| Method and apparatus for attaching microelectronic substrates and support members -> Monitor Keywords |
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  Method and apparatus for attaching microelectronic substrates and support membersUSPTO Application #: 20070020811Title: Method and apparatus for attaching microelectronic substrates and support members Abstract: A microelectronic package and method for forming such packages. In one embodiment, the package can be formed by providing a support member having a first surface, a second surface facing opposite the first surface, and a projection extending away from the first surface. A quantity of adhesive material can be applied to the projection to form an attachment structure, and the adhesive material can be connected to a microelectronic substrate with the attachment structure providing no electrically conductive link between the microelectronic substrate and the support member. The microelectronic substrate and the support member can then be electrically coupled, for example, with a wire bond. In one embodiment, the projection can be formed by disposing a first material on a support member while the first material is at least partially flowable, reducing the flowability of the first material, and disposing a second material (such as the adhesive) on the first material. (end of abstract) Agent: Perkins Coie LLP Patent-sea - Seattle, WA, US Inventor: Tongbi Jiang USPTO Applicaton #: 20070020811 - Class: 438118000 (USPTO) Related Patent Categories: Semiconductor Device Manufacturing: Process, Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor, Including Adhesive Bonding Step The Patent Description & Claims data below is from USPTO Patent Application 20070020811. Brief Patent Description - Full Patent Description - Patent Application Claims Continue reading... Full patent description for Method and apparatus for attaching microelectronic substrates and support members Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Method and apparatus for attaching microelectronic substrates and support members patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Method and apparatus for attaching microelectronic substrates and support members or other areas of interest. ### Previous Patent Application: Semiconductor device and method of producing high contrast identification mark Next Patent Application: Thermoplastic/thermoset composition material and method of attaching a wafer to a substrate Industry Class: Semiconductor device manufacturing: process ### FreshPatents.com Support Thank you for viewing the Method and apparatus for attaching microelectronic substrates and support members patent info. IP-related news and info Results in 0.67243 seconds Other interesting Feshpatents.com categories: Accenture , Agouron Pharmaceuticals , Amgen , AT&T , Bausch & Lomb , Callaway Golf |
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