Metal fusion bonding inventions 02/09

20090050672 - Tool and apparatus for friction stir welding: The present invention provides a tool for forming a friction stir weld joint in a workpiece. According to one embodiment, the tool includes a rotatable pin having first and second ends and defining a stirring portion therebetween structured to frictionally engage the workpiece so as to at least partially form... Agent: Alston & Bird, LLP

20090050673 - Soldering apparatus and solder tip: The present application discloses a fixture-free, hands-free soldering apparatus having a base support assembly and a solder assembly. The base support assembly has a base member supporting a power supply and an electronic temperature, time and speed control system, and an actuator for remotely actuating the solder assembly without the... Agent: Jeanne E. Longmuir

20090050674 - Wave soldering bath: e

20090050675 - Friction welding method and components produced from steel and metal aluminide using an intermediary from an ni alloy: A method for connecting a first component from a metal aluminide or a refractory Ti alloy to a second component from steel, metal aluminide or a refractory Ti alloy, especially from a steel shaft, by friction welding is disclosed. An intermediary from an Ni alloy is inserted between the first... Agent: Davidson, Davidson & Kappel, LLC

20090050676 - Tool and method for assembling metal parts by impacting with the aid of magnetic force using two electromagnetic coils movable with respect to each other: A tool for assembling a part made of a ferromagnetic material with a part made of a paramagnetic material. The tool includes a first tool part including a first abutment and a first electromagnetic coil. The tool also includes a second part including a second abutment, wherein the second part... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090050677 - Method of welding electronic components on pcbs: An exemplary method of welding electronic components on PCBs is disclosed. Firstly, a metal tray including a number of supporting areas is provided. At least one through hole is formed in each of the supporting areas. Secondly, solder pastes are applied onto welding pads of PCBs. Thirdly, electronic components are... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20090050678 - Method for mounting electronic parts: When a surface-mount electronic part, which includes at least two mounting electrodes on an external underside thereof, is bonded to circuit terminals on a wiring board using solder, a protrusion, which is thicker than the circuit terminal, is provided on a surface of the wiring board facing the outer bottom... Agent: Cantor Colburn, LLP

20090050679 - Method and facility for assembling components of a vehicle body: The assembly of body components using a geometry box (1) and clamping frames (7, 8) is described. At least for the larger components (9, 10), in particular the side wall parts of the body, a multipart clamping frame (8a, 8b) is used. The component (9, 10) is grasped and fed... Agent: Proskauer Rose LLP

20090050680 - Method for connecting tubular solid oxide fuel cells and interconnects for same: An interconnect for electrically connecting a first and second cell of a tubular fuel cell bundle having a body with an anode contact and a cathode contact extending therefrom. The anode contact is formed to follow a contour of an anode portion of the first cell. The cathode contact is... Agent: Edwards Angell Palmer & Dodge LLP

20090045243 - Butt welding and feeding machine: Rolls of steel plates fed to a butt welding and feeding machine, a seamless welding between two adjoining juxtaposed steel plates must be first trimming off both butt ends or leading and trailing edge flanges. After trimming, the trimmed leading and trailing edges flush against each other. Welding torch opposite... Agent: Young, Zhi-huei

20090045244 - Wire bonding apparatus comprising rotary positioning stage: A wire bonding apparatus, comprising a bonding tool mounted on a bondhead body which is in turn mounted on a positioning table, is provided for bonding electronic devices. The positioning table has first and second motors coupled to it that are operative to drive the bondhead body to positions along... Agent: Ostrolenk Faber Gerb & Soffen

20090045245 - Solder repairing apparatus and method of repairing solder: A solder repairing apparatus includes a stage designed to place the surface of at least a specific part of an object along a reference plane within a specific spot defined on the stage. A heating unit applies a thermal energy to the specific spot. A dividing plate is designed to... Agent: Staas & Halsey LLP

20090039139 - Friction stir welding load confirmation system: A portable multi-axis load confirmation tool having a rotating ball on the end thereof follows a three-dimensional weld program path therewith. The ball reacts to an internal load cell for verifying weld program path dynamics before an actual program is run with friction stir welding tools. The load cell is... Agent: Ostrager Chong Flaherty & Broitman, P.C.

20090039140 - Solder mold with venting channels: A solder mold for transferring solder to a wafer includes a substrate, a plurality of solder cavities for holding solder, and a plurality of ventilation channels formed between the plurality of solder cavities.... Agent: F. Chau & Associates, LLC

20090039141 - Bonding wire cleaning unit and method of wire bonding using the same: A wire cleaning system for cleaning wire configured to be wirebonded is provided. The wire cleaning system includes a chamber through which a wire configured to be wirebonded extends prior to the wire being wirebonded. The wire cleaning system also includes an energy source for removing contamination from the wire... Agent: Kulicke And Soffa Industries, Inc.

20090039142 - Method for forming a solder mold with venting channels and method for using the same: A method for forming a solder mold for transferring solder to a wafer includes etching a plurality of solder cavities into a substrate. A plurality of ventilation channels are etched on the substrate connecting the plurality of solder cavities.... Agent: F. Chau & Associates, LLC

20090032569 - Friction welding method and products made using the same: A method including providing a first portion including one of an annular portion or a hub portion; rotating a second portion including the other of the hub portion or the annular portion; and pressing the second portion against the first portion such that friction between the hub portion and the... Agent: General Motors Corporation C/o Reising, Ethington, Barnes, Kisselle, P.C.

20090032570 - Compression bonding device and a mounting method: A compression bonding device has a dam member so that when a pressing head is pressed against an object to be pressed, the bonding part is surrounded by the dam member. Thus, even if the surface of the bonding part bulges by pressing, the bulging part is stopped by the... Agent: Oliff & Berridge, PLC

20090032571 - Methods and systems for welding particle-matrix composite bodies: Methods and associated systems for welding a particle-matrix composite body to another body are disclosed. In some embodiments, a particle-matrix bit body may be welded to a metal coupler. In one embodiment, a heating torch may heat a first localized volume of the particle-matrix composite body to a temperature below... Agent: Trask Britt

20090032572 - System, method, and apparatus for reactive foil brazing of rock bit components. hardfacing and compacts: A reactive foil is used to join rock bit components such as leg sections, hardfacing, and cutter elements to the rolling cone earth-boring bit body. A small pulse of localized energy ignites the foil in a fraction of second to deliver the necessary amount of heat energy to reflow solder... Agent: Bracewell & Giuliani LLP

20090032573 - Amorphous caesium aluminum fluoride complex, its production and use: The present invention provides an amorphous caesium aluminium fluoride complex, a process for its production and the use of the complex as a flux, in particular for the soft soldering of aluminium.... Agent: Fulbright & Jaworski, LLP