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  Method and apparatus to process substrates with megasonic energyUSPTO Application #: 20070207707Title: Method and apparatus to process substrates with megasonic energy Abstract: A variety of techniques may be employed, alone or in combination, to enhance contact between a processed substrate and applied megasonic energy. In accordance with one embodiment of the new invention, the vibration plate is brought into intimate contact with one surface of the substrate, while cleaning or processing fluid contacts the other. In accordance with an alternative embodiment of the present invention, a reflecting surface may be provided to cause emanated energy to be reflected back into the near field and make it more uniform. In accordance with another alternative embodiment of the present invention, energy may be transferred across a substrate bounded on both sides by liquid with incidence of megasonic energy that is either normal to the substrate surface or within a critical range of incident angles. In yet another embodiment, generated dilatational waves may be converted to surface waves prior to contacting the substrate. (end of abstract) Agent: Townsend And Townsend And Crew, LLP - San Francisco, CA, US Inventors: Garry L. Montierth, Henry R. Miranda, Sharyl L. Maraviov, Ahmed A. Busnaina USPTO Applicaton #: 20070207707 - Class: 451036000 (USPTO) Related Patent Categories: Abrading, Abrading Process, Utilizing Fluent Abradant The Patent Description & Claims data below is from USPTO Patent Application 20070207707. Brief Patent Description - Full Patent Description - Patent Application Claims
CROSS-REFERENCE TO RELATED APPLICATIONS [0001] The instant nonprovisional patent application claims priority from the following provisional patent applications, each of which is also incorporated by reference herein for all purposes: 60/476,845, filed Jun. 6, 2003; 60/476,527, filed Jun. 6, 2003; 60/530,194, filed Dec. 16, 2003; 60/510,054, filed Oct. 8, 2003; 60/546,383, filed Feb. 20, 2004; 60/517,255, filed Nov. 3, 2003; 60/528,941, filed Dec. 10, 2003; and 60/525,435, filed Nov. 26, 2003. BACKGROUND OF THE INVENTION [0002] The application of megasonic energy to substrate wet processing has become widely accepted, especially in semiconductor fabrication. As device/feature size has shrunk, and as substrate structures have become more vulnerable to damage, the frequency of megasonic systems have increased and have trended towards the megahertz range. [0003] The application of sonic energy having frequencies approaching and exceeding one megahertz are often referred to as megasonic processing. These higher frequencies are used in an attempt to dislodge smaller contaminant particles and to reduce the localized energy release associated with bubble formation/collapse (cavitation and possible microcavitation) that some have theorized can lead to substrate damage as has been observed with lower frequency ultrasonic cleaners. [0004] Historically, batch-processing systems have been designed to introduce megasonic energy parallel to substrate surfaces. In the quest for faster processing, particularly with the push for single wafer processing, megasonic designs have tended towards high-energy systems with introduction of energy perpendicular to substrate surfaces. This has led to concerns regarding megasonic damage to sensitive structures. [0005] Therefore it is desirable to find gentler ways of applying megasonic energy that will rapidly remove ever-smaller contaminants. BRIEF SUMMARY OF THE INVENTION [0006] A variety of techniques may be employed, alone or in combination, to enhance contact between a processed substrate and applied megasonic energy. In accordance with one embodiment of the new invention, the vibration plate is brought into intimate contact with one surface of the substrate, while cleaning or processing fluid contacts the other. In accordance with an alternative embodiment of the present invention, a reflecting surface may be provided to cause emanated energy to be reflected back into the near field and make it more uniform. In accordance with another alternative embodiment of the present invention, energy may be transferred across a substrate bounded on both sides by liquid with incidence of megasonic energy that is either normal to the substrate surface or within a critical range of incident angles. In accordance with yet another embodiment of the present invention, generated dilatational waves may be converted to surface waves prior to contacting the substrate. In accordance with still another embodiment of the present invention, generated dilatational waves may be converted into surface waves after contacting the substrate, or within the substrate itself. [0007] An apparatus in accordance with an embodiment of the present invention, configured to process a substrate with megasonic energy, comprises a processing region configured to receive a processing fluid, a megasonic energy source, and a vibration member in physical contact with the megasonic energy source and with at least a portion of an element proximate to the processing region. A combined thickness of the element and the vibration member being about .+-.30% of an odd one-quarter wavelength of a megasonic energy applied by the source in order to transfer the megasonic energy across the element. [0008] An embodiment of a method in accordance with the present invention of processing a substrate, comprises, placing at least one substrate into a process vessel, making contact between at least a part of the substrate and at least a part of a vibration member, and introducing at least one processing fluid into the processing vessel. At least a part of the substrate is contacted with at least one of the processing fluids and megasonic energy is applied, wherein the applying megasonic energy step occurs at least one of before, during and after the introducing processing fluid step. [0009] An embodiment of an apparatus in accordance with the present invention configured to process a substrate with megasonic energy, comprises, a processing region configured to receive a processing fluid, a megasonic energy source, and a vibration member in contact with the megasonic energy source and oriented within a critical angle range of between about 18-58.degree. relative to an element positioned within the processing region, in order to transfer the megasonic energy across the element. [0010] An embodiment of a method in accordance with the present invention for processing a substrate, comprises, placing at least one substrate into a processing vessel, introducing at least