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Metal fusion bonding

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
01/22/2015 > 5 patent applications in 5 patent subcategories.

20150021375 - Method for semi-automatically reconditioning a railcar articulated connector: A method for semi-automatically reconditioning a railcar articulated connector that comprises a male portion including a parent casting material is provided. The method comprises applying weld material to a male portion of an articulated connector, mounting a housing mounting a housing defining an interior space to the male portion, the... Agent: Ttx Company

20150021376 - Wire bonding capillary with working tip protrusion: A method for bonding a wire to a substrate includes forming a wire ball at a working tip of a capillary and contacting the wire ball to a substrate via the capillary. The method also includes driving a protrusion at the working tip of the capillary into contact with a... Agent: Freescale Semiconductor, Inc.

20150021377 - Method and machine for forge welding of tubular articles and exothermic flux mixture and method of manufacturing an exothermic flux mixture: A method of forge welding includes placing at least two components for welding together, adjacent each other and with an exothermic flux mixture placed between the components. The exothermic flux mixture is heated to initiate an exothermic reaction and the faying surfaces of the two components are pressed together. The... Agent: Tubefuse Applications B.v.

20150021378 - Method of joining components using metal paste with oxidizing agents: A sintering method is provided which allows components to be joined to each other in a stable way, wherein the processing temperature is less than 200° C. and stable contact points are produced, which have low porosity and also high electrical and thermal conductivity. The method for joining components includes... Agent:

20150021379 - Additive manufacturing system for joining and surface overlay: An additive manufacturing system includes an additive manufacturing tool configured to receive a plurality of metallic anchoring materials and to supply a plurality of droplets to a part, and a controller configured to independently control the composition, formation, and application of each droplet to the plurality of droplets to the... Agent:

01/15/2015 > 6 patent applications in 6 patent subcategories.

20150014394 - Wave soldering apparatus and nozzle thereof: An apparatus used for wave soldering including a nozzle device configured to discharge molten solder to a circuit board near a solder tank, wherein, the nozzle device includes at least one pair of adjacent nozzle openings configured to discharge the molten solder towards the middle between the pair of nozzle... Agent:

20150014395 - Welding fixture: A welding fixture comprises a suction assembly, a drive assembly, and a positioning assembly. The suction assembly comprises a fixing member and a suction member slidably coupled to the fixing member. The drive assembly couples the fixing member to the suction member. The suction assembly comprises a positioning member slidably... Agent:

20150014396 - Print head for stencil printer: A stencil printer for printing viscous material on an electronic substrate includes a stencil having apertures formed therein, and a print head positioned over the stencil and configured to deposit viscous material within the apertures of the stencil. The print head includes a housing defining an elongate chamber, a source... Agent:

20150014397 - Method for bonding a tantalum structure to a cobalt-alloy substrate: Methods for bonding a porous tantalum structure to a substrate are provided. The method includes placing a compressible or porous interlayer between a porous tantalum structure and a cobalt or cobalt-chromium substrate to form an assembly. The interlayer comprising a metal or metal alloy that has solid state solubility with... Agent:

20150014398 - Method of mounting electronic parts on surface mounting substrate: A method of mounting electronic parts on a surface mounting substrate includes a step of forming a film resist layer by applying a resist with a film coating device to amounting surface of a surface mounting substrate formed with a wiring pattern including a pair of lands to mount an... Agent:

20150014399 - Conductive paste for die bonding, and die bonding method with the conductive paste: The present invention provides a conductive paste for die bonding comprising a metal powder and an organic solvent, the metal powder comprising: one or more metal particles selected from a silver powder, a palladium powder, and a copper powder, the metal particles having a purity of 99.9% by mass or... Agent: Tanaka Kikinzoku Kogyo K.k.

01/08/2015 > 6 patent applications in 5 patent subcategories.

