Metal fusion bonding patents - Monitor Patents
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Metal fusion bonding

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
  
02/05/2015 > 8 patent applications in 8 patent subcategories.

20150034698 - Robot: A robot includes: a stage unit; a rotation base connected to the stage unit in a rotatable manner around a predetermined rotating axis; an arm unit connected to the rotation base and having a base end rotatable around a first rotation axis that is substantially orthogonal to the rotating axis;... Agent: Kabushiki Kaisha Yaskawa Denki

20150034699 - Reflow treating unit & substrate treating apparatus: Provided are a semiconductor substrate manufacturing apparatus and a substrate treating method, and more particularly, an apparatus and method for performing a reflow treating process on a semiconductor wafer. The apparatus treating apparatus includes a load port on which a carrier accommodating a substrate is seated, a substrate treating module... Agent: Semigear Inc

20150034700 - Reflow treating unit & substrate treating apparatus: Provided are a semiconductor substrate manufacturing apparatus and a substrate treating method, and more particularly, an apparatus and method for performing a reflow treating process on a semiconductor wafer. The apparatus treating apparatus includes a load port on which a carrier accommodating a substrate is seated, a substrate treating module... Agent: Semigear Inc

20150034701 - Electronic part and method for forming joint structure of electronic part and joining object: An electronic part including an electronic part main body and an external electrode on the surface of the electronic part main body. The external electrode includes at least one alloy layer selected from among a Cu—Ni alloy layer and a Cu—Mn alloy layer, and an antioxidant film formed on the... Agent:

20150034702 - Apparatus & method for treating substrate: Provided are a semiconductor substrate manufacturing apparatus and a substrate treating method, and more particularly, an apparatus and method for performing a reflow treating process on a semiconductor wafer. The apparatus treating apparatus includes a load port on which a carrier accommodating a substrate is seated, a substrate treating module... Agent: Semigear Inc

20150034703 - Method of manufacturing vehicle body: In a method of manufacturing a vehicle body a side structure and a center structure are positioned in place using a fixture or the like, and fixed by welding with maintained accuracy of mounting positions; annular parts along the width of the cabin of the vehicle and other parts are... Agent:

20150034704 - Electrical component having presoldered surface with flux reservoirs: A presoldered prefluxed electrical component or connector, which can protect the flux from wearing off the surface of solder during shipping and handling. The electrical component can include a terminal pad. A layer of solder can be on the terminal pad. The layer of solder can have a surface with... Agent:

20150034705 - Pressure welding using propylene: A process and method for welding using an oxygen and propylene gas mixture is disclosed herein. Landing gear components may be welded together using this oxygen and propylene gas fuel source. For instance, an axle beam and/or a post of an aircraft may be welded using oxygen and propylene gas... Agent: Goodrich Corporation

  
01/29/2015 > 6 patent applications in 5 patent subcategories.

20150028080 - Method for the cohesive connection of two components using integrally formed portions for manipulating said components: A method for the cohesive connection of two components, in particular two rotating shaft parts, in a connecting region, is provided, wherein integrally formed portions for manipulating the surface geometry of the components are positioned adjacent to the connecting region, wherein the two components are welded together and wherein a... Agent: Siemens Aktiengesellschaft

20150028081 - Method for fabricating wire bonding structure: A method for fabricating a wire bonding structure is disclosed, which includes: providing a substrate having a plurality of bonding pads; and foaming a ball end of a bonding wire on at least one of the bonding pads by performing a scrubbing process along a path around a periphery of... Agent: Siliconware Precision Industries Co., Ltd

20150028082 - Method for repairing and improving structural integrity of storage tanks: In some implementations of ignition-free welding in at least one fastener is attached to a container that resides within a hazardous environment. The fasteners are then used to secure a fill zone to the container. The chamber then receives a sealing material for the purpose of sealing a leak without... Agent: Forge Tech, Inc.

20150028083 - Method for repairing and improving structural integrity of storage tanks: In some a friction welding apparatus includes a vacuum chamber which prevents combustion in a vicinity of a tank, the vacuum chamber formed from a flexible seal between the tank and a housing and a magnetic apparatus that encompasses a perimeter of a damaged area of the tank and a... Agent: Forge Tech, Inc.

