|Metal fusion bonding patents - Monitor Patents|
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Metal fusion bondingBelow are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 03/06/2014 > 6 patent applications in 5 patent subcategories.
20140061283 - Friction stir welding apparatus: A friction stir welding apparatus includes a displacement detecting device that detects displacement of a welding tool caused by deformation of a fitting jig, at the time of performing friction stir welding in which an arm to which the fitting jig fitted with the welding tool is fixed is moved... Agent: F-tech Inc.
20140061282 - System for preventing the formation of martensite in metals joining applications: A system for joining materials such as metal alloys that includes a first component, wherein the first component includes a first alloy having a known austenization temperature below which martensite forms when the component is heated and then cooled at a predetermined rate of cooling; a second component, wherein the... Agent: Edison Welding Institute, Inc.
20140061284 - Hermetically sealed polymer capacitors with high stability at elevated temperatures: A process for providing an improved hermetically sealed capacitor which includes the steps of applying a solder and a flux to an interior surface of a case; flowing the solder onto the interior surface; remove flux thereby forming a flux depleted solder; inserting the capacitive element into the casing; reflowing... Agent: Kemet Electronics Corporation
20140061285 - Connection verification technique: Some embodiments of the present invention are generally directed to testing connections of a memory device to a circuit board or other device. In one embodiment, a memory device that is configured to facilitate continuity testing between the device and a printed circuit board or other device is disclosed. The... Agent: Micron Technology, Inc.
20140061286 - Extruded 3xxx-series aluminium alloy tube product: An aluminium alloy extruded tube product for a heat exchanger assembly and made from a 3xxx-series aluminium alloys and including furthermore a purposive addition of one or more wetting elements selected from the group of: Bi 0.03% to 0.5%, Pb 0.03% to 0.5%, Sb 0.03% to 0.5%, Li 0.03% to... Agent: Aleris Rolled Products Germany Gmbh
20140061287 - Lead-free solder ball: A lead-free solder ball for electrodes of a BGA or CSP comprising 0.5-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. Even when a printed circuit board to which the solder ball is bonded has Cu electrodes or Au-plated... Agent: Senju Metal Industry Co., Ltd.02/27/2014 > 2 patent applications in 2 patent subcategories.
20140054357 - Welding fixture clamp: A welding fixture clamp includes a stationary clamp jaw having a first guide surface and a pivotal clamp jaw having a second guide surface. The second guide surface slides relative to the first guide surface as the pivotal clamp jaw pivots about the pivot axis. Side shields are secured to... Agent: Automation Services, LLC
20140054358 - Coiled tubing with heat resistant conduit: Coiled tubing with a secured conduit and a method for manufacturing same. A slickline held by a retainer is introduced to the coiled tubing manufacturing process by attaching the retainer and slickline to a metal plate, prior to the metal plate being welded into a tubular. The slickline is unaffected... Agent:02/20/2014 > 5 patent applications in 5 patent subcategories.
20140048583 - Method for holding high speed friction spot joining tools: The invention utilizes vibration control, precision manufacturing tolerances for certain components of the system, and techniques for limiting thermal expansion of components, including passive insulation and active cooling techniques, in order to enable high speed tool rotation for Friction Stir Spot Joining of Advanced High Strength Steels.... Agent:
20140048584 - Ultrasonic bonding systems and methods of using the same: An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool for bonding a conductive bonding material to a workpiece. The ultrasonic bonding system also includes a pressing member adapted to press against the workpiece, the pressing member being supported by the... Agent: Orthodyne Electronics Corporation
20140048585 - Method of forming a collar on a tubular component through depositing of weld metal and machining this deposit into a collar: A method of forming a collar on a tubular component is described. The method includes the steps of depositing a weld metal onto the surface of the tubular component, machining the collar into the weld material, and machining a support shoulder into the collar to facilitate suspension of the tubular... Agent: Pipeline Technique Limited
20140048586 - Innovative multi-purpose dipping plate: The present disclosure is directed to an apparatus for the application of soldering flux to a semiconductor workpiece. In some embodiments the apparatus comprises a dipping plate having a reservoir which is adapted to containing different depths of flux material. In some embodiments, the reservoir comprises at least two landing... Agent: Taiwan Semiconductor Manufacturing Co., Ltd.
20140048587 - Brazing alloy and processes for making and using: Disclosed is a brazing alloy composition. The composition comprises, by weight, about 94% copper, about 4% zinc, and about 2% iron. Further disclosed is a brazing process utilizing the brazing alloy, a method for the brazing alloy's preparation and a work piece having members joined by the brazing alloy providing... Agent:02/13/2014 > 6 patent applications in 6 patent subcategories.
20140042207 - Position adjustable grapple attachment: An attachment that is configured for attachment to an arm of a piece of construction equipment. The attachment includes a pair of grapple mechanisms mounted on a main beam. Each grapple mechanism includes opposing grab arms mounted to a grab arm housing. The grab arm housings of the grapple mechanisms... Agent: Lavalley Industries, LLC
20140042208 - Method and apparatus for manufacturing vehicle power transmission device: A method for manufacturing a vehicle power transmission device having a case and a ring gear fitted to the outer peripheral surface of the case to transmit drive power from a drive source. The method includes: a welding step in which an annular flange is provided on the case or... Agent: Toyota Jidosha Kabushiki Kaisha
20140042209 - Method for manufacturing a spiral groove metal pipe with a symmetrical structure: A method for manufacturing a spiral groove metal pipe with a symmetrical structure comprises the steps of: supplying a metal strip successively; forming spiral grooves on the upper surface of the metal strip supplied at the metal strip supplying step in which the spiral grooves are repeatedly and symmetrically formed... Agent:
20140042210 - Rounding system and method used in the manufacture of conical or cylindrical structures: A can rounding system and method that uses arms that are able to maintain cans in a concentric arrangement during the welding process. The arms enable the can rounding system to maintain the concentric positions in order to achieve improved circular dimensions and increase the overall efficiency in the construction... Agent: Smi & Hydraulics, Inc.
20140042211 - Method and system for welding conduits: A system and a method for welding two or more conduits are disclosed. The system includes a root welding tool, a filler welding tool and a support member. The root welding tool root weld a gap to form a root layer configured along end portions, from outer circumferential surfaces side... Agent: Alstom Technology Ltd
20140042212 - Electrically conductive compositions comprising non-eutectic solder alloys: Transient liquid phase sintering compositions comprising one or more high melting point metals and one or more low melting temperature alloys are known in the art as useful compositions for creating electrically and/or thermally conductive pathways in electronic applications. The present invention provides transient liquid phase sintering compositions that employ... Agent: Ormet Circuits, Inc.Previous industry: Elongated-member-driving apparatus
Next industry: Envelopes, wrappers, and paperboard boxes
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