Metal fusion bonding inventions 03/09

20090078740 - Wirebonder forming low profile wire bonds between integrated circuits dies and printed circuit boards: A wirebonder for electrically connecting an integrated circuit die with conductors on a printed circuit board. The wirebonder has a bonding tool for attaching wire bonds from the integrated circuit die to the conductors of the printed circuit board and a wire engaging structure for deforming the wire bonds such... Agent: Silverbrook Research Pty Ltd

20090078741 - Method of manufacturing vehicle body and welding facility: A method is disclosed for manufacturing a plurality of vehicle bodies having different vehicle types using the same manufacturing line. In the method, when a frame member assembly and a panel member assembly of the vehicle body are to be joined, the frame member assembly and the panel member assembly... Agent: Carrier Blackman And Associates

20090078742 - Method and a device for inspecting a pipe connection weld by an ultrasound probe: A method of inspecting a substantially circular circumferential weld for connecting together an inner pipe and a coaxial outer pipe, either directly or via a junction forging, by using an ultrasound probe having a plurality of robotic multibeam piezoelectric emitter-receivers. The method is performed by: a) positioning at least one... Agent: Cohen, Pontani, Lieberman & Pavane LLP

20090078743 - Wire bonding system utilizing multiple positioning tables: A wire bonding apparatus and method in which separate first and second positioning tables are provided for mounting electronic devices to be wire bonded, and a bonding tool is provided at a bonding position for bonding the electronic devices. First and second loading/unloading positions are provided for loading electronic devices... Agent: Ostrolenk Faber Gerb & Soffen

20090078744 - Method of forming low profile wire bonds between integrated circuits dies and printed circuit boards: A method of profiling a series of wire bonds between a line of contact pads on a die, and a corresponding set of conductors on a supporting structure, by electrically connecting each of the contact pads on the die to a corresponding conductor on the supporting structure with a respective... Agent: Silverbrook Research Pty Ltd

20090078745 - Method for forming interconnects: A method for forming interconnects between a component and a substrate. The method comprises determining at least one location of differential flexing between a component and a substrate during drop impact; and forming a plurality of solder joints on at least one of the component and the substrate. A first... Agent: Dickstein Shapiro LLP

20090078746 - Bump forming method and bump forming apparatus: A method for forming bumps 19 on electrodes 32 of a wiring board 31 includes the steps of: (a) supplying a fluid 14 containing conductive particles 16 and a gas bubble generating agent onto a first region 17 including the electrodes 32 on the wiring board 31; (b) disposing a... Agent: Mcdermott Will & Emery LLP

20090078747 - Anisotropic conductive adhesive composition, anisotropic conductive film comprising the same, and associated methods: An anisotropic conductive adhesive composition includes an acrylic rubber binder having a weight average molecular weight of about 100,000 to about 1,000,000, a first component including at least one of a mono(meth)acrylate compound and a di(meth)acrylate compound, a second component including at least one of a tri(meth)acrylate compound and a... Agent: Lee & Morse, P.C.

20090072007 - Friction stir welding tool and friction stir welding method: A friction stir welding tool 1 includes a rotor 2 to be attached to a rotation-drive section and a probe 3 concentrically provided on a distal end surface of the rotor 2. A provisional joining projection 4 is concentrically provided on a distal end surface of the probe 3. A... Agent: Edwards Angell Palmer & Dodge LLP

20090072008 - Secondary battery protecting module and lead mounting method: In a lead mounting method of mounting, onto a principal surface of a printed board, a lead to be connected to a terminal, a flat lead is prepared which lead has a mounted part to be disposed on the principal surface of the printed board and a connected part to... Agent: Frishauf, Holtz, Goodman & Chick, PC

20090072009 - Method of preventing bonding between a load distribution block and a plate set of stacked sheets during diffusion bonding of a fluid flow structure: The present invention relates to diffusion bonding of patterned sheets to form a fluid flow handling structure, and to a method of preventing bonding between a load distribution block and a plate set of stacked sheets during the diffusion bonding process.... Agent: Shirley L. Church, Esq.

20090072010 - Joining method and resultant article: A method of manufacturing an article by diffusion bonding, the method comprising the steps of assembling first and second component parts having a joint therebetween; sealing the joint against infiltration by solid particulate material, without causing phase change of the component parts; and applying heat and isostatic pressure via a... Agent: Mccormick, Paulding & Huber LLP

20090072011 - Method of mounting conductive ball and conductive ball mounting apparatus: A method of mounting a conductive ball according to the present invention includes the steps of, disposing a mask on a substrate including connection pads, the mask having opening portions corresponding to the connection pad, supplying conductive balls on the mask, arranging the conductive balls on the connection pad of... Agent: Kratz, Quintos & Hanson, LLP

20090072012 - Apparatus and method for arranging magnetic solder balls: An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a magnet which is incorporated in the stage and is movable in parallel with a lower surface of the placed and fixed substrate so as to cause a magnetic force to act in... Agent: Drinker Biddle & Reath (dc)