20150028084 - Method for carrying out solder connections in a technologically optimized manner: The invention relates to a method for carrying out solder connections in a technologically optimized manner, in particular lead-free solder connections. At least one of the joining partners provides the solder required for the connection. A flux is used in order to activate the solder, and the electric and mechanical... Agent: Few Fahrzeugelektrikwerk Gmbh & Co. Kg

20150028085 - Bonding material and bonding method in which said bonding material is used: The occurrence of uneven drying in the center and end of a surface of a bonding layer during a desolvation process of a pre-drying step is reduced to ensure highly reliable bonding without peeling of a bonding surface even after repeated exposure to heat shock after bonding. The bonding material... Agent: Dowa Electronics Materials Co., Ltd.

  
01/22/2015 > 5 patent applications in 5 patent subcategories.

20150021375 - Method for semi-automatically reconditioning a railcar articulated connector: A method for semi-automatically reconditioning a railcar articulated connector that comprises a male portion including a parent casting material is provided. The method comprises applying weld material to a male portion of an articulated connector, mounting a housing mounting a housing defining an interior space to the male portion, the... Agent: Ttx Company

20150021376 - Wire bonding capillary with working tip protrusion: A method for bonding a wire to a substrate includes forming a wire ball at a working tip of a capillary and contacting the wire ball to a substrate via the capillary. The method also includes driving a protrusion at the working tip of the capillary into contact with a... Agent: Freescale Semiconductor, Inc.

20150021377 - Method and machine for forge welding of tubular articles and exothermic flux mixture and method of manufacturing an exothermic flux mixture: A method of forge welding includes placing at least two components for welding together, adjacent each other and with an exothermic flux mixture placed between the components. The exothermic flux mixture is heated to initiate an exothermic reaction and the faying surfaces of the two components are pressed together. The... Agent: Tubefuse Applications B.v.

20150021378 - Method of joining components using metal paste with oxidizing agents: A sintering method is provided which allows components to be joined to each other in a stable way, wherein the processing temperature is less than 200° C. and stable contact points are produced, which have low porosity and also high electrical and thermal conductivity. The method for joining components includes... Agent:

20150021379 - Additive manufacturing system for joining and surface overlay: An additive manufacturing system includes an additive manufacturing tool configured to receive a plurality of metallic anchoring materials and to supply a plurality of droplets to a part, and a controller configured to independently control the composition, formation, and application of each droplet to the plurality of droplets to the... Agent:

  
01/15/2015 > 6 patent applications in 6 patent subcategories.

20150014394 - Wave soldering apparatus and nozzle thereof: An apparatus used for wave soldering including a nozzle device configured to discharge molten solder to a circuit board near a solder tank, wherein, the nozzle device includes at least one pair of adjacent nozzle openings configured to discharge the molten solder towards the middle between the pair of nozzle... Agent:

20150014395 - Welding fixture: A welding fixture comprises a suction assembly, a drive assembly, and a positioning assembly. The suction assembly comprises a fixing member and a suction member slidably coupled to the fixing member. The drive assembly couples the fixing member to the suction member. The suction assembly comprises a positioning member slidably... Agent:

20150014396 - Print head for stencil printer: A stencil printer for printing viscous material on an electronic substrate includes a stencil having apertures formed therein, and a print head positioned over the stencil and configured to deposit viscous material within the apertures of the stencil. The print head includes a housing defining an elongate chamber, a source... Agent:

20150014397 - Method for bonding a tantalum structure to a cobalt-alloy substrate: Methods for bonding a porous tantalum structure to a substrate are provided. The method includes placing a compressible or porous interlayer between a porous tantalum structure and a cobalt or cobalt-chromium substrate to form an assembly. The interlayer comprising a metal or metal alloy that has solid state solubility with... Agent:

20150014398 - Method of mounting electronic parts on surface mounting substrate: A method of mounting electronic parts on a surface mounting substrate includes a step of forming a film resist layer by applying a resist with a film coating device to amounting surface of a surface mounting substrate formed with a wiring pattern including a pair of lands to mount an... Agent:

20150014399 - Conductive paste for die bonding, and die bonding method with the conductive paste: The present invention provides a conductive paste for die bonding comprising a metal powder and an organic solvent, the metal powder comprising: one or more metal particles selected from a silver powder, a palladium powder, and a copper powder, the metal particles having a purity of 99.9% by mass or... Agent: Tanaka Kikinzoku Kogyo K.k.

Previous industry: Elongated-member-driving apparatus
Next industry: Envelopes, wrappers, and paperboard boxes


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