Metal fusion bonding patents - Monitor Patents Logo icons
Monitor Keywords Patent Organizer File a Provisional Patent Browse Inventors Browse Industry Browse Agents

USPTO Class 228  |  Browse by Industry: Previous - Next | All     monitor keywords
Recent  |  14:  |  |  | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | 13: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | 12: Dec | Nov | Oct | Sep | Aug | July | June | May | April | Mar | Feb | Jan | 11: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | 10: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan |  | 09: Dec | Nov | Oct | Sep | Aug | Jl | Jn | May | Apr | Mar | Fb | Jn |  | 2008 | 2007 |

Metal fusion bonding

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
12/04/2014 > 3 patent applications in 3 patent subcategories.

20140353360 - Temperature triggering ejector mechanism for lock pin soldering type component: A temperature triggering ejector system for lock pin soldering type component is provided. There is provided a temperature triggering ejector system for a lock pin soldering type component, lock pins of said component are fixed in through holes of a circuit board and solder is filled in the through holes... Agent: International Business Machines Corporation

20140353361 - Electric wire connecting method and connecting device thereof: An electric wire connecting device connects a conductor of an electric wire formed of a plurality of core wires to a terminal. The connecting device includes a pair of clamping members for clamping a part of an end portion of the conductor, and a ultrasonic welding horn for connecting the... Agent: Yazaki Corporation

20140353362 - Laser ablation process for manufacturing submounts for laser diode and laser diode units: A method for manufacturing submounts for laser diodes includes the steps of providing a base configured with a ceramic carrier and a metal layer deposited upon the substrate. The method further includes using a pulsed laser operative to generate a plurality of pulses which are selectively trained at predetermined pattern... Agent: Ipg Photonics Corporation

11/27/2014 > 2 patent applications in 2 patent subcategories.

20140346215 - Metal connection method: Disclose is a metal connection method comprising the steps of: holding a connection part of a first metal member and a connection part of a second metal member facing each other; deforming the connection parts by applying pressure to the connection parts with the connection parts butted each other to... Agent: Yazaki Corporation

20140346216 - Process for joining by diffusion welding a part made of steel having a high carbon content with a part made of steel or nickel alloy having a low carbon content: corresponding assembly: Process for joining by diffusion welding a part made of steel having a high carbon content and low carbide-forming elements content with a part made of steel or of nickel alloy having a low carbon content and a high carbide-forming elements content, each of the parts comprising a surface to... Agent: Commissariat &#xc0 L'&#xc9 Nergie Atomique Et Aux &#xc9 Nergies Alternatives

11/20/2014 > 4 patent applications in 4 patent subcategories.

20140339288 - Production method of multilayer clad material: A production method includes a rolling step of obtaining a laminated plate by clad rolling first and second metallic plates in a superposed manner at a rolling reduction of 25% to 85%, a surface activation treatment step of subjecting at least joint scheduled surfaces of the laminated plate 20 and... Agent: Showa Denko K.k.

20140339289 - Method of manufacturing mounting substrate and method of manufacturing electronic apparatus: A method of manufacturing a mounting substrate, the method includes: transferring part or all of a plurality of devices on a device substrate onto a wiring substrate, and temporarily fixing the transferred devices to the wiring substrate with use of a fixing layer having viscosity, the device substrate including a... Agent: Sony Corporation

20140339290 - Wire bonding method and semiconductor package manufactured using the same: Provided is a wire bonding method. The method includes: positioning a capillary having a wire inserted on a substructure including at least three connection terminals spaced apart from each other; forming an adhesive ball at a tip of the wire; bonding the adhesive ball to one of the connection terminals... Agent:

20140339291 - Method for enhancing the yield rate of ball implanting of a substrate of an integrated circuit: A method is used for implanting solder balls of an integrated circuit by operating a ball implanting machine. The ball implanting machine includes a suction fixture, an evacuating device, two pivoting and inverting devices, a guide plate, a ball carrier, and a substrate. The suction fixture has a plurality of... Agent:

11/13/2014 > 1 patent applications in 1 patent subcategories.

20140332583 - Wire bonding apparatus: Provided is a wire bonding apparatus including: a base (11); a bonding head (13) configured to move a capillary (15) in X, Y, and Z directions with respect to the base (11); and a wire-cleaning plasma unit (30). The wire-cleaning plasma unit (30) includes: hollow casings (31a), (31b) in which... Agent: Shinkawa Ltd.

Previous industry: Elongated-member-driving apparatus
Next industry: Envelopes, wrappers, and paperboard boxes


RSS FEED for 20141204: xml
Integrate into your RSS reader/aggregator or website to track weekly updates.
For more info, read this article.


Thank you for viewing Metal fusion bonding patents on the website. These are patent applications which have been filed in the United States. There are a variety ways to browse Metal fusion bonding patent applications on our website including browsing by date, agent, inventor, and industry. If you are interested in receiving occasional emails regarding Metal fusion bonding patents we recommend signing up for free keyword monitoring by email.

Results in 0.58502 seconds