Metal fusion bonding inventions 05/09

20090134201 - Work clamp and wire bonding apparatus: A work clamp and a wire bonding apparatus that can sufficiently restrain oxidation of a bonding area even while reducing a use amount of antioxidant gas are provided. The work clamp according to the present invention includes an interior hollow portion 10 providing an atmosphere of the antioxidant gas, a... Agent: Wenderoth, Lind & Ponack, L.L.P.

20090134202 - Reflow apparatus and method: Provided are a reflow apparatus and method. The reflow apparatus includes a loader unit, a heating unit, an unloader unit, and a moving unit. The loader unit has an input module and an input stacker. Processing objects are stored in vertical stacks in magazines, and a plurality of magazines is... Agent: Marger Johnson & Mccollom, P.C.

20090134203 - Methods and apparatus for forming tubular strings: An embodiment of a method for interconnecting tubular sections includes the steps of vertically positioning a second tubular above a first tubular forming a seam defined by a bottom end of the second tubular and a top end of the first tubular; positioning a friction stir welder (FSW) proximate to... Agent: Winstead PC (fcc-fki) Henry L. Ehrlich

20090134204 - Soldering method and semiconductor module manufacturing method: A soldering method for soldering a semiconductor element to each of bonding portions defined at a plurality of locations on a circuit board is disclosed. The soldering method includes laying out the bonding portions in a non-linear manner in at least three locations on the circuit board, placing the semiconductor... Agent: Morgan & Finnegan Transition Team C/o Locke Lord Bissell & Liddell

20090134205 - Soldering method, method for manufacturing semiconductor module, and soldering apparatus: A soldering method for soldering an electronic component to a circuit board is disclosed. The soldering method includes placing the electronic component on the bonding portion of the circuit board with solder arranged between the electronic component and the bonding portion, placing a weight on the electronic component, and heating... Agent: Morgan & Finnegan Transition Team C/o Locke Lord Bissell & Liddell

20090134206 - Process and paste for contacting metal surfaces: For production of an electrically conductive or thermally conductive connection for contacting two elements, an elemental metal, in particular silver, is formed from a metal compound, in particular a silver compound, between the contact surfaces. In this production, the processing temperature for the use of a silver solder can be... Agent: Panitch Schwarze Belisario & Nadel LLP

20090134207 - Solder ball attachment ring and method of use: A method of attaching a solder ball to a bonding pad includes disposing flux on the bonding pad, attaching a conductive metal ring to the pad using the flux, and placing the solder ball in the ring. A reflow operation is performed that secures the ring to the pad and... Agent: Freescale Semiconductor, Inc. Law Department

20090127314 - In-line package apparatuses and methods: An in-line package apparatus includes a first treating unit, an input storage unit, a heating unit and an output storage unit. The first treating unit performs a ball attach process or a chip mount process. A processing object that a process is completed in the first treating unit is received... Agent: Stanzione & Kim, LLP

20090127315 - Apparatus and method for manufacturing semiconductor device: An apparatus for manufacturing a semiconductor device is provided. The apparatus has a bonding head, a stage, and a system for appropriately setting the amount of a descending movement of the bonding head. The bonding head incorporates a heater. A camera is capable of capturing an image of a gap... Agent: Mcdermott Will & Emery LLP

20090127316 - Apparatus and method for producing a bonding connection: One aspect relates to a method for producing a bonding connection by means of a bonding apparatus having a heel shaper and a bonding stamp. The heel shaper is situated relative to the bonding stamp in a first active position or can be moved into such a first active position.... Agent: Dicke, Billig & Czaja

20090127317 - Device and method for producing a bonding connection: e

20090127318 - Method for manufacturing a printing form and printing form with thermally insulating layer: Reusable printing forms and thermal image setting on the printing forms is optimized in terms of performance. A method for manufacturing the printing form, in particular a rewritable printing form, having a thermally insulating layer, is distinguished by the fact that the thermally insulating layer is produced by the configuration... Agent: Lerner Greenberg Stemer LLP

20090127319 - Method for soldering magnesium alloy workpiece: A method for soldering a magnesium alloy workpiece is provided. The method includes providing a magnesium alloy workpiece; modifying a surface of the magnesium alloy workpiece; performing a high phosphorous (7 to 12 wt % of P) electroless nickel plating process on the surface of the magnesium alloy workpiece; preparing... Agent: Birch Stewart Kolasch & Birch

20090127320 - Refrigeration purging adaptor: An adapter configured to enable a user to quickly and easily couple a fluid supply source to a pipe extending from a system to be brazed without requiring any modification or marring to the pipe. The adapter forming a substantially air-tight seal without requiring any bonding or adhesives. In one... Agent: Hughes Law Firm, PLLC

20090127321 - Electronic assembly remanufacturing system and method: A method for remanufacturing an electronic assembly includes removing a first portion of an assembly housing to expose an underside of an enclosed circuit assembly. One or more solder joints on the underside of the circuit assembly are associated with at least one component that is also affixed to a... Agent: Leydig, Voit & Mayer, Ltd

20090120995 - Friction stir weld tools, methods of manufacturing such tools, and methods of thin sheet bonding using such tools: Friction stir weld tools configured to bond or laminate thin sheets. Friction stir weld tools have a first shoulder, a pin extending from a friction surface of the first shoulder, and a second shoulder. In some embodiments, the second shoulder is secured at least partially around the first shoulder and... Agent: Traskbritt / Battelle Energy Alliance, LLC

20090120996 - Solder ball mounting decive: A solder ball mounting device that can mount minute solder balls with a diameter of 200 μm or less onto a connection pad. The solder ball mounting device can mount solder balls to be solder bumps on a printed circuit board using a mask having a plurality of openings corresponding... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090120997 - Saturable absorber component and method for manufacturing a saturable absorber component: s

20090120998 - Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components: A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact... Agent: Wenderoth, Lind & Ponack L.L.P.

20090120999 - High tin solder etching solution: A method is provided for the removal of tin or tin alloys from substrates such as the removal of residual tin solder from the molds used in the making of interconnect solder bumps on a wafer or other electronic device. The method is particularly useful for the well-known C4NP interconnect... Agent: Law Office Of Delio & Peterson, LLC.

20090114702 - Device for centering and clamping tubular parts: The invention concerns a device for centering and clamping tubular parts such as conduits designed to form pipeline pipes of the type consisting of an elongated cylinder (1) comprising in particular clamping means, such as at least clamping shoes (2) arranged over its entire periphery and adapted to be radially... Agent: Trego, Hines & Ladenheim, PLLC

20090114703 - Method and device for producing a longitudinally welded hollow profile: A method for producing a longitudinally welded hollow profile from a sheet metal blank having defined longitudinal edges, in which the sheet metal blank is initially preformed into an open seam profile with the aid of at least two tool parts allows for the economical production of accurately formed hollow... Agent: Proskauer Rose LLP