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Method and apparatus for attaching microelectronic substrates and support members   

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Abstract: A microelectronic package and method for forming such packages. In one embodiment, the package can be formed by providing a support member having a first surface, a second surface facing opposite the first surface, and a projection extending away from the first surface. A quantity of adhesive material can be applied to the projection to form an attachment structure, and the adhesive material can be connected to a microelectronic substrate with the attachment structure providing no electrically conductive link between the microelectronic substrate and the support member. The microelectronic substrate and the support member can then be electrically coupled, for example, with a wire bond. In one embodiment, the projection can be formed by disposing a first material on a support member while the first material is at least partially flowable, reducing the flowability of the first material, and disposing a second material (such as the adhesive) on the first material. ...

Agent: Perkins Coie LLP Patent-sea - Seattle, WA, US
Inventor: Tongbi Jiang
USPTO Applicaton #: #20070020811 - Class: 438118000 (USPTO) - 01/25/07 - Class 438 

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Related Patent Categories: Semiconductor Device Manufacturing: Process, Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor, Including Adhesive Bonding Step
The Patent Description & Claims data below is from USPTO Patent Application 20070020811, Method and apparatus for attaching microelectronic substrates and support members.

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