Metal fusion bonding patents - Monitor Patents Logo icons
Monitor Keywords Patent Organizer File a Provisional Patent Browse Inventors Browse Industry Browse Agents

USPTO Class 228  |  Browse by Industry: Previous - Next | All     monitor keywords
Recent  |  14: Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | 13: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | 12: Dec | Nov | Oct | Sep | Aug | July | June | May | April | Mar | Feb | Jan | 11: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | 10: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan |  | 09: Dec | Nov | Oct | Sep | Aug | Jl | Jn | May | Apr | Mar | Fb | Jn |  | 2008 | 2007 |

Metal fusion bonding

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
09/04/2014 > 4 patent applications in 4 patent subcategories.
08/28/2014 > 3 patent applications in 2 patent subcategories.

20140239049 - Method of manufacturing mask assembly for thin film deposition: A method of manufacturing a mask assembly for thin film deposition includes: positioning a division mask on a mask frame, wherein the division mask has a length in a first direction that is greater than a width in a second direction perpendicular to the first direction; and spot welding opposing... Agent: Samsung Display Co., Ltd.

20140239050 - Self-expansible stent with radiopaque markers and method of making such a stent: Pushing a self-expanding stent from one of its ends, during release of the stent at a stenting site in a bodily lumen, by proximal withdrawal of a surrounding sheath, can impose unacceptably high stresses on parts of the strut network of the stent. For location of stents in a bodily... Agent: C. R. Bard, Inc.

20140239051 - Cutter structures, inserts comprising same and method for making same: A method of making a cutter structure comprising super-hard material defining a rake face topology is provided. The method includes providing a pre-sinter assembly comprising a substrate body having a formation surface defining a topology complementary to the rake face topology, and an aggregation comprising a plurality of super-hard grains,... Agent: Element Six Abrasives S.a.

08/21/2014 > 3 patent applications in 3 patent subcategories.

20140231490 - Friction stir welding apparatus: A friction stir welding apparatus includes a rotating tool provided with an upper rotating body arranged to be axially adjustable in position by an upper actuator, a lower rotating body integral with a rotating main rod extending through the upper rotating body and arranged to be axially adjustable in position... Agent: Nippon Sharyo, Ltd.

20140231491 - Method of manufacturing electronic component unit: An electronic component unit manufacturing method includes: preparing a circuit board including a heat generating element mounted thereon and a bonding metal foil layer formed thereon, a heat transfer board including an insulative layer formed on one face thereof and a heat transfer metal foil layer formed on the insulative... Agent:

20140231492 - Electronic component mounting method, electronic component placement machine, and electronic component mounting system: Disclosed is an electronic component mounting method including the steps of: providing a first electronic component having a principal surface provided with a plurality of bumps; providing a substrate having a plurality of first electrodes corresponding to the plurality of bumps; applying flux to the plurality of bumps; placing the... Agent: Panasonic Corporation

08/14/2014 > 4 patent applications in 4 patent subcategories.

20140224859 - Coated rotary tool and method for manufacturing the same: A friction stir welding tool of the present invention is used for friction stir welding, and includes: a base material; and a coating layer formed on a surface of at least a portion of the base material that is to be caused to contact workpieces during friction stir welding, the... Agent:

20140224860 - Fill head interface with combination vacuum pressure chamber: A fill head apparatus includes at least one chamber for holding a fluid. The chamber has an outlet for expelling the fluid. A vacuum device has an inlet for a suction device adjacent to the fluid outlet. A plurality of flexible and resilient sealing devices contact a top surface of... Agent: International Business Machines Corporation

20140224861 - Wire solder, method of feeding the same, and apparatus and system therefor: Provided is an apparatus for feeding wire solder with high tensile strength and pull cut resistance. The wire solder has an extended wire solder and a core wire having a higher tensile strength than the wire solder. The apparatus for feeding the wire solder comprises a wire solder storage section... Agent: Nihon Superior Co., Ltd.

20140224862 - Method of manufacturing a semiconductor device: A soldering method achieves little void and good joint condition in soldering an insulated circuit board and a semiconductor chip using a tin—high antimony solder material. A method of manufacturing a semiconductor device includes the steps of preparing a solder plate having a U-shape; mounting the solder plate on a... Agent: Fuji Electric Co., Ltd.

Previous industry: Elongated-member-driving apparatus
Next industry: Envelopes, wrappers, and paperboard boxes


RSS FEED for 20140904: xml
Integrate into your RSS reader/aggregator or website to track weekly updates.
For more info, read this article.


Thank you for viewing Metal fusion bonding patents on the website. These are patent applications which have been filed in the United States. There are a variety ways to browse Metal fusion bonding patent applications on our website including browsing by date, agent, inventor, and industry. If you are interested in receiving occasional emails regarding Metal fusion bonding patents we recommend signing up for free keyword monitoring by email.

Results in 0.18353 seconds