Metal fusion bonding inventions

20090277950 - Wirebonding method and apparatus: A method and apparatus are discloses for wirebonding leads of a plurality of lead frames being part of a lead frame assembly by a wirebonding tool to semiconductor products mounted on the respective lead frames. The semiconductor products are clamped by a clamping mechanism comprising a stationary clamp and a... Agent: Nxp, B.v. Nxp Intellectual Property & Licensing

20090277951 - Electronic component mounting apparatus and electronic component mounting method: There is provided an electronic component mounting apparatus including: a component holder which holds an electronic component; a pressing unit which applies pressure to the held electronic component through the component holder; and an ultrasonic transducer which applies ultrasonic vibration to the held electronic component through the component holder. The... Agent: Ratnerprestia

20090272788 - Friction stir welding apparatus and system: A rotational tool retaining member unit 37 is mounted at one end portion thereof to a FSW gun body 26. The rotational tool retaining member unit 37 is provided at the other end thereof with a fitting hole 61 and a plurality of mounting passages 60 which are formed on... Agent: Oliff & Berridge, PLC

20090266869 - Ultrasonic vibration bonding resonator: An ultrasonic vibration bonding resonator includes a resonance body, bonding working portions having a bonding working face and provided at a point of maximum oscillation on upper and lower surfaces of the resonance body and support portions provided at two points of minimum oscillation apart from the bonding working portions... Agent: Sughrue Mion, PLLC

20090266870 - Joined composite structures with a graded coefficient of thermal expansion for extreme environment applications: An integrated composite structure with a graded coefficient of thermal expansion (CTE) is formed by selecting a plurality of layers of materials with a graded CTE and using joining approaches such as welding, brazing, or solid state bonding to produce a CTE-graded layered composite or near net shape. The integrated... Agent: The Boeing Company C/o Felix L. Fischer, Attorney At Law

20090266871 - Method and apparatus for beam soldering: Beam soldering involves using a beam of light emitted from a source to reflow adjoining pairs of solder pads on components being joined. In some scenarios, material between adjacent solder pads on at least one of the components is absorptive of a certain spectrum of light and, consequently, can be... Agent: Hitachi C/o Wagner Blecher LLP

20090261146 - Donor material technology for friction stir welding: A method and apparatus is disclosed for forming a friction stir weld joint using a friction stir tool. A first metallic work material and a second metallic work material are provided and are substantially abutted to define a joint interface having a weld surface. A quantity of metallic donor material... Agent: Williams Mullen

20090261147 - Dross removal: This invention relates to for devices, systems, and methods for separating dross, carried by molten solder, into solder and residue.... Agent: Fish & Richardson PC

20090261148 - Production method of solder circuit board: A method for producing a solder circuit board includes the steps of imparting tackiness to a surface of an electrically conductive circuit electrode on a printed-wiring board to form a tacky part, causing only one solder particle to adhere to the tacky part, and heating the printed-wiring board, thereby melting... Agent: Sughrue Mion, PLLC

20090261149 - Mounting method using thermocompression head: A mounting method is provided using a thermocompression head which can mount an electric component in a short time with high connection reliability. The method is provided for mounting an electric component on a wiring board by using a thermocompression head having an elastic pressure bonding member composed of an... Agent: K&l Gates LLP