20150008249 - Device for dispensing and distributing flux-free solder on a substrate: A device for dispensing and distributing flux-free solder on a substrate comprises an elongated tool, a tool mount, an ultrasonic generator, a wire guide tube, and optionally a heat sink and a housing. The tool can be fixed to the tool mount and has a longitudinal borehole which opens into... Agent:

20150008250 - Device for torsionally welding metal parts by means of ultrasound: A device for ultrasonically welding metal parts includes a sonotrode whose head can be excited by a vibration generator to produce vibrations. The sonotrode is connected to the vibrator with a screw connection provided on one side of the sonotrode. The sonotrode head may have at least one welding surface... Agent:

20150008251 - Method and apparatus for measuring a free air ball size during wire bonding: Disclosed is a method of measuring a free air ball size during a wire bonding process of a wire bonder, which comprises a position sensor and a bonding tool for forming an electrical connection between a semiconductor device and a substrate using a bonding wire. Specifically, the method comprises the... Agent:

20150008252 - Manufacturing method for a shield conductor: A method is disclosed for manufacturing a shield conductor by connecting a metallic braid part formed of tubularly braided metallic wire to a part to be connected provided with a tubular part having electrical conductivity. The method includes fitting the metallic braid part to an outer peripheral surface of an... Agent:

20150008253 - Transient liquid phase bonding process for double sided power modules: A double-sided bonding process using transient liquid phase (TLP) bonding structure. A first side of an electronic device is processed to partially complete bonding. A second side of the electronic device is processed to complete bonding. The first side completes bonding during the processing of the second side. This reduces... Agent: Toyota Motor Engineering & Manufacturing North America, Inc.

20150008254 - Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same: A bond head for a thermocompression bonder is provided. The bond head includes a tool configured to hold a workpiece to be bonded, a heater configured to heat the workpiece to be bonded, and a chamber proximate the heater. The chamber is configured to receive a cooling fluid for cooling... Agent:

01/01/2015 > 6 patent applications in 6 patent subcategories.

20150001277 - Multi-spot soldering apparatus: A multi-spot soldering apparatus which applies temperature protection to molten solder to be applied to the contacts of electronic components on printed circuit boards is provided. The multi-spot soldering apparatus includes a bottom plate, a number of containers mounted on the bottom plate and communicating with the multiple solder pot,... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20150001278 - Solder ball mounter: An solder ball mounter includes a stage configured to support a substrate, a ball placer head configured to provide solder balls, and a solder ball mask configured to align the solder balls with the substrate. The solder ball mask includes an upper mask layer including an upper opening having a... Agent: Samsung Electronics Co., Ltd.

20150001279 - Multi-vehicle model collinear flexible framing system: A multi-vehicle type co-production line flexible framing is disclosed, comprising a robot welding system, a high speed transport system, a floor panel intelligent flexible positioning system, and a side panel flexible positioning and switching system. The floor panel intelligent flexible positioning system is correspondingly connected to a transfer rail of... Agent: Guangzhou Mino Automotive Equipment Co., Ltd.

20150001280 - Method for joining metal materials: A method for joining metal materials, which joins a first member with at least a joining face made of Metal A, the Metal A being mainly composed of at least one selected from the group consisting of Al, Cu, Ag and Au, to a second member with at least a... Agent:

20150001281 - Crash-durable adhesive with enhanced stress durability: A heat-curable structural adhesive includes a non-rubber-modified epoxy resin, a reaction product of a carboxyl- or amine-terminated butadiene polymer or copolymer and a bisphenol F-based epoxy resin, a elastomeric toughener containing capped isocyanate groups, one or more epoxy curing agents a moisture scavenger and a heat activatable catalyst comprising a... Agent:

20150001282 - Apparatus for thermal melting process and method of thermal melting process: The apparatus for thermal melting process according to the present invention is an apparatus 1 for thermal melting process that thermally melts objects 100 including solder in an atmosphere containing carbonic acid vapor, and the hand part 4 for carrying and transferring the thermally melted process objects 100 is used... Agent: Ayumi Industry Co., Ltd.

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