20090072013 - Nano-scale particle paste for wiring microelectronic devices using ink-jet printing: Nano-scale particle paste may be used for on-die routing and other applications using deposition and inkjet printing. A metal paste is applied to a surface of a die to electrically couple two spaced apart connection points of the die. Alternatively, or in addition, the paste may contain carbon nanotubes. The... Agent: Blakely Sokoloff Taylor & Zafman LLP

20090065553 - Friction stir welding apparatus: Portable friction stir welding apparatus having a crawler which supports a motor for rotating a Friction Stir Welding tool and is coupled to a drive mechanism for urging the crawler along a predefined weld path on work pieces. The crawler can comprise one member or a set of two or... Agent: Intellectual Property

20090065554 - Methods and device for controlling pressure in reactive multilayer joining and resulting product: The invention includes a method of joining two components. The method includes providing at least two components to be joined, a reactive multilayer foil, and a compliant element, placing the reactive multilayer foil between the at least two components, applying pressure on the two components in contact with the reactive... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20090065555 - Electrical interconnect forming method: An electrical structure method of forming. The method includes forming a plurality of individual metallic structures from metallic layer formed over a first substrate. A plurality of vias are formed within a second substrate. The plurality of vias are positioned over and surrounding the plurality of metallic structures. A portion... Agent: Schmeiser, Olsen & Watts

20090065556 - Method to reduce shrinkage driven distortion when welding on pressure piping and vessel materials: A welding method is disclosed in which a structural weld overlay is re-oriented from a circumferential orientation to an axial orientation during deposition. The axial welding orientation provides a more favorable condition to prevent weld cracking and shrinkage distortion. The axial welding orientation also allows two or more weld machines... Agent: Nixon & Vanderhye P.C.

20090065557 - Selective rework apparatus for surface mount components: An apparatus for selective rework for surface mount components. A shield assembly encloses a circuit board on which Surface Mount Technology (SMT) modules are soldered. The shield assembly includes a top shield member having an opening over an SMT module to be removed from the circuit board, and a bottom... Agent: John E. Campbell IBM Corp.

20090057371 - Friction stir joining apparatus: In the friction stir joining apparatus of the present invention, a rotation control unit variably controls a rotational speed of a rotor; and a straight movement control unit controls a straight movement of the rotor so as to control a pressure applied by the rotor to the object. The tip... Agent: Oliff & Berridge, PLC

20090057372 - Conductive ball mounting apparatus: A conductive ball mounting apparatus includes a stage including a placement surface, stage moving means that moves the stage between a supply position and a mounting position, mounting means that comprises an array mask and mounts the conductive ball to the object to be mounted via the array mask, elevating... Agent: Drinker Biddle & Reath (dc)

20090057373 - Multi-purpose end effector for welder: A multi-purpose end effector for a welding robot includes a base plate mounted on a robot and carrying a plurality of tools including a welder, a cleaning wheel for cleaning a workpiece, and a buffing wheel for buffing the weld. The tools are arranged in serial order on the base... Agent: General Motors Corporation Legal Staff

20090057374 - Hot-bar soldering tool head: A hot-bar head is adapted for soldering at least two flexible flat cables to a substrate. The hot-bar head includes a head body having a connecting portion that extends in a longitudinal direction, and at least two soldering portions, each of which extends from the connecting portion and has a... Agent: Ostrolenk Faber Gerb & Soffen

20090057375 - Method of improving surface roughness of fluid flow conduits within a diffusion bonded fluid flow structure: The present invention relates to a method of diffusion bonding sheets of patterned material to fabricate a fluid delivery system; and particularly relates to a method of improving the interior surface roughness of fluid flow conduits formed within the diffusion bonded fluid delivery system structure.... Agent: Shirley L. Church, Esq.

20090057376 - Automated evacuation and sealing process: An automatic chamber evacuating method, system, and apparatus are disclosed, which include a nest, wherein a region or chamber, such as for example the reference chamber of an absolute pressure sensor, may be placed. A switch is used to initiate an automatic process whereby an air operated chuck seals to... Agent: Intellectual Property Honeywell International Inc.

20090057377 - Friction stir joining apparatus: In the friction stir joining apparatus of the present invention, a rotation control unit variably controls a rotational speed of a rotor; and a straight movement control unit controls a straight movement of the rotor so as to control a pressure applied by the rotor to the object. The tip... Agent: Oliff & Berridge, PLC

20090057378 - In-situ chip attachment using self-organizing solder: An in-situ chip attachment process uses a self-organizing solder paste composed of a synthetic resin organic flux and solder particles having a mean diameter that falls between around 0.1 μm and around 10 μm. The process is carried out by blanket depositing the solder paste on a first substrate having... Agent: Intel Corporation C/o Intellevate, LLC