Metal fusion bonding inventions 09/09

20090236402 - Soldering machine comprising a soldering module and at least one soldering station that is mobile and exchangeable insertable into the soldering module: A soldering machine for soldering components which are mounted on a circuit board contains a soldering module and comprises at least one soldering station which is mobile and exchangeably insertable in the soldering module. The soldering station and the soldering module are equipped with means for mutual alignment and with... Agent: Nixon Peabody LLP

20090236403 - Multiple pass and multiple layer friction stir welding and material enhancement processes: Processes for friction stir welding, typically for comparatively thick plate materials using multiple passes and multiple layers of a friction stir welding tool. In some embodiments a first portion of a fabrication preform and a second portion of the fabrication preform are placed adjacent to each other to form a... Agent: Ornl-utb-luedeka, Neely & Graham

20090236404 - Pasty silver particle composition, process for producing solid silver, solid silver, joining method, and process for producing printed wiring board: [PROBLEMS] To provide a pasty silver particle composition, which, upon heating, allows silver particles to be easily sintered to form solid silver possessing excellent strength, electric conductivity and thermal conductivity, and a production process of solid silver and the like. [MEANS FOR SOLVING PROBLEMS] A pasty silver particle composition comprising... Agent: Knobbe Martens Olson & Bear LLP

20090236405 - Method for making backlight module frame: An exemplary method for making backlight module frame includes: providing a plurality of metallic sheets cooperatively defining a frame shape, and a positioning device comprising a worktable and a plurality of positioning portions defined at corners of the worktable, wherein each metallic sheet comprises a first positioning protrusion corresponding to... Agent: PCe Industry, Inc. Att. Steven Reiss

20090236406 - Method of electrically connecting a microelectronic component: A method of treating a component can include providing a component including a plurality of metallic posts extending generally parallel to one another. The providing step can be performed so that the posts have solder on the tips of the posts but not covering other portions of the posts. The... Agent: Tessera Lerner David Et Al.

20090230171 - Device for mounting electric component: A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of... Agent: K&l Gates LLP

20090230172 - Method of bonding: The present invention provides a bonding method in which a bonded portion having a sufficient bonding strength can be obtained at a relatively low temperature, for example, in die bonding a semiconductor chip. A metal paste 20 was applied to a semiconductor chip 10, the metal paste 20 consisting of... Agent: Roberts & Roberts, LLP Attorneys At Law

20090230173 - Advanced multi-shouldered fixed bobbin tools for simultaneous friction stir welding of multiple parallel walls between parts: The present invention discloses a multi-shouldered friction stir welding tool. The multi-shouldered friction stir welding tool comprises an integral shank-pin unit having a plurality of pin portions on the shank-pin unit, where the plurality of pin portions for driving into a plurality of joints to perform a friction stir welding... Agent: Intellectual Property

20090230174 - Self-assembly of elements using microfluidic traps: A self-assembly process is disclosed for integrating free standing microcomponents onto a template having a plurality of binding sites, an interconnect network, and trapping structures disposed downstream of the binding sites. The self-assembly is accomplished by flowing a fluid medium containing the microcomponents over the template such that some of... Agent: Christensen, O'connor, Johnson, Kindness, PLLC

20090230175 - Flux for soldering and method for manufacturing an electronic device using the same: A flux for soldering of the present invention, in connecting a mounting pad exposed on a board to a solder ball, is applied onto at least one of a surface of the mounting pad and the solder ball. The flux for soldering contains a solvent, and the solvent contains a... Agent: Mcginn Intellectual Property Law Group, PLLC

20090230176 - Joining jig and method for manufacturing a bonded body of different members by using the jig: A joining jig 5 is constituted of a pair of flat-plate sandwiching portions 17, 18 including sandwiching faces 15 which sandwich therebetween a platy member laminate 4 prepared by laminating two platy members 2, 3 with providing a solder on a joined face between the platy members. The joining jig... Agent: Oliff & Berridge, PLC

20090224024 - Friction welding methods and friction welding apparatuses: One aspect of the present invention can include a friction welding method having a friction step for generating a friction heat by pressing the pair of works while relatively rotating the pair of works, and an upset step started before generating an approach margin at the pair of works at... Agent: Locke Lord Bissell & Liddell LLP Attn:IPDocketing

20090224025 - Branch connection stub, a branch connection device comprising a main pipe and said branch connection stub, and a method of connecting such a branch connection stub by welding: The invention relates to a branch connection stub for connection to a main pipe. The branch connection stub presents an outside surface of revolution and has at least one axial internal passage, a rear segment with a fastener flange, an intermediate segment, and a front segment having a free end... Agent: Weingarten, Schurgin, Gagnebin & Lebovici LLP

20090224026 - Electronic component mounting method: An electronic component mounting method that is to mount on a board 3 an electronic component 11 formed with solder bumps 16 on a lower surface thereof Solder paste 19 is printed onto the electrodes 3a of the board 3 and further provided onto the solder bumps 16 by transfer.... Agent: Pearne & Gordon LLP

20090224027 - Method for diffusion bonding metallic components with nanoparticle foil: A method for joining metal parts of a turbine engine component, the method comprising positioning a nanoparticle foil between faying surfaces of the metal parts, and diffusion bonding the metal with the nanoparticle foil, where the nanoparticle foil has a film thickness of about 100 micrometers or less, and comprises... Agent: Kinney & Lange, P.A.

20090224028 - Selective soldering apparatus with jet wave solder jet and nitrogen preheat: Solder is pumped through a nozzle to produce a jet of solder and leads on a printed circuit board are passed through the jet to solder them to the board tracks. The nozzle is mounted on a flange held between slip rings so that the nozzle can be rotated to... Agent: Dickstein Shapiro LLP

20090218385 - Wire bonder: A wire bonder comprises a bonding head with a rocker which is arranged on the bonding head and is rotatable about a horizontal axis. The rocker comprises at least three bores into which a piezoelectric element each is inserted, which element is used either as a sensor or as a... Agent: Mccormick, Paulding & Huber LLP

20090218386 - Soldering method, soldering apparatus and method for manufacturing semiconductor device: An object-to-be-soldered (92) is accommodated in a sealable chamber (17). An internal pressure (P) of the chamber (17) is raised to a normal pressure (Po) or higher by feeding a reducing gas to the chamber (17). A soldering of a semiconductor element (12) with respect to a circuit board (11)... Agent: Locke Lord Bissell & Liddell LLP Attn:IPDocketing

20090218387 - Method of soldering portions plated by electroless ni plating: When electrodes of a BGA plated by electroless Ni plating are soldered with solder balls of a lead-free solder, peeling of soldered joints readily takes place under an external impact. When a BGA electrode plated by electroless Ni plating is soldered with a lead-free solder to which 0.03-0.1 mass percent... Agent: Michael Tobias