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03/27/08 | 27 views | #20080072708 | Prev - Next | USPTO Class 076 | About this Page    monitor keywords

Method for manufacturing die and molding obtained therewith

USPTO Application #: 20080072708
Title: Method for manufacturing die and molding obtained therewith
Abstract: A substrate 11 is patterned by photolithography to make a first original plate. Next, the pattern 11a of the first original plate is transferred to make a second original plate 12. Next, the second original plate 12 is machined to make a die. Further, the pattern 12b of the second original plate 12 is transferred to make a third original plate 13, which is used as a die. This provides a method for manufacturing a die by which a special shape, for example, a shape having a high aspect ratio portion can be easily formed and a molding obtained therewith.
(end of abstract)
Agent: - ,
Inventors: Munemitsu ABE, Shozo TAKAMURA, Satoru SHIMIZU, Eiji SHINOHARA
USPTO Applicaton #: 20080072708 - Class: 076107100 (USPTO)
Related Patent Categories: Metal Tools And Implements, Making, Blank Or Process, Die

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