Metal fusion bonding inventions

20090266869 - Ultrasonic vibration bonding resonator: An ultrasonic vibration bonding resonator includes a resonance body, bonding working portions having a bonding working face and provided at a point of maximum oscillation on upper and lower surfaces of the resonance body and support portions provided at two points of minimum oscillation apart from the bonding working portions... Agent: Sughrue Mion, PLLC

20090266870 - Joined composite structures with a graded coefficient of thermal expansion for extreme environment applications: An integrated composite structure with a graded coefficient of thermal expansion (CTE) is formed by selecting a plurality of layers of materials with a graded CTE and using joining approaches such as welding, brazing, or solid state bonding to produce a CTE-graded layered composite or near net shape. The integrated... Agent: The Boeing Company C/o Felix L. Fischer, Attorney At Law

20090266871 - Method and apparatus for beam soldering: Beam soldering involves using a beam of light emitted from a source to reflow adjoining pairs of solder pads on components being joined. In some scenarios, material between adjacent solder pads on at least one of the components is absorptive of a certain spectrum of light and, consequently, can be... Agent: Hitachi C/o Wagner Blecher LLP

20090261146 - Donor material technology for friction stir welding: A method and apparatus is disclosed for forming a friction stir weld joint using a friction stir tool. A first metallic work material and a second metallic work material are provided and are substantially abutted to define a joint interface having a weld surface. A quantity of metallic donor material... Agent: Williams Mullen

20090261147 - Dross removal: This invention relates to for devices, systems, and methods for separating dross, carried by molten solder, into solder and residue.... Agent: Fish & Richardson PC

20090261148 - Production method of solder circuit board: A method for producing a solder circuit board includes the steps of imparting tackiness to a surface of an electrically conductive circuit electrode on a printed-wiring board to form a tacky part, causing only one solder particle to adhere to the tacky part, and heating the printed-wiring board, thereby melting... Agent: Sughrue Mion, PLLC

20090261149 - Mounting method using thermocompression head: A mounting method is provided using a thermocompression head which can mount an electric component in a short time with high connection reliability. The method is provided for mounting an electric component on a wiring board by using a thermocompression head having an elastic pressure bonding member composed of an... Agent: K&l Gates LLP

20090255979 - Ultrasonic mounting apparatus: In an ultrasonic mounting apparatus, a pressing shaft coupled with a voice coil motor to apply a load on a part to be mounted is placed independently from components including a bonding tool, ultrasonic horn, transducer, and horn support member. The components can move coaxially with the pressing shaft which... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20090255980 - Control systems for friction stir welding of titanium alloys and other high temperature materials: Control systems, methods, and algorithms are provided for controlling the process parameters during FSW in order to repeatedly produce high quality welds for high temperature alloys such as titanium alloys and superalloys. In accordance with exemplary embodiments of the present invention, a desired range of forge load, pinch load, and/or... Agent: Mcdermott Will & Emery LLP

20090255981 - Method for repairing cracks in components and solder material for soldering components: The invention relates to a method for repairing components that consist of a superalloy. The method comprises the following steps: a solder material is applied to the repair site; the repair site with the applied solder material is heated until the latter melts; and the melted solder material is left... Agent: Siemens Corporation Intellectual Property Department

20090250503 - z-axis motion system for a wire bonding machine: A coil assembly configured to provide motion of a bonding tool of a wire bonding machine along a substantially vertical axis is provided. The coil assembly includes a first coil portion having a first force constant, the first coil portion being configured to receive energy to provide a first motion... Agent: Kulicke And Soffa Industries, Inc.

20090250504 - Solder applying apparatus: A solder applying apparatus includes a tray body having a base portion and a surrounding portion extending from a periphery of the base portion, cooperating with the base portion to define a solder-accommodating space therebetween for receiving a solder material therein, and having a top end distal from the base... Agent: Townsend And Townsend And Crew, LLP

20090250505 - Gimballing roller device for friction stir welding apparatus and method: A friction stir welding (FSW) apparatus has an FSW tool adapted for joining work pieces supportable against a backing anvil. The FSW apparatus comprises a pair of clamping rollers maintained in substantially perpendicular relationship to the backing anvil as the FSW tool moves along the tool path. A roller pivot... Agent: NovatechIPLaw

20090250506 - Apparatus and methods of attaching hybrid vlsi chips to printed wiring boards: A method for preparing an integrated circuit for connection to a surface, the integrated circuit including lead contacts and leadless contacts, is provided. The method includes providing the integrated circuit, applying a first solder paste to the leadless contacts, forming solder balls on the applied solder paste, heating the solder... Agent: Steptoe & Johnson LLP

20090250507 - Soldering method and system thereof: A soldering system includes a circuit board having first soldering terminals, a soldering object having second soldering terminals, soldering blocks disposed between the circuit board and the soldering object for electrically interconnecting the first soldering terminals and the second soldering terminals respectively, and a supporting structure supporting the soldering object... Agent: Wei Te Chung Foxconn International, Inc.

20090250508 - Antioxidant joint compound and method for forming an electrical connection: In a method for forming an electrical connection between electrical components, a joint compound as described is applied to mating surfaces of either a suitable connector, the components to be coupled together, or both. The connector is then crimped to the components, for example a wire and grounding rod, such... Agent: Panduit Corp.