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Metal fusion bonding February patent applications/inventions, industry category 02/10Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 02/25/2010 > patent applications in patent subcategories. patent applications/inventions, industry category
20100044412 - Ball array mask and ball array mask supporting apparatus: A ball array mask includes: a metal mask, which includes through holes into which minute balls are inserted, and which is positioned at a location above an object to be mounted; a hollow frame; a stretchable sheet, edges of the metal mask being affixed to the hollow frame by the... Agent: Drinker Biddle & Reath (dc)
20100044413 - Minute ball array apparatus: A minute ball array apparatus includes: an array jig including insert parts, into which minute balls are to be inserted, and which are formed in a predetermined pattern; a ball moving unit, which comprises a thrust surface, and which moves the thrust surface along an upper surface of the array... Agent: Drinker Biddle & Reath (dc)
20100044414 - Turntable welding system with light curtain protection: A robotic welding system is provided that includes multiple welding cells equidistantly spaced in a circular arrangement, multiple perimeter light curtains to provide safety protection around the welding cells, a turntable centrally located in the circular arrangement, and multiple welding robots attached to the turntable. The welding system further includes... Agent: Rankin, Hill & Clark LLP
20100044415 - Sputtering target assembly and method of making same: A method for producing a sputtering target assembly bonded to a backing plate. The method includes bonding a target (100) to a high strength backing plate (110) and further creating a vacuum seal between the target and the backing plate using friction stir welding processes.... Agent: Wegman, Hessler & Vanderburg
20100044416 - Method of manufacturing electronic components having bump: An electronic component manufacturing method including: a step of mounting a bump formation material on a first wiring substrate 100 to melt the bump formation material to form a bump 200 at the wiring substrate 100; a step of pressing a jig onto the bump 200 to form a recessed... Agent: Young & Thompson
20100044417 - Deconstructable assembly and method: An assembly (10) that can be both joined and parted by temperature processing. A parting member (20) captured between two members of the assembly exhibits a state change as a function of temperature such that the two members can be joined with a meltable joining material (18) at a joining... Agent: Siemens Corporation Intellectual Property Department02/18/2010 > patent applications in patent subcategories. patent applications/inventions, industry category
20100038404 - Apparatus for induction friction solid state welding: An apparatus for induction friction solid state welding a body having a work piece receiving bore. A stationary chuck is provided for securing a first tubular workpiece in the bore. A moving chuck is provided for securing a second tubular workpiece in bore. An induction heating coil is movable between... Agent: Davis & Bujold, P.l.l.c.
20100038405 - Spindle-integrated cooling and collection device for stir friction welder: A friction-stir welding apparatus includes a friction-stir welding tool, a spindle on which the tool is located, bearings supporting the spindle for rotational movement, and a heat sink that is mounted on the spindle between the friction-stir welding tool and the bearings. This arrangement reduces and/or eliminates the need for... Agent: Delphi Technologies, Inc.
20100038406 - Ultrasonic bonding apparatus: An ultrasonic bonding apparatus includes an ultrasonic bonding unit, and a wiping unit configured to wipe out pre-cured underfill that has adhered to a tool surface of a head, by using a wiping member. The ultrasonic bonding unit includes a first driver configured to drive the head to press an... Agent: Westerman, Hattori, Daniels & Adrian, LLP
20100038407 - Methods of hardbanding joints of pipe using friction stir welding: A method for applying a wear reducing material to a tool used in a wellbore operation that includes welding a hardfacing alloy to a surface of the tool, wherein the welding comprises friction stirring the alloy into the tool's surface is disclosed. Methods of welding a preformed sleeve or width... Agent: Osha, Liang LLP / Smith
20100038408 - Methods of treating hardbanded joints of pipe using friction stir processing: A method for treating a wear reducing material welded to a surface of a tool used in a wellbore operation that includes friction stirring the wear reducing material into the surface of the tool is disclosed. Method for improving the properties of a wear reducing material on a tool are... Agent: Osha, Liang LLP / Smith
20100038409 - Joining method for joining components: A method is provided for connecting components particularly in the field of aerospace wherein a first component is connected to a second component, comprising the following steps: arranging at least one nano- or microstructured material between the first and the second component, initiating an exothermic reaction of the nano- or... Agent: Fenwick & West LLP
20100038410 - Securing metallic objects: A method and apparatus are disclosed for securing a first metallic target object to a further metallic target object. The apparatus includes a heating element for heating a bonding interface region between juxtaposed portions of a first and further metallic target object, at least one chamber body portion securable around... Agent: Klarquist Sparkman, LLP
20100038411 - Method of producing conductive circuit board: A conductive circuit board is produced by imparting tackiness to the conductive circuit surface on a printed wiring board, attaching solder powder to the tacky area by supplying a slurry containing solder powder, and then heating the printed wiring board to melt the solder, thereby forming a solder circuit. In... Agent: Sughrue Mion, PLLC
20100038412 - Low-melting boron-free braze alloy compositions: Nickel-based low-melting boron-free braze alloy compositions include varying amounts of the alloying elements cobalt, chromium, hafnium, zirconium together with optionally titanium and aluminum. The braze alloys can be used as a stand alone braze alloy or in combination with other filler alloys to create braze joints with desirable joint geometries... Agent: Ade & Company Inc.02/11/2010 > patent applications in patent subcategories. patent applications/inventions, industry category
20100032471 - Connector between a reaction pipe and a cooling pipe and method for connecting a reaction pipe to a cooling pipe: Connector between a reaction pipe and a cooling pipe and method for connecting a reaction pipe to a cooling pipe. The cooling pipe is a double pipe having an inner pipe, disposed in the extension of the reaction pipe, and an outer pipe that surrounds the inner pipe to form... Agent: Robert W. Becker & Associates
20100032472 - Brazing composition and brazing method for superalloys: A brazing composition for the brazing of superalloys including a base material with at least one initial phase is provided. The initial phase has a solidus temperature that is below the solidus temperature of the base material and, above a certain temperature, forms with the base material and/or with at... Agent: Siemens Corporation Intellectual Property Department02/04/2010 > patent applications in patent subcategories. patent applications/inventions, industry category
20100025453 - Method and device for controlling the generation of ultrasonic wire bonds: A method for generating a wire bond between a wire and an electrical contact member is provided. The method comprising the steps of: pressing a first surface of a portion of the wire against a second surface of the electrical contact member with a first force while vibrating the portion... Agent: Workman Nydegger 1000 Eagle Gate Tower
20100025454 - Solder alloys and process for repairing a component: Many known solder alloys according to prior art utilize silicon or boron as melting point reducers, which, however, form brittle phases that have an undesirable effect on the thermo-mechanical properties. The invention relates to a solder ally that comprises gallium and/or germanium, preferably forms the Y′ phase and has improved... Agent: Siemens Corporation Intellectual Property DepartmentPrevious industry: Elongated-member-driving apparatus
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