Metal fusion bonding patents - Monitor Patents Logo icons
Monitor Keywords Patent Organizer File a Provisional Patent Browse Inventors Browse Industry Browse Agents

USPTO Class 228  |  Browse by Industry: Previous - Next | All     monitor keywords
Recent  |  14:  | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | 13: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | 12: Dec | Nov | Oct | Sep | Aug | July | June | May | April | Mar | Feb | Jan | 11: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | 10: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan |  | 09: Dec | Nov | Oct | Sep | Aug | Jl | Jn | May | Apr | Mar | Fb | Jn |  | 2008 | 2007 |

Metal fusion bonding

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
11/13/2014 > 1 patent applications in 1 patent subcategories.

20140332583 - Wire bonding apparatus: Provided is a wire bonding apparatus including: a base (11); a bonding head (13) configured to move a capillary (15) in X, Y, and Z directions with respect to the base (11); and a wire-cleaning plasma unit (30). The wire-cleaning plasma unit (30) includes: hollow casings (31a), (31b) in which... Agent: Shinkawa Ltd.

11/06/2014 > 4 patent applications in 4 patent subcategories.

20140326778 - Ultrasonic wire bonding wedge with multiple bonding wire slots: An ultrasonic wire bonding wedge with multiple bonding wire slots is provided. The wire bonding wedge includes a pillar fixing part for providing fixed connection to the bonding device. One end of the fixing part includes a wire bonding wedge nozzle, with feature that the tip of the nozzle including... Agent:

20140326779 - Inflatable purge dam apparatus with diffuser: An inflatable purge dam apparatus includes first and second inflatable purge bladders defining a weld-zone therebetween. A purge gas discharge port is adapted to deliver a purge gas into the weld zone. A purge gas diffuser is in fluid communication with the gas discharge port. The purge gas diffuser is... Agent:

20140326780 - Welding device for mask frame assembly and method of welding mask frame assembly: A welding device for a mask frame assembly, includes a chamber maintained in a vacuum state, a mask frame disposed in the chamber, a support frame disposed in the chamber and configured to support the mask frame, a mask disposed in the chamber and configured to be welded to the... Agent: Samsung Display Co,. Ltd.

20140326781 - Linear friction welding method: A linear friction welding method and linear friction welding apparatus for joining two work pieces. The method involves vibrating a third weld component, or “coupon” between the two principle work pieces under a welding pressure. Friction between the coupon and work pieces causes the material at the weld surfaces to... Agent:

10/30/2014 > 2 patent applications in 2 patent subcategories.

20140319199 - Multi-functional detachable and replaceable wire bonding heating plate: A multi-functional detachable and replaceable wire bonding heating plate is provided with a heat blocking layer, a heating layer, a heat equalization layer, and a top layer. The bottom of the heat blocking layer has a recessed portion and the heating layer is disposed on top of the heat blocking... Agent: Pram Technology Inc.

20140319200 - Method of mounting electronic part, circuit substrate, and image forming apparatus: The circuit substrate includes at least two lands formed on a substrate, wherein one electrode is to be mounted on the at least two lands, an electronic part having electrodes, one of the electrodes is soldered on the at least two lands with solders whose amounts are adjusted by a... Agent: Canon Kabushiki Kaisha

10/23/2014 > 7 patent applications in 6 patent subcategories.

20140312096 - Oxy-fuel weld repair of metallic components: A method of repairing a metallic component is disclosed. The method may include machining away a damaged first portion of the component, and machining away a second portion of the component adjacent the damaged first portion, the second portion being an area that would be subject to distortion resulting from... Agent: Caterpillar Inc.

20140312098 - Systems and methods for fabricating structures including metallic glass-based materials using ultrasonic welding: Systems and methods in accordance with embodiments of the invention fabricate objects including metallic glass-based materials using ultrasonic welding. In one embodiment, a method of fabricating an object that includes a metallic glass-based material includes: ultrasonically welding at least one ribbon to a surface; where at least one ribbon that... Agent: California Institute Of Technology

20140312097 - Wire connection method and wire connection device: In connecting a conductor consisting of a plurality of core lines of an electric wire to a terminal, it is performed to make the core lines, which are adjacent to each other at a peripheral part in a vicinity of an end of the conductor, into contact with each other... Agent: Yazaki Corporation

20140312099 - Friction stir welding tool made of cemented tungsten carbide with nickel and with a al2o3 surface coating: A friction stir welding tool for welding of metallic plates and especially steel plates. The friction stir welding tool is made of cemented carbide comprising WC grains in a binder phase and wherein the welding tool is at least partly coated with a surface coating comprising Al2O3.... Agent:

20140312100 - Protective polymer layer: The present invention relates to a method of joining polymer coated steel pipes comprising the steps of providing polymer coated pipe segments with an uncoated length on both ends of the segments; welding the polymer coated pipe segments together; applying a curable polymer (A) onto the uncoated length of the... Agent: Borealis Ag

20140312101 - Materials, structures and methods for microelectronic packaging: Highly reliable interconnections for microelectronic packaging. In one embodiment, dielectric layers in a build-up interconnect have a gradation in glass transition temperature; and the later applied dielectric layers are laminated at temperatures lower than the glass transition temperatures of the earlier applied dielectric layers. In one embodiment, the glass transition... Agent:

20140312102 - Semiconductor device manufacturing method and soldering weight: A method for manufacturing a semiconductor device, includes preparing a solder, a soldering article, a base material, a weigh having a foot where a center of gravity of the weight is shifted from a center of the soldering article, a positioning jig having a hole for holding the soldering article... Agent: Fuji Electric Co., Ltd.

Previous industry: Elongated-member-driving apparatus
Next industry: Envelopes, wrappers, and paperboard boxes


RSS FEED for 20141113: xml
Integrate into your RSS reader/aggregator or website to track weekly updates.
For more info, read this article.


Thank you for viewing Metal fusion bonding patents on the website. These are patent applications which have been filed in the United States. There are a variety ways to browse Metal fusion bonding patent applications on our website including browsing by date, agent, inventor, and industry. If you are interested in receiving occasional emails regarding Metal fusion bonding patents we recommend signing up for free keyword monitoring by email.

Results in 0.21599 seconds