Metal fusion bonding patents - Monitor Patents
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Metal fusion bonding

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
  
07/10/2014 > 4 patent applications in 4 patent subcategories.

20140191016 - Tubular friction welding joining method without rotation of the tubulars: Tubulars are joined to each other without rotation of the tubulars. A coupling is placed between the aligned tubulars and is supported for rotation or oscillating about its longitudinal axis. The tubulars are clamped in a manner that allows a compressive force to be transmitted to the coupling as the... Agent: Baker Hughes Incorporated

20140191017 - Nickel-based alloy, use and method: The invention relates to a novel alloy which comprises the elements carbon (C), chromium (Cr), cobalt (Co), molybdenum (Mo), tungsten (W), titanium (Ti), aluminium (Al), boron (B), and zirconium (Zr), based on nickel, and which has a very low tendency to form cracks during welding.... Agent: Siemens Aktiengesellschaft

20140191018 - Welded hot-rolled high-strength steel structural members and methods: Hot-rolled high-strength steel elongated structural members and method of making same are disclosed by hot-rolling high-strength steel having a specific chemical composition to provide structural units. The units are then welded together to provide structural members of desired geometrical configuration including a thin web with opposed thicker flanges extending therefrom... Agent: Consolidated Metal Products, Inc.

20140191019 - Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment: Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules... Agent: Advanced Technology Materials, Inc.

  
07/03/2014 > 6 patent applications in 5 patent subcategories.

20140183245 - Friction stir welding apparatus: A friction stir welding apparatus having a new cooling system that can cool a portion required to be cooled accurately and uniformly with a simple configuration, while suppressing unnecessary thermal expansion of a mounting jig includes a holding mechanism 20 having a holding member 22a movable with respect to a... Agent: F-tech Inc.

20140183246 - Friction stir welding apparatus: In a friction stir welding apparatus that can control a penetrating position of a probe with respect to a processing target member to an optimum position at a time of friction stir welding by detecting a wear volume and a tip position of the probe, as a drive mechanism moves... Agent: F-tech Inc.

20140183247 - Welding methods: A visually seamless method of joining a first piece of metal and a second piece of metal is described. The first piece of metal is placed in contact with an edge of the second piece of metal. In some embodiments, the edge includes a sacrificial lip. The first piece of... Agent: Apple Inc.

20140183248 - Methods for vacuum assisted underfilling: Methods for applying an underfill with vacuum assistance. The method may include dispensing the underfill onto a substrate proximate to at least one exterior edge of an electronic device attached to the substrate. A space between the electronic device and the substrate is evacuated through at least one gap in... Agent: Nordson Corporation

20140183249 - Substrate processing device and method of manufacturing the same: Disclosed herein is a substrate processing device, including: a first mask disposed over a base substrate and provided with a first opening which exposes a connection pad of the base substrate; a first squeeze inserting a flux ball into a first opening of the first mask; and a first heating... Agent: Samsung Electro-mechanics Co., Ltd.

20140183250 - Heat transfer device for wave soldering: A structure including a circuit board including a plane and a pin-in-hole component; and a heat transfer device, where the heat transfer device is thermally connected to the plane at a leading edge of the circuit board, the heat transfer device transfers heat from a wave of molten solder to... Agent: International Business Machines Corporation

  
06/26/2014 > 3 patent applications in 2 patent subcategories.

20140175158 - Method for manufacturing light emitting diode package: A method for manufacturing an LED package includes following steps: providing a eutectic bonding apparatus comprising a heating device, a supporting platform located in the heating device, and a nozzle; providing a resistance measuring device comprising a probe, an electrical power, and a controlling unit; providing an LED chip; providing... Agent:

20140175159 - Thermocompression bonding method and apparatus for mounting semiconductor chips on a substrate: m

20140175160 - Solder paste material technology for elimination of high warpage surface mount assembly defects: A composition including a solder flux including a rosin material have a property to maintain a less than 10 percent drop in tackiness from an initial tackiness value of 20 gf to 120 gf over a temperature regime of 20° C. to 200° C. A composition including a solder powder;... Agent:

  
06/19/2014 > 3 patent applications in 3 patent subcategories.

20140166730 - Ultrasonic soldering process for electrically powered igus: The present invention relates to an ultrasonic soldering tool for soldering wires to a solder tab of an electrochromic device located between the layers of an insulated glass unit. The soldering tool includes an ergonomically designed handle and soldering tip head to increase operator comfort during use while also providing... Agent: Sage Electrochromics, Inc.

20140166731 - Friction stir welding method: The invention aims at providing a friction stir welding method which can achieve joining a butting portion to a deep location therein by reducing the load on the friction stirring device. The friction stir welding method for joining two metal members (1) using a primary joining rotary tool (F) with... Agent: Nippon Light Metal Company, Ltd.

20140166732 - Method of reattaching an end assembly to a well car: A method of shortening an end of a well car includes removing a plurality of parts that would inhibit the shortening process; cutting a shear plate and a set of side sill angles at a location on the well side of the end assembly; detaching the end assembly from a... Agent: Ttx Company

Previous industry: Elongated-member-driving apparatus
Next industry: Envelopes, wrappers, and paperboard boxes


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