one processing fluid into the processing vessel to contact at least a part of the substrate, and applying megasonic energy at between about 18-58.degree. relative to a surface of the substrate, such that a substantial portion of the megasonic energy is transferred across the substrate. The introducing of a processing fluid step may occur before, during, or after the applying megasonic energy step. [0011] An alternative embodiment of an apparatus in accordance with the present invention configured to process a substrate with megasonic energy, comprises, a processing region configured to receive a processing fluid, a flow member configured to control a path of the processing fluid within the tank, and a megasonic energy source configured to apply megasonic energy to the tank, such that a direction of the megasonic energy conforms to the path. [0012] An alternative embodiment of a method in accordance with the present invention for processing a substrate with megasonic energy, comprises, flowing a processing fluid within a tank containing a substrate, and applying megasonic energy to the tank such that a direction of the megasonic energy conforms to a path of the processing fluid. [0013] Another alternative embodiment of an apparatus in accordance with the present invention configured to process a substrate with megasonic energy, comprises, a processing region configured to receive a processing fluid, a megasonic energy source, and a wedge vibration member having a first face in contact with and configured to receive energy from the megasonic energy source. The wedge vibration member having a second face oriented at an angle relative to the first face and configured to emit energy received from the megasonic energy source to a substrate positioned within the processing region. [0014] An alternative embodiment of a method in accordance with the present invention for processing a substrate, comprises the steps of placing a substrate into a processing region, introducing at least one processing fluid to the substrate, and contacting at least a part of a vibration member comprising a plate to at least part of a first face of a wedged shaped vibration member. Megasonic energy is applied to the substrate from a second face of the wedge shaped vibration member, wherein the applying megasonic energy step occurs at least one of before, during and after the introducing a processing fluid step. [0015] Another alternative embodiment of an apparatus in accordance with the present invention configured to process a substrate with megasonic energy, comprises, a processing region configured to receive a processing fluid, a vibration member in physical contact with a megasonic energy source and configured to support a substrate in the processing region within a near field of megasonic energy incident in a first direction from the vibration member, and an element configured to direct megasonic energy to the near field from a second direction different from the first direction. [0016] Another embodiment of an apparatus in accordance with the present invention configured to process a substrate with megasonic energy, comprises, a processing region configured to receive a processing fluid, and a megasonic energy source configured to output megasonic energy having at least one of a user-controlled and variable frequency, power, and pulse width, to a substrate present within the processing region. [0017] An embodiment of a method in accordance with the present invention for processing a substrate, comprises, varying at least one of frequency, power, and pulse width of ultrasonic energy applied from a first energy source to a substrate in contact with a processing fluid, such that a uniformity of energy in near field regions is improved by at least one of moving high energy node points and low energy null points, minimizing a difference between a magnitude of the high and low energy points, and retarding formation of high and low energy points. [0018] An embodiment of a method in accordance with the present invention for processing a substrate with megasonic energy, comprises, disposing a substrate in contact with a processing fluid, applying megasonic energy to the substrate to establish points of constructive and destructive interference proximate to a substrate surface, and changing a position of the points of constructive and destructive interference in order to enhance uniformity of exposure of the substrate to sonic energy. [0019] An embodiment of a method in accordance with the present invention for processing a substrate, comprises the steps of supporting a substrate in a holder, positioning the substrate adjacent to a portion of a processing member, and causing relative motion between the substrate and the processing member at least one of before, during, or after a substrate processing step. The substrate is brought into at least one of into contact with and closely spaced apart from, the processing member surface. One of a solid, a fluid, and a mixture is between the substrate and the processing member, and energy is transmitted to an interface between the substrate and the processing member to modify processing of a surface of the substrate. [0020] An embodiment of a processing apparatus in accordance with the present invention comprises a vessel configured to contain an electrochemical fluid, a voltage supply, and a support configured to position a substrate in contact with the electrochemical fluid, one of the support and the substrate in electrical communication with a first terminal of the voltage supply. An electrode is in electrical communication with the electrochemical bath and with a second terminal of the voltage supply, and a sonic energy source is in communication with the substrate one of across the electrode, across the substrate, and along a face of the substrate. [0021] An embodiment of a method in accordance with the present invention for processing a substrate, comprises the steps of, providing an electrode in electronic communication with an electrochemical bath, disposing a substrate within the electrochemical bath, applying a potential difference between the substrate and the electrode across the electrochemical bath, and applying sonic energy across one of the electrode and the substrate, to a surface of the substrate. Continue reading... Full patent description for Method and apparatus to process substrates with megasonic energy Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Method and apparatus to process substrates with megasonic energy patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. 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