Metal fusion bonding inventions 07/09

20090188966 - Ultrasonic press using servo motor with delayed motion: An ultrasonic welding method includes the acts of pressing an ultrasonic welding stack mounted for linear movement against a first workpiece using an electrical servo motor, applying a predetermined initial load to the first workpiece, and initiating a weld, the initiating of the weld comprising outputting energy from the ultrasonic... Agent: Nixon Peabody, LLP

20090188967 - Vapor-operated soldering system and vapor generation system for a soldering system: A method is provided for a soldering process. The method can include receiving a liquid phase heat transfer medium at a preheating container. The heat transfer medium can be received from an external supply. The method can also include heating the heat transfer medium to or above a predefined temperature... Agent: Sterne, Kessler, Goldstein & Fox P.l.l.c.

20090188968 - Friction stir welding process: The invention relates to a process for the friction stir welding of two panels (20, 21), using a welding device (25) having a retractable pin (29), comprising the following steps: positioning the two panels (20, 21) so as to be in contact over an overlap region (24) and keeping them... Agent: Young & Thompson

20090188969 - Weld metal material apparatus and method: A solid weld-metal-producing material is formed by agglomerating weld metal material powder. An igniter may be integrally formed in or on the agglomerated weld metal material. In addition to typical components of a weld metal material mixture, such as a reductant metal and a transition metal oxide, the agglomerated weld... Agent: Jonathan A. Platt Renner, Otto, Boisselle & Sklar, LLP

20090184152 - Soldering method, semiconductor module manufacturing method, and soldering apparatus: A soldering method for soldering an electronic component onto a circuit board is provided. The soldering method uses a cooling circuit board as the circuit board. The cooling circuit board includes an insulation substrate and a metal heat sink. The insulation substrate has a front surface with a metal circuit... Agent: Locke Lord Bissell & Liddell LLP Attn:IPDocketing

20090184153 - Method of producing a welded joint: A method of producing a welded joint between components of a turbomachine is described, in particular for the repair of components, wherein components are welded to one another along common edges in such a way that a pocket-like recess is incorporated in a first component, in particular in a replacement... Agent: Davidson, Davidson & Kappel, LLC

20090184154 - Method for the strengthening of a welded connexion and/or for the increase of tolerance of a welded connexion in relation to fatigue load, element for a tower of a wind turbine, tower of a wind turbine and wind turbine: A method for the strengthening of a welded connexion, an element for a tower of a wind turbine, a tower of a wind turbine, and a wind turbine having a welded connexion with modified geometry are provided. The weld seam and/or for the increase of tolerance of a welded connexion... Agent: Siemens Corporation Intellectual Property Department

20090184155 - Pcb mounting method: Provided is a method for mounting a Printed Circuit Board (PCB). The method includes providing a solder cream on a predetermined region of a bottom surface of the PCB except for a region requiring insulation, mounting the PCB on a mounting region of a housing on which the PCB is... Agent: Storm LLP

20090184156 - Process for producing semiconductor device and apparatus therefor: A process for producing a semiconductor device, includes: first melting by heating only a superior portion of a bump formed on an electrode on one principle surface of a semiconductor substrate; and second melting the entire bump by also heating an inferior portion of the bump.... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20090179064 - System and method for restoring metal components: A system for restoring a metal component with a brazing alloy, the system comprising an induction coil configured to extend around a portion of the metal component and at least a portion of the brazing alloy, a motion assembly configured to cause relative movement between the metal component and the... Agent: Kinney & Lange, P.A.

20090179065 - Friction plug welding methods and systems: Friction plug welding methods and systems plug a hole extending through a component part from front and back faces thereof. A sacrificial plate having an opening therethrough may be positioned against the back face of the component part with assistance from a restraint part (which is also preferably provided with... Agent: Nixon & Vanderhye, PC

20090179066 - Container and exposure apparatus having the same: A method of forming a container having a lid and a container body which define an inside space, and a material containing an organic compound provided in the inside space. The method includes forming a groove and a communication member for communicating the groove with an outside space, in at... Agent: Fitzpatrick Cella Harper & Scinto

20090179067 - Selective soldering system: A solder machine includes a top flat carrier that holds PWBs just above a solder bath. Opposed edges of the carrier are coupled to a frame and each edge can be independently raised or lowered by a respective piston. Also, the base of the frame can pivot along one of... Agent: Rogitz & Associates

20090173768 - Apparatus for manufacturing sealed flux laminated alloy filler metal: Disclosed therein is a filler metal (90) used as a bonding material in bonding technology by brazing and soldering and an apparatus for manufacturing the same. A flux cored alloy filler metal 200 according to a prior art has a problem in that a flux is leaked through a joint... Agent: Saliwanchik Lloyd & Saliwanchik A Professional Association

20090173769 - Welding of single crystal alloys: A blade member is oscillated in the direction of arrow A-A relative to a rim of a disc; a forge force is applied radially and a weld is formed along line; the blade member is formed from a face centred cubic (FCC) nickel based single crystal alloy, such as CMSX-4... Agent: Oliff & Berridge, PLC

20090173770 - Lead-free solder alloy and electoronic component using this lead-free solder alloy: Solder attachment of connecting portions of insulation coated conductors having copper as a base material is carried out by melting lead-free solder alloy containing from 5.3 to 7.0 wt % copper (Cu), from 0.1 to less than 0.5 wt % nickel (Ni), with a remainder being tin (Sn), at a... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20090173771 - Method and device for heat treatment, especially connection by soldering: The present invention relates to a method and device (10) for the temperature treatment of workpieces (19) or components, in particular for producing a solder connection between a solder material and at least one component or workpiece used as a solder material carrier by means of melting the solder material... Agent: Intellectual Property Group Fredrikson & Byron, P.A.

20090166395 - Method of joining metal material: Metal materials made of iron (Fe) or the like are butted together at a joint, and a probe of a rotary tool is inserted into the joint. The rotary tool is rotated while being moved in the lengthwise direction of the joint, whereby the metallographic structure of the joint is... Agent: Osha Liang L.L.P.

20090166396 - Microball attachment using self-assembly for substrate bumping: Electronic devices and methods for fabricating electronic devices are described. One method includes providing a substrate with a plurality of bonding pads thereon, and providing a plurality of solder microballs, the microballs including a coating thereon. The method also includes flowing the solder microballs onto the substrate and positioning the... Agent: Konrad Raynes & Victor, LLP. Attn: Int77

20090166397 - Bga package module desoldering apparatus and method: A BGA package module desoldering apparatus for detaching a chip module from a circuit board is disclosed to include a heat source for heating the chip module, and radiators each having a tank and a refrigerant received in the tank for attaching to the circuit devices of the circuit board... Agent: Browdy And Neimark, P.l.l.c. 624 Ninth Street, Nw

20090166398 - Soldering apparatus and soldering method: A soldering apparatus has a conveyor which conveys an electronic circuit board, a fluxer which applies a flux having water as a solvent to a surface of the electronic circuit board to be soldered, a first heating device which heats the electronic circuit board, a water removal device which removes... Agent: Ratnerprestia

20090166399 - Laminar flow well: It has been observed that turbulent solder flow, particularly at the opening of a conventional flow well, correlates to a greater degree of Cu dissolution of the PTH barrels of a PCB, especially those that are aligned with the opening. A more laminar solder flow is created to more evenly... Agent: Blake, Cassels & Graydon LLP