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05/01/08 | 5 views | #20080099139 | Prev - Next | USPTO Class 156 | About this Page  156 rss/xml feed  monitor keywords

Method for sealing microcomponent

USPTO Application #: 20080099139
Title: Method for sealing microcomponent
Abstract: A microcomponent on a substrate is sealed with a liquid silicone composition in the cured state by forming a channel or recess in a substrate, placing a microcomponent at the center of the channel-delimited region or recess, applying a droplet of liquid silicone composition so that the droplet is delimited by the perimeter of the channel or recess and held in a convex shape by the surface tension of the liquid, and curing the liquid silicone composition. (end of abstract)
Agent: Birch Stewart Kolasch & Birch - Falls Church, VA, US
Inventors: Kei Miyoshi, Naoki Yamahawa
USPTO Applicaton #: 20080099139 - Class: 156291000 (USPTO)


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