Metal fusion bonding inventions 06/09

20090159639 - Friction stir spot joining device: There is provided a friction stir spot joining device wherein stirring-related members are unitized to form a unitized stirring unit and an opening is formed in a friction stir spot joining device body for housing the unitized stirring unit therein. A stirring motor, a stirring shaft and a power transmission... Agent: Flynn Thiel Boutell & Tanis, P.C.

20090159640 - Wave soldering apparatus: A wave soldering apparatus includes: two parallel tracks; a soldering bath defining a wave soldering region between the tracks for soldering circuit boards passing therethrough; a conveying unit including two belts that are movably and respectively mounted on the tracks, and a plurality of clamping members mounted on the belts;... Agent: Davidson Berquist Jackson & Gowdey LLP

20090159641 - Forming solder balls on substrates: A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask... Agent: Fish & Associates, PC Robert D. Fish

20090159642 - Process of brazing/soldering by flame of metallic and non-metallic materials: The invention refers to the flame soldering/brazing procedure of metallic and nonmetallic materials, used in industrial operations without releasing of noxious gases emissions. The soldering/brazing procedure according to the invention is achieved totally eliminating the noxious gases emissions, reducing the energy consumption for the soldering/brazing operation, and improving the quality... Agent: Dennis G. Lapointe Lapointe Law Group, Pl

20090159643 - Method for joining tube plates and tubes as well as friction tool to carry out the method: The invention relates to a method for the joining of tube plates (10) and tubes (11) in a tube bundle heat transfer device with the help of a rotating friction tool. Here, the friction tool is rotatingly moved into the open end of a tube (11) surrounded by the tube... Agent: Millen, White, Zelano & Branigan, P.C.

20090159644 - Mold and method of manufacturing the same: A mold welded with a dissimilar metal member manufactured by pressingly bringing the dissimilar metal member into contact with a mold formed of copper or a copper alloy in a stationary state while rotating the dissimilar metal member at a high speed, stopping the dissimilar metal member, and providing a... Agent: Wenderoth, Lind & Ponack, L.L.P.

20090159645 - Brazing alloy compositions and methods: Various braze alloy compositions are described, along with methods for using them. In one instance, a boron-free, high-temperature braze alloy includes selected amounts of chromium, hafnium, and nickel. The braze alloy can be used, for example, as a component in a wide gap braze mixture where a higher or lower... Agent: General Electric Company Global Research

20090159646 - Conductive ball removing method, conductive ball mounting method, conductive ball removing apparatus, and conductive ball mounting apparatus: In a method of removing conductive balls that are left on a mask provided on a substrate having pads thereon, the method includes: (a) making a sheet member close to the mask using a contacting mechanism such that a gap between the sheet member and the mask is set small... Agent: Rankin, Hill & Clark LLP

20090159647 - Method for bonding glassy metals: A method for bonding two glassy metal pieces, includes: (a) disposing the glassy metal pieces in an environment such that the surrounding of the glassy metal pieces is heated to a working temperature within a common supercooled liquid region of the glassy metal pieces; and (b) pressing one of the... Agent: Ohlandt, Greeley, Ruggiero & Perle, LLP

20090159648 - Device and method for brazing a heat pipe: The present invention relates to a device and method for brazing a heat pipe assembly with copper-silver alloy filler rings to improve heat dissipation efficiency of a heat pipe. The device comprises a brazing furnace and a conveyor. The brazing furnace comprises an open ended passage with a multi-stage brazing... Agent: Hogan & Hartson LLPIPGroup, Columbia Square

20090159649 - Soldering method: Embodiments of the present invention provide a soldering method capable of satisfactorily melting a solder without damaging a workpiece be soldered. One embodiment of a soldering method removes component waves of predetermined wavelengths from a light beam emitted by a light source and melts a solder by irradiating the solder... Agent: Townsend And Townsend And Crew LLP

20090159651 - Conductive ball mounting method and surplus ball removing apparatus: A conductive ball mounting method of the present invention, includes a step of, arranging a mask in which an opening portion is provided, on a substrate including a connection pad, arranging a conductive ball on the connection pad through the opening portion of the mask by supplying the conductive ball... Agent: Kratz, Quintos & Hanson, LLP

20090159650 - Semiconductor device and automotive ac generator: A semiconductor device includes a semiconductor element, a support member bonded to a first surface of the semiconductor element with a first bonding material and a lead electrode bonded to a second surface of the semiconductor element supported on the support member with a second bonding material, and further including... Agent: Antonelli, Terry, Stout & Kraus, LLP

