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  Method for processing a substrate using multiple fluid distribtuions on a polishing surfaceUSPTO Application #: 20080038998Title: Method for processing a substrate using multiple fluid distribtuions on a polishing surface Abstract: A polishing fluid delivery apparatus has been provided that in one embodiment includes a support member, a dispense arm, a polishing fluid delivery tube and a variable restricting device. The dispense arm extends from an upper portion of the support member and has an outlet of the delivery tube coupled thereto. The restricting device interfaces with the delivery tube and is adapted to provide a variable restriction to flow passing through the delivery tube. In another embodiment, the restricting device is a pinch valve and the tube in continuous from the outlet to beyond a portion that interfaces with the pinch valve. In yet another embodiment, the position of the dispense arm is controllable. (end of abstract) Agent: Patent Counsel Applied Materials, Inc. - Santa Clara, CA, US Inventors: Alexander S. Polyak, Avi Tepman USPTO Applicaton #: 20080038998 - Class: 451060000 (USPTO) Related Patent Categories: Abrading, Abrading Process, Abradant Supplying The Patent Description & Claims data below is from USPTO Patent Application 20080038998. Brief Patent Description - Full Patent Description - Patent Application Claims
CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is a continuation of U.S. patent application Ser. No. 11/176,985, filed Jul. 8, 2005, which is a divisional application of U.S. patent application Ser. No. 10/428,914, filed May 2, 2003, and now issued as U.S. Pat. No. 6,939,210, all of which are hereby incorporated by reference in their entireties. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] Embodiments of the present invention generally relate to a method for processing a substrate in a chemical mechanical polishing system. [0004] 2. Description of the Related Art [0005] Chemical mechanical polishing is one process commonly used in the manufacture of high-density integrated circuits. Chemical mechanical polishing is utilized to planarize a layer of material deposited on a semiconductor wafer by moving the substrate in contact with a polishing surface while in the presence of a polishing fluid. Material is removed from the surface of the substrate that is in contact with the polishing surface through a combination of chemical and mechanical activity. One type of polishing fluid commonly used in chemical mechanical polishing applications is a slurry containing chemical agents and abrasive particles. The abrasive particles in the slurry enhance the mechanical removal of material from the substrate while exposing the underlying surface to the chemical agents in the polishing fluid. [0006] Polishing fluid is typically provided to the polishing surface through a dispense arm that is positioned over the polishing surface during processing. The dispense point (i.e., the point at which the polishing fluid flows from a delivery tube to the polishing surface), and the amount and concentration of polishing fluid provided to the polishing surface are attributes that impact the quality of substrate processing. To ensure acceptable polishing results, conventional polishing fluid delivery systems rely on detent mechanisms to ensure repeatable positioning of the polishing fluid dispense arm at a pre-defined dispense location along with various flow control devices utilized to monitor and control the amount and concentration of polishing fluid delivered to the polishing surface. [0007] One problem associated with this conventional arrangement is that the polishing fluid dispense arm is limited to the pre-defined position wherein the detent mechanism engages the arm. Thus, control of the dispense point on the polishing surface is limited to physically changing the delivery tube's position along the arm. Thus, in order to change the dispense point to achieve a desired processing result, polishing must be interrupted to allow for service personnel to mechanically adjust the position of the nozzles along the length of the slurry dispense arm, thereby increasing the risk of equipment damage and disadvantageously decreasing substrate throughput. [0008] Another issue affecting many conventional polishing fluid delivery systems is the tendency of abrasive particles within the slurry to attach and agglomerate at tube fittings and around flow control components. For example, the interfaces between the slurry delivery tube and tees, valves, restrictors or other devices include small seams or gaps along the flow path where abrasive particles from within the slurry tend to adhere and conglomerate. As the number of abrasive particles accumulating at these locations grows, chains or groups of the conglomerated particles break free and travel downstream through the delivery tube to the polishing surface where they come in contact with the surface of the substrate being polished. These conglomerated particles often cause scratching of the substrate surface and defect generation. Therefore, it would be desirable to minimize and/or eliminate any seams along the slurry flow path to minimize the introduction of conglomerated particles to the polishing surface. [0009] Therefore, there is a need for an improved slurry delivery system. SUMMARY OF THE INVENTION [0010] A polishing fluid delivery apparatus has been provided that in one embodiment includes a support member, a dispense arm, at least one polishing fluid delivery tube and a variable restricting device. The dispense arm extends from an upper portion of the support member and has an outlet of the delivery tube coupled thereto. The restricting device interfaces with the delivery tube and is adapted to provide a variable restriction to flow passing through the delivery tube. In another embodiment, the restricting device is a pinch valve and the tube is continuous from the outlet to beyond a portion that interfaces with the pinch valve. In yet another embodiment, the position of the dispense arm is controllable. BRIEF DESCRIPTION OF THE DRAWINGS [0011] A more particular description of the invention, briefly summarized above, may be had by reference to the embodiments thereof that are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments. [0012] FIG. 1 is a top view of an illustrative chemical mechanical polishing system having one embodiment of a polishing fluid delivery system; [0013] FIG. 2 is a sectional view of a polishing fluid dispense arm of the polishing fluid delivery system of FIG. 1; [0014] FIGS. 3A-C are simplified top views of the polishing fluid dispense arm in various positions; [0015] FIG. 4 is a bottom perspective view of one embodiment of a polishing fluid dispense arm; [0016] FIG. 5 is a top view of another embodiment of a polishing fluid dispense arm; and [0017] FIGS. 6-7 are simplified top views of other embodiments of a polish fluid delivery system. [0018] To facilitate understanding, identical reference numerals have been used, wherever possible, to designate identical elements that are common to the figures. DETAILED DESCRIPTION [0019] FIG. 1 is a top view of an illustrative chemical mechanical polishing system 100 having one embodiment of a polishing fluid delivery system 102 of the present invention. The chemical mechanical polishing system 100 generally includes a factory interface 104, a cleaner 106 and a polisher 108. One polishing system 100 that may be adapted to benefit from the invention is a REFLEXION.RTM. chemical mechanical polishing system, available from Applied Materials, Inc., located in Santa Clara, Calif. Another polishing system 100 that may be adapted to benefit from the invention is described in U.S. Pat. No. 6,244,356, issued Jul. 2, 2002 to Birang, et al., which is incorporated by reference in its entirety. Continue reading... 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