Metal fusion bonding patents - Monitor Patents
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Metal fusion bonding

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
  
09/04/2014 > 4 patent applications in 4 patent subcategories.
  
08/28/2014 > 3 patent applications in 2 patent subcategories.

20140239049 - Method of manufacturing mask assembly for thin film deposition: A method of manufacturing a mask assembly for thin film deposition includes: positioning a division mask on a mask frame, wherein the division mask has a length in a first direction that is greater than a width in a second direction perpendicular to the first direction; and spot welding opposing... Agent: Samsung Display Co., Ltd.

20140239050 - Self-expansible stent with radiopaque markers and method of making such a stent: Pushing a self-expanding stent from one of its ends, during release of the stent at a stenting site in a bodily lumen, by proximal withdrawal of a surrounding sheath, can impose unacceptably high stresses on parts of the strut network of the stent. For location of stents in a bodily... Agent: C. R. Bard, Inc.

20140239051 - Cutter structures, inserts comprising same and method for making same: A method of making a cutter structure comprising super-hard material defining a rake face topology is provided. The method includes providing a pre-sinter assembly comprising a substrate body having a formation surface defining a topology complementary to the rake face topology, and an aggregation comprising a plurality of super-hard grains,... Agent: Element Six Abrasives S.a.

  
08/21/2014 > 3 patent applications in 3 patent subcategories.

20140231490 - Friction stir welding apparatus: A friction stir welding apparatus includes a rotating tool provided with an upper rotating body arranged to be axially adjustable in position by an upper actuator, a lower rotating body integral with a rotating main rod extending through the upper rotating body and arranged to be axially adjustable in position... Agent: Nippon Sharyo, Ltd.

20140231491 - Method of manufacturing electronic component unit: An electronic component unit manufacturing method includes: preparing a circuit board including a heat generating element mounted thereon and a bonding metal foil layer formed thereon, a heat transfer board including an insulative layer formed on one face thereof and a heat transfer metal foil layer formed on the insulative... Agent:

20140231492 - Electronic component mounting method, electronic component placement machine, and electronic component mounting system: Disclosed is an electronic component mounting method including the steps of: providing a first electronic component having a principal surface provided with a plurality of bumps; providing a substrate having a plurality of first electrodes corresponding to the plurality of bumps; applying flux to the plurality of bumps; placing the... Agent: Panasonic Corporation

  
08/14/2014 > 4 patent applications in 4 patent subcategories.

20140224859 - Coated rotary tool and method for manufacturing the same: A friction stir welding tool of the present invention is used for friction stir welding, and includes: a base material; and a coating layer formed on a surface of at least a portion of the base material that is to be caused to contact workpieces during friction stir welding, the... Agent:

20140224860 - Fill head interface with combination vacuum pressure chamber: A fill head apparatus includes at least one chamber for holding a fluid. The chamber has an outlet for expelling the fluid. A vacuum device has an inlet for a suction device adjacent to the fluid outlet. A plurality of flexible and resilient sealing devices contact a top surface of... Agent: International Business Machines Corporation

20140224861 - Wire solder, method of feeding the same, and apparatus and system therefor: Provided is an apparatus for feeding wire solder with high tensile strength and pull cut resistance. The wire solder has an extended wire solder and a core wire having a higher tensile strength than the wire solder. The apparatus for feeding the wire solder comprises a wire solder storage section... Agent: Nihon Superior Co., Ltd.

20140224862 - Method of manufacturing a semiconductor device: A soldering method achieves little void and good joint condition in soldering an insulated circuit board and a semiconductor chip using a tin—high antimony solder material. A method of manufacturing a semiconductor device includes the steps of preparing a solder plate having a U-shape; mounting the solder plate on a... Agent: Fuji Electric Co., Ltd.

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