20090152325 - Method for consolidating and sealing a tube: P

20090152326 - Ultrasonic welding-based microfluidic device and method of manufacturing the same: A method of manufacturing an ultrasonic welding-based microfluidic device, the method including: forming a bottom board having two welding stoppers formed right and left and having a certain height and a certain interval; forming a top board having two energy directors formed with an interval greater than the interval between... Agent: Ampacc Law Group

20090152327 - Wire bonding method: According to an aspect of an embodiment, a wire bonding method includes vibrating a capillary of a bonding head, the capillary having a heater attached thereto at a position corresponding to a node of vibration of the capillary generated by the vibration heating the capillary with the heater and performing... Agent: Fujitsu Patent Center C/o Cpa Global

20090152328 - Apparatus for friction stir and friction stir processing: An apparatus for a friction stir and a friction stir processing of the present invention suppress an occurrence of a surface defect in an area processed by the friction stir. The apparatus for the friction stir includes a tool having a columnar tip-side part, a rotating unit for rotating the... Agent: Antonelli, Terry, Stout & Kraus, LLP

20090152329 - Method and apparatus for mounting at least two types of electronic components: Provided is a method and apparatus for mounting a plurality of electronic components. The method comprises mounting a first electronic component on a substrate; forming a mask on the substrate to expose the first electronic component and a region of the substrate on which a solder paste is to be... Agent: Drinker Biddle & Reath LLP Attn: Patent Docket Dept.

20090152330 - Dental material for attaching a cast metal structure to a metal coping in the preparation or repair of a dental restoration: A dental material composition for attaching a metal structure to a dental coping in the preparation or repair of a dental restoration which includes a component of high-fusing temperature metal particles in a range of between 1-10 weight percent, a component of low fusing temperature metal particles having a melting... Agent: Eugene Lieberstein

20090152331 - Solder pastes comprising nonresinous fluxes: According to the invention, a resin-free solder paste made from a metal powder, particularly soft solder and a gel, is prepared, wherein the gel according to the invention leaves no residue on the metal surface during the remelting of the metal powder. The gel according to the invention is based... Agent: Panitch Schwarze Belisario & Nadel LLP

20090145948 - Device and method for joining the faces of parts: Device for joining faces of parts having great longitudinal extension by friction welding. The device includes first and second clamping arrangements structured and arranged to position ends of the parts against one another. At least one of the first and second clamping arrangements is axially movable with respect to another... Agent: Greenblum & Bernstein, P.L.C

20090145949 - Attaching construction and welding method: An attaching construction includes a first member having a circular tubular welding portion at a distal end and, at a rear end thereof, a holding portion which is integral with the welding portion. The attaching construction includes a second member having an annular first positioning rib, and an annular second... Agent: Osha Liang L.L.P.

20090145950 - Dispensing solder for mounting semiconductor chips: A method for mounting a semiconductor chip onto a substrate comprises the steps of positioning a solder dispenser over the substrate and passing a length of solder wire through the solder dispenser to the substrate. The feeding of the wire to the substrate in a feeding direction is controlled with... Agent: Ostrolenk Faber Gerb & Soffen

20090140026 - Method and apparatus for inspecting joined object formed by friction stir joining: This invention provides a method for inspecting a joined region and joining strength of a joined object formed by a spot friction stir joining process. In this method, an ultrasonic wave is introduced into the joined object from a backing face 25 opposed to a joining tool plunging face 24... Agent: Oliff & Berridge, PLC

20090140027 - Friction stir spot welding tool and method: The proposed triangular pin tool is found to significantly increase the weld strength when compared to conventional pin shaped tools due to the following: (1) it inhibits the formation of the vertical hook in the stir zone (the upward rise of the hook is arrested when the pin plunges into... Agent: Gifford, Krass, Sprinkle,anderson & Citkowski, P.c

20090140028 - Soldering tip, soldering iron, and soldering system: A soldering system for melting a solder to form a joint between a first workpiece and a second workpiece is described. The system may comprise an energy generating system, a soldering tip, and a dispenser adapted to dispense controlled amounts of the solder. The soldering tip includes a non-wetting solder... Agent: Wood, Herron & Evans, LLP (nordson)

20090140029 - Method and device for wire bonding: The invention provides a device for wire bonding with a copper-containing bonding wire for connecting a component to a support, wherein provision is made on the component as well as on the support for at least one bond pad, encompassing a guide for the bonding wire and a device for... Agent: The Boc Group, Inc.

20090140030 - Braze formulations and processes for making and using: A braze formulation for superalloys including nickel, chromium, optionally, cobalt, optionally, aluminum, optionally, boron, hafnium and tantalum, said braze formulation having a solidus temperature of no greater than about 1180° C. and a liquidus temperature of no greater than about 1250° C. Methods for brazing are also provided. The brazing... Agent: General Electric Company Ge Global Patent Operation