Metal fusion bonding inventions 04/09

20090108050 - Friction stirring-joining method and method of manufaturing hollow body: A base 1 having a recess 2, and a cover 3 to be fitted into the recess 2 and to close an opening of the recess 2 are prepared. A stepped portion 4 is formed on the inner circumferential surface of the recess 2 at an intermediate depth for allowing... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090108051 - Method for joining components: A method for joining components is described, in particular, for joining a rotor blade to a rotor base member when manufacturing and/or repairing an integrally bladed gas turbine rotor. The method includes the following steps: providing two components to be assembled, respectively joined to one another; providing a joining part;... Agent: Davidson, Davidson & Kappel, LLC

20090108052 - Selective soldering using fiber optic device: A fiber optic device for enabling soldering is described. The fiber optic device includes an entry portion comprising an optical fiber bundle for receiving a single light beam wherein the optical fiber bundle splits the light beam into a plurality of separate portions, each of the separate portions for enabling... Agent: Hitachi C/o Wagner Blecher LLP

20090108053 - Solder ball placement vacuum tool: The invention provides apparatus, systems, and methods for positioning solder balls in a desired arrangement on a surface. In preferred embodiments of the invention, a vacuum head body is configured to direct a vacuum force through a vacuum chamber wherein a permeable vacuum plate encloses the vacuum chamber. A stencil... Agent: Texas Instruments Incorporated

20090101695 - Gold alloy wire for bonding wire having high initial bondability, high bonding reliability, high roundness of compression ball, high straightness, and high resin flowability resistance: There is provided a gold alloy wire for a bonding wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, and high resin flowability resistance. The gold alloy wire for a bonding wire comprises one kind or two kinds of Pt and Pd... Agent: Darby & Darby P.C.

20090095793 - Selective soldering apparatus with multiple pumps and thimble plate and nitrogen cooled pump bearing assembly: A soldering apparatus comprises a solder bath, a body positioned in the bath and having a plurality of main conduits for feeding solder from a solder pump to a nozzle or thimble. Each conduit communicates with a pump chamber and a conduit in a thimble plate on which the thimbles... Agent: Dickstein Shapiro LLP

20090095794 - Welding system: The present invention relates to a welding system. The welding system comprises: a fixing jig for securely fixing any one of a plurality of to-be-welded objects; a movable jig for moving another of the plurality of to-be-welded objects a movable block for horizontally moving the movable jig; a block driving... Agent: Edwards Angell Palmer & Dodge LLP

20090095795 - Tool assembly used with friction stir welding: A tool assembly which is particularly suitable for friction stir welding applications. The tool assembly includes a holder having an axis and one end adapted to be rotatably driven by a rotary drive mechanism about the holder axis. A tool having an axis is also provided and includes a tool... Agent: Gifford, Krass, Sprinkle,anderson & Citkowski, P.c

20090095796 - Wire wrapped pressure vessels: A pressure vessel (2) for the storage of fluid has a core (10) made of metal or polymer and is wrapped either completely or partially from outside with a high strength fibers (21, 22) for reinforcement wherein one of the reinforcing fibers is a metal wire (21) of a single... Agent: David L. King, Sr.

20090095797 - Clamping device for vehicle body transfer cart: The present invention provides a clamping device for a vehicle body transfer cart, in which a rotation unit for rotating a cart unit, an air supply unit for supplying air to the cart unit, and an electrical signal unit for transmitting an electric signal to the cart unit are installed... Agent: Edwards Angell Palmer & Dodge LLP

20090090767 - Method and system for restoring parent metal properties across welds: A method, with an associated system, for providing a cast component comprises annealing heat treatment to reduce casting stresses; initial machining the cast component; initial nondestructive testing (NDT) the machined cast component to identify NDT indications in the cast component; treating and removing NDT indications from the machined cast component;... Agent: Ge Energy General Electric C/o Ernest G. Cusick

20090084827 - Solder ball loading method and solder ball loading unit: A solder ball loading unit for loading a solder balls to be turned to a solder bumps on a connection pad of a printed wiring board, including a ball arranging mask having a plurality of openings corresponding to the connection pad of the printed wiring board, a cylinder member located... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090084828 - Apparatus for the connection of strips: The invention relates to an apparatus and a method for clamping, cutting, and joining strips to a continuous strip. Said device comprises a clamping device (125), a cutting device (155), and a joining device (195). The clamping device, cutting device, and joining device are kinematically coupled to each other.... Agent: Friedrich Kueffner

20090084829 - Magnetic plug weld tool: A magnetic based welding tool having an adjustment knob, a pivot arm, and a copper alloy pad, designed to assist with welding holes, for example, in sheet metal, that are to be welded closed with a MIG or TIG welder, by providing a backup to the hole, to keep the... Agent: Marc E. Hankin, Esq.

20090084830 - Tool assembly heat treatment method: A method of welding connection is directed towards the construction and subsequent heat treatment of industrial grade manual tools and, specifically, their tool heads to handles or handle attachment connections. The method employs the use of matching, non-heat treated, compatible material such as steel alloys, for the tool heads and... Agent: Hollstein Keating Cattell Johnson & Goldstein P.C. Willow Ridge Executive Office Park

20090084831 - Soldering method and apparatus for mounting devices on printed circuit board: In a case of soldering for mounting a device on a printed circuit board, a printed circuit board to which a device is soldered is heated in a high oxygen concentration atmosphere to form oxide films on surfaces of joints, by which detachment of a device soldered onto the surface... Agent: Kratz, Quintos & Hanson, LLP