|Metal fusion bonding patents - Monitor Patents|
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Metal fusion bondingBelow are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 12/04/2014 > 3 patent applications in 3 patent subcategories.
20140353360 - Temperature triggering ejector mechanism for lock pin soldering type component: A temperature triggering ejector system for lock pin soldering type component is provided. There is provided a temperature triggering ejector system for a lock pin soldering type component, lock pins of said component are fixed in through holes of a circuit board and solder is filled in the through holes... Agent: International Business Machines Corporation
20140353361 - Electric wire connecting method and connecting device thereof: An electric wire connecting device connects a conductor of an electric wire formed of a plurality of core wires to a terminal. The connecting device includes a pair of clamping members for clamping a part of an end portion of the conductor, and a ultrasonic welding horn for connecting the... Agent: Yazaki Corporation
20140353362 - Laser ablation process for manufacturing submounts for laser diode and laser diode units: A method for manufacturing submounts for laser diodes includes the steps of providing a base configured with a ceramic carrier and a metal layer deposited upon the substrate. The method further includes using a pulsed laser operative to generate a plurality of pulses which are selectively trained at predetermined pattern... Agent: Ipg Photonics Corporation11/27/2014 > 2 patent applications in 2 patent subcategories.
20140346215 - Metal connection method: Disclose is a metal connection method comprising the steps of: holding a connection part of a first metal member and a connection part of a second metal member facing each other; deforming the connection parts by applying pressure to the connection parts with the connection parts butted each other to... Agent: Yazaki Corporation
20140346216 - Process for joining by diffusion welding a part made of steel having a high carbon content with a part made of steel or nickel alloy having a low carbon content: corresponding assembly: Process for joining by diffusion welding a part made of steel having a high carbon content and low carbide-forming elements content with a part made of steel or of nickel alloy having a low carbon content and a high carbide-forming elements content, each of the parts comprising a surface to... Agent: Commissariat À L'É Nergie Atomique Et Aux É Nergies Alternatives11/20/2014 > 4 patent applications in 4 patent subcategories.
20140339288 - Production method of multilayer clad material: A production method includes a rolling step of obtaining a laminated plate by clad rolling first and second metallic plates in a superposed manner at a rolling reduction of 25% to 85%, a surface activation treatment step of subjecting at least joint scheduled surfaces of the laminated plate 20 and... Agent: Showa Denko K.k.
20140339289 - Method of manufacturing mounting substrate and method of manufacturing electronic apparatus: A method of manufacturing a mounting substrate, the method includes: transferring part or all of a plurality of devices on a device substrate onto a wiring substrate, and temporarily fixing the transferred devices to the wiring substrate with use of a fixing layer having viscosity, the device substrate including a... Agent: Sony Corporation
20140339290 - Wire bonding method and semiconductor package manufactured using the same: Provided is a wire bonding method. The method includes: positioning a capillary having a wire inserted on a substructure including at least three connection terminals spaced apart from each other; forming an adhesive ball at a tip of the wire; bonding the adhesive ball to one of the connection terminals... Agent:
20140339291 - Method for enhancing the yield rate of ball implanting of a substrate of an integrated circuit: A method is used for implanting solder balls of an integrated circuit by operating a ball implanting machine. The ball implanting machine includes a suction fixture, an evacuating device, two pivoting and inverting devices, a guide plate, a ball carrier, and a substrate. The suction fixture has a plurality of... Agent:11/13/2014 > 1 patent applications in 1 patent subcategories.
20140332583 - Wire bonding apparatus: Provided is a wire bonding apparatus including: a base (11); a bonding head (13) configured to move a capillary (15) in X, Y, and Z directions with respect to the base (11); and a wire-cleaning plasma unit (30). The wire-cleaning plasma unit (30) includes: hollow casings (31a), (31b) in which... Agent: Shinkawa Ltd.Previous industry: Elongated-member-driving apparatus
Next industry: Envelopes, wrappers, and paperboard boxes
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