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Metal fusion bonding December patent applications/inventions, industry category 12/09

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
  
12/31/2009 > patent applications in patent subcategories. patent applications/inventions, industry category

20090321497 - Linear friction welding apparatus and method: A linear friction welding head apparatus for dual axis forging, the apparatus including three sets of orthogonal actuators for providing X-, Y-, and Z-planes of apparatus movement for providing Y-axis oscillation, a first forge load along a first forge axis, and a second forge load along a second forge axis.... Agent: Adams Intellectual Property Law

20090321498 - Wave soldering tank: The wave soldering tank 1 has a tank body 1a which houses molten solder S, a discharge pump 5 which pumps molten solder S, a discharge nozzle 4 which spouts molten solder S which was sent to it by the discharge pump 5 upwards, a duct 2 having the discharge... Agent: Michael Tobias

20090321499 - Electronic component mounting apparatus and electronic component mounting method: The electronic component mounting apparatus of the present invention has a paste transfer unit 10 that horizontally, relatively moves a squeegee 11b and a transfer surface 13 with respect to each other, thereby spreading, over the transfer surface 13, a paste film 3 whose thickness is equivalent to the height... Agent: Pearne & Gordon LLP

20090321500 - Repair apparatus and repair method: A repair apparatus includes a heating head device configured to heat a soldering member, which is soldered to a circuit board. The heating head device includes a heating head and a contact member heated by the heating head. The contact member is formed of a material having a spring characteristic... Agent: Arent Fox LLP

20090321501 - Method of fabricating wire on wire stitch bonding in a semiconductor device: A low profile semiconductor package is disclosed including at least first and second stacked semiconductor die mounted to a substrate. The first semiconductor die may be electrically coupled to the substrate with a plurality of stitches in a forward ball bonding process. The second semiconductor die may in turn be... Agent: Vierra Magen/sandisk Corporation

  
12/24/2009 > patent applications in patent subcategories. patent applications/inventions, industry category

20090314822 - Method of controlling the trajectory of a bonding tool during the formation of a wire loop: A method of determining a trajectory of an arc motion of a wire used in the formation of a wire loop is provided. The arc motion is between a first point and a second point of the trajectory. The method includes: (1) defining a pivot point with respect to the... Agent: Kulicke And Soffa Industries, Inc.

20090314823 - Method of friction welding: A method of friction welding comprises providing a first workpiece (24) having a first weld surface (38) and a second workpiece (26) having a second weld surface (40). The first workpiece (24) is arranged such that it tapers away from the first weld surface (38), the first workpiece (24) converges... Agent: Oliff & Berridge, PLC

20090314824 - Metal surface treatment method: A metal surface treatment method includes: a shot-peening step of shot-peening a dissimilar metal particle (2) on a surface of a base metal (1), the dissimilar metal particle (2) being a metal particle different from the base metal (1), to provide a dissimilar metal film (3) on the surface of... Agent: Wenderoth, Lind & Ponack, L.L.P.

20090314825 - Method for soldering with a multistep temperature profile: In soldering processes according to prior art, there is often an insufficient tie-up to a substrate of a component. A method in which no voids occur during the soldering processes is provided. A temperature pattern is proposed according to the method in which the temperature is lowered successively during the... Agent: Siemens Corporation Intellectual Property Department

  
12/17/2009 > patent applications in patent subcategories. patent applications/inventions, industry category

20090308910 - Ultrasonic device having exponential horn sleeve portion: An ultrasonic device includes a coupler, a mounting sleeve and an exponential horn form by both the coupler and the mounting sleeve. A flange is located on the mounting sleeve for support at a node of minimum vibratory motion. The mounting sleeve and coupler are formed separately and then metallurgically... Agent: Drinker Biddle & Reath Attn: Intellectual Property Group

20090308911 - Wire bonding capillary tool having multiple outer steps: A bonding tool for bonding a fine wire to a substrate, said bonding tool comprising an at least substantially cylindrical portion having a concentric capillary therein through which the fine wire runs; a working tip portion formed at an end of the cylindrical portion being tapered towards the tip thereof,... Agent: Intellectual Property / Technology Law

