Metal fusion bonding inventions 01/09

20090026246 - Superplastic forming of titanium assemblies: A method of superplastic forming of titanium packs and an associated assembly is provided. The titanium packs can include sheets having different granular structures so that the different sheets are adapted to superplastically form at different temperatures. One or more of the sheets can be formed at a temperature that... Agent: Alston & Bird, LLP

20090026247 - Apparatus and method of mounting conductive ball: There is provided a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of connection pads formed on a substrate. The conductive ball mounting apparatus includes: an outer frame; an inner cylinder provided in the outer frame, wherein an upper surface and a lower surface... Agent: Rankin, Hill & Clark LLP

20090026248 - Method for soldering components: The invention relates to a method for soldering components, in particular heat exchanger, in particular made of aluminium materials, aluminium alloys or wrought alloys, in a soldering furnace, in particular a continuous soldering furnace or a batch-type soldering furnace, which comprises a muffle, which is flushed with protective gas in... Agent: Foley And Lardner LLP Suite 500

20090026249 - Method for soldering two components together by using a solder material: A method for soldering or hybridizing two components to each other by means of a solder material, including producing, on the opposite-facing surfaces of the components to be soldered or hybridized, a surface capable of being wetted by said solder material, this surface being produced on a first component which... Agent: Burr & Brown

20090026250 - Method and apparatus for loading solder balls: A solder ball loading apparatus for loading solder balls onto pads of a printed wiring board includes a holding device for holding a printed wiring board having pads and holding a ball array mask having of openings that correspond to pads of the printed wiring board, one or more cylinder... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090020585 - Aluminum alloy brazing sheet having high-strength and production method therefor: a core alloy; an Al—Si-based filler alloy cladded on one side or both sides of the core alloy, wherein the core alloy is composed of an aluminum alloy containing 0.3-1.2% (mass %, the same applies the below) Si, 0.05-0.4% Fe, 0.3-1.2% Cu, 0.3-1.8% Mn, 0.05-0.6% Mg, and containing one or... Agent: Carrier Blackman And Associates

20090020586 - Semiconductor device bonding apparatus and method for bonding semiconductor device using the same: The semiconductor device bonding apparatus 1 of the present invention includes: a pressing member 15 that presses the semiconductor device 10 toward the substrate 11 side in a state where a bump 14 is provided between the semiconductor device 10 and the substrate 11; an ultrasonic vibration applying member 16... Agent: Hamre, Schumann, Mueller & Larson P.c.

20090020587 - Bonding method: At a comparatively early stage, members to be bonded are pressurized together by an applied pressure that is a comparatively low pressure. Under an applied pressure condition (a gas venting process) of the comparatively low pressure, an organic protective film is vaporized by heating a bonding material, and a void... Agent: Oliff & Berridge, Plc

20090020588 - Method for manufacturing product involving solder joining, solder joining apparatus, soldering condition verification method, reflow apparatus, and solder joining method: A method for manufacturing a product involving solder joining wherein components placed on a board on which the components are to be mounted are solder-joined to the board by subjecting the board to reflow heating under prescribed heating conditions, the method comprising: calculating, at each designated site on the board,... Agent: Staas & Halsey LLP

20090020589 - Ultrasonic brazing of aluminum alloy and aluminum matrix composite: A method of ultrasonic brazing metal matrix composite, which forms a reinforced composite bond without filling welding wire with reinforcement or adding alloy element to generate ceramic phase, includes the steps of setting a filler metal; introducing ultrasonic vibration to braze in air; dissolving the base materials, and introducing ultrasonic... Agent: David And Raymond Patent Firm

20090020590 - Process for making interconnect solder pb-free bumps free from organo-tin/tin deposits on the wafer surface: A method is provided for making of interconnect solder bumps on a wafer or other electronic device without depositing any significant amount of tin or other solder component from the solder onto the wafer surface which tin can cause shorts or other defects in the wafer. The method is particularly... Agent: Law Office Of Delio & Peterson, Llc.

20090020591 - Conductive ball mounting method: There is provided a method of mounting one conductive ball on each of a plurality of connection pads on a substrate. The method includes: (a) providing a pre-alignment base including: a support layer formed to allow a flux to pass therethrough; and an alignment layer provided on the support layer... Agent: Rankin, Hill & Clark LLP

20090020592 - Method of joining and method of fabricating an organic light emitting diode display device using the same: A method of joining a flexible layer and a support includes forming a first metal layer on one surface of the flexible layer, forming a second metal layer on one surface of the support, cleaning the first metal layer and the second metal layer, and joining the first metal layer... Agent: Lee & Morse, P.c.

20090020593 - Method and apparatus for manufacturing solder mounting structure: In manufacturing a camera module structure (100), a hot air nozzle (4) melts solder at a solder connection portion (3) by blowing hot air to the solder connection portion (3), while a suction nozzle (5) suctions the hot air that moves toward the camera module (2), from a position nearer... Agent: Edwards Angell Palmer & Dodge LLP

20090014497 - Apparatus for welding upper and lower plates of metal separating plate of fuel cell: Provided is an apparatus for welding upper and lower plates of a metal separating plate of a fuel cell which can simplify the welding of a separating plate, improve welding and watertight performance, and prevent the thermal deformation of a separating plate. The apparatus includes a supporting unit which is... Agent: Morgan, Lewis & Bockius LLP (sf)

20090014498 - Compression bonding device: A compression bonding device capable of packaging electric components on both sides of a substrate is provided. A compression bonding device includes first and second pressing rubbers. Electric components can be simultaneously packaged on the front face and the rear face of a substrate by sandwiching the substrate between the... Agent: Bell, Boyd & Lloyd, LLP

20090014499 - Automated preform attach for vacuum packaging: Systems and methods for automatically attaching preforms to substrates. An example system includes a nest, a first component that places a substrate into the nest, a second component that places a preform on the substrate in the nest, a tacking device that tacks the preform to the substrate, a plurality... Agent: Honeywell International Inc. Patent Services Ab-2b

20090014500 - Weight balancer and pipe joining method: The present invention relates to a weight balancer (100) and a pipe joining method that is capable of reducing a load of pipes when arranging and welding the pipes in ships, plants, piping work sites and the like. A weight balancer (100) according to the present invention includes an operation... Agent: Harness, Dickey & Pierce, P.L.C

20090014501 - Electronic component mounting system, electronic component placing apparatus, and electronic component mounting method: Regarding electronic component mounting in which an electronic component having plural solder bumps for external connection on its lower surface is mounted on a board, in an electronic component mounting operation of previously measuring the height position of solder paste on the board on which the solder paste has been... Agent: Pearne & Gordon LLP

20090014502 - Method and apparatus for placing conductive balls: An improved placing method and placing apparatus are provided for placing conductive balls in a predetermined pattern onto a base unit. In the placing method for placing balls having conductivity in a predetermined pattern onto one surface of the base unit, an arrangement member has one surface, another surface opposite... Agent: J.c. Patents

20090014503 - Reflow apparatuses and methods for reflow: There are provided reflow apparatuses and a methods therefor. In some embodiments, a reflow apparatus includes a first heating unit capable of heating a solder on a substrate up to just below before a melting point of the solder at ambient pressure such that the solder on the substrate is... Agent: Mills & Onello LLP

20090014504 - Method of supplying paste solder material and metal mask therefor: When different paste solder materials are printed to circuit patterns on a substrate, a plurality of metal masks corresponding to kinds of solder materials are used so as to perform printing in a manner corresponding to each of the solder materials, so that the particular solder materials are supplied to... Agent: Townsend And Townsend And Crew, LLP

20090014505 - Braze materials and processes therefor: Braze materials and processes for using braze materials, such as for use in the manufacturing, coating, repair, and build-up of superalloy components. The braze material contains a plurality of first particles of a metallic material having a melting point, and a plurality of second particles comprising at least one nonmetallic... Agent: Hartman & Hartman, P.C.

20090008426 - Addition of d2 to h2 to detect and calibrate atomic hydrