| Method for manufacturing a substrate with surface structure by employing photothermal effect -> Monitor Keywords |
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Method for manufacturing a substrate with surface structure by employing photothermal effectMethod for manufacturing a substrate with surface structure by employing photothermal effect description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20090269505, Method for manufacturing a substrate with surface structure by employing photothermal effect. Brief Patent Description - Full Patent Description - Patent Application Claims
This non-provisional application claims priority under 35 U.S.C. § 119(a) on Patent Application No(s). 097103802 filed in Taiwan, R.O.C. on Jan. 31, 2008 and Patent Application No(s). 097151822 filed in Taiwan, R.O.C. on Dec. 31, 2008 the entire contents of which are hereby incorporated by reference. 1. Field of the Invention The present invention relates to a method for manufacturing a substrate, and more particularly to a method for manufacturing a substrate with surface structure by employing photothermal effect. 2. Related Art Recently, many technologies were developed to form micro/nano-structure on surface of a substrate, such as nano-imprinting lithography (NIL), semiconductor manufacturing process or micro-electro-mechanical process (MEM) etc. Although these technologies can be used to fabricate micro/nano-structure, the fabricated process is complex and expensive. For example, when semiconductor manufacturing process or MEMS process is used to fabricate micro/nano-structure, the sample was treated by several processes, including spinning coat, exposure/development, etching and imprinting process. Therefore, it is difficulty and there is high cost to fabricate micro/nano-structure employing these technologies. The NIL technology also need many processes to fabricate template with micro/nano-structure on its surface and then imprint on a substrate. This technology also exhibits it is difficulty to manufacture micro/nano structure surface in large area. During making a printed circuit board (PCB), there is a process for forming gold fingers (also called as an edge connector). The edge connector is used as an interface for connecting the PCB and outside element through inserting to the outside element. The gold fingers are made with gold because gold has superior conductivity and superior oxidation resistance. However, the cost of gold is very expensive, so only the gold finger is only partially formed with gold using platting or chemical bonding, such as bonding pad. During platting, it is necessary to appropriately control parameters, to avoid some questions such as contamination with other metal and bad adhesion etc. Furthermore, a subtractive process and an additive process are the methods for making a conductive structure. For the subtractive process, the etching formulation and the etching angle errors result in copper residues. Thus, the subtractive process is not suitable for manufacturing fine circuits. The additive process needs a mask to define circuits, and then to manufacture circuits through copper-cladding processes such as plasma sputtering, electroplating, or electroless plating. In general, the flow of the additive process is rather complicated and the cost is relatively high. Therefore, a method for manufacturing conductive wires through inkjet technology is proposed. Currently, the method for manufacturing conductive wires through the inkjet technology has already been applied in manufacturing flexible circuit boards. Conventionally, the inkjet technology is used to spray conductive ink with low melting point on an organic substrate, so as to manufacture a flexible circuit board having conductive wires at a high speed and a low cost. However, the conductive ink should be sintered into a film at a high temperature to form conductive wires and meanwhile to enhance the conductivity thereof. During such sintering process, a sintering temperature of 200° C. is required, and the sintering duration should be over about 30 minutes. Accordingly, residual thermal stress is easily generated between the substrate and the formed conductive wires. Besides the heat treatment, another method is to use ultraviolet (UV) laser to sinter, but this method easily damages the substrate. This invention provides a method for manufacturing a substrate with surface structure by employing photothermal effect, which is a novel and simple method and can directly manufacture micro/nano-structure on surface of a substrate in large area through photothermal effect of nanoparticles. Compare with above technologies, the method for manufacturing a substrate with surface structure by employing photothermal effect according to this invention is rather simple, relatively low cost, and possible to form pattern on surface of a substrate in large amount. In one embodiment, a method for manufacturing a substrate with surface structure by employing photothermal effect involves steps of providing a substrate; distributing a plurality of nanoparticles on the provided substrate; irradiating the nanoparticles on the provided substrate with a specific wavelength, such that the nanoparticles convert irradiating energy (i.e. light energy) to thermal energy; and forming a layer of the predetermined pattern on the surface of the provided substrate through the thermal energy generated by the nanoparticles. In a case, the nanoparticles on the provided substrate can be melted through the thermal energy generated by the nanoparticles to form a nanoparticle-melted thin layer of the predetermined pattern, so as to obtain the substrate with the layer of the predetermined pattern. The predetermined pattern can be a pattern of at least one conductive wire and/or at least one conductive area. In the situation of the predetermined pattern being a pattern having at least one conductive wire, the substrate with the conductive wire may be obtained. In the situation of the predetermined pattern is a pattern having at least one conductive area, the substrate having a conductive area may be obtained. Herein, the nanoparticles can be directly distributed on the provided substrate in accordance with the predetermined pattern. Alternatively, the nanoparticles can be first distributed on the provided substrate as a whole layer, and then, the nanoparticles on the substrate is irradiated by a beam with specific wavelength through moving the beam along with the predetermined pattern, to excite the irradiated nanoparticles. In this case, the excited nanoparticles and nanoparticles around the excited nanoparticles on the provided substrate are melted through the thermal energy generated by the excited nanoparticles, and the melted nanoparticles are fixed on the provided substrate through thermal energy generated by the excited nanoparticles. Finally, unmelted nanoparticles are removed from the provided substrate to form a nanoparticle-melted thin layer of the predetermined pattern on the provided surface, so as to obtain the substrate with the layer of the predetermined pattern. In view of the above, the method for manufacturing a substrate with surface structure by employing photothermal effect according to this invention form micro/nano-structure on/in surface of a substrate. Use of the method according to this invention to fabricate micro/nano-structure on/in surface of the substrate can exhibit several advantages, such as the fabricated process is more simple and cheaper, and the sample can be manufactured in large area. Furthermore, when manufacturing the substrate with the layer of the predetermined pattern, residual stress can be reduced, as well as the thermal power, and adhesion between the predetermined pattern and the substrate can be increased. Further, energy loss can be reduced. The present invention will become more fully understood from the detailed description given herein below for illustration only, which thus is not limitative of the present invention, and wherein: Continue reading about Method for manufacturing a substrate with surface structure by employing photothermal effect... 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