20090308912 - Device for the controlled displacement of a spray nozzle to individual spray points, in particular for spraying flux in wave soldering units: The invention relates to a device for the controlled displacement of an upward-directed spray nozzle to individual spray points that are situated a distance apart, in particular for spraying flux in wave soldering units. The spray nozzle is situated axially on a rotary axle rotated by a rotary drive, to... Agent: Houston Eliseeva

20090308913 - Device for use with a friction stir spot welding (fssw) apparatus: A device for use with a welding apparatus, such as a friction stir spot welding (FSSW) apparatus, that maintains work pieces in a generally flat or flush orientation during a welding operation. The device can be mounted to the operable end of an FSSW apparatus so that it exerts a... Agent: General Motors Corporation C/o Reising, Ethington, Barnes, Kisselle, P.C.

20090308914 - Wire bonding method: A wire bonding method that connects a first bonding point and a second bonding point by a wire, the method including a step that press-bonds a ball formed on a tip end of a wire to a first bonding point, thus forming a press-bonded ball; a step that slightly raises... Agent: Quinn Emanuel Koda & Androlia

  
12/10/2009 > patent applications in patent subcategories. patent applications/inventions, industry category

20090302094 - Welding together low and high carbon steels: A weld joins a thin overlay of low carbon steel to a base that contains high carbon steel, at least at its surface along which the weld is formed. The weld may be effected by fusion (melting) or by solid-state diffusion. With either it creates a heat affected zone (HAZ)... Agent: Polster, Lieder, Woodruff & Lucchesi

20090302095 - Techniques for arranging solder balls and forming bumps: A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls are dispensed into the aligned through holes and cavities. Substantially one ball is dispensed into each aligned through hole and cavity,... Agent: Ryan, Mason & Lewis, LLP

20090302096 - Techniques for arranging solder balls and forming bumps: A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls are dispensed into the aligned through holes and cavities. Substantially one ball is dispensed into each aligned through hole and cavity,... Agent: Ryan, Mason & Lewis, LLP

  
12/03/2009 > 6 patent applications in 5 patent subcategories. patent applications/inventions, industry category

20090294511 - Lateral position detection for friction stir systems: A friction stir system for processing at least a first workpiece includes a spindle actuator coupled to a rotary tool comprising a rotating member for contacting and processing the first workpiece. A detection system is provided for obtaining information related to a lateral alignment of the rotating member. The detection... Agent: Darby & Darby P.C.

20090294512 - Member for smoothing flexible belt seams and method for using: An improved member for use in welding seamed flexible belts to produce smoother seams having reduced seam thickness. The improved member has a unique configuration, that includes a ridge defined at an end of the member and further includes a V-shape groove or cut defined in the ridge, which helps... Agent: Pillsbury Winthrop Shaw Pittman, LLP Xerox Corporation

20090294513 - Ultrasonic welding member for smoothing flexible belt seams and method for using: An ultrasonic welding member for use in welding seamed flexible belts to produce smoother seams having reduced seam thickness. The ultrasonic welding member has a unique configuration, that includes an increased tip surface formed in such a manner that more energy from the horn is dispersed over the seam overlap... Agent: Pillsbury Winthrop Shaw Pittman, LLP Xerox Corporation

20090294514 - Friction stir welding improvements for metal matrix composites, ferrous alloys, non-ferrous alloys, and superalloys using a superabrasive tool: A friction stir welding system that enables clamping of a pipe to enable friction stir welding around the pipe OD, a movable mandrel that provides a counter-force to the pressure exerted on the outside of a pipe by a tool, and a system for providing friction stir welding and repair... Agent: Morriss Obryant Compagni, P.C.

20090294515 - Mounting integrated circuit components on substrates: A poly(alkylene carbonate) tack agent may be used to secure an electrical component, such as an integrated circuit, to a substrate for soldering. The tack agent may disintegrate or vaporize at normal reflow temperatures so that no clean up is needed. In some embodiments, flexless soldering may be implemented. If... Agent: Trop, Pruner & Hu, P.C.

20090294516 - Solder ball loading mask, apparatus and associated methodology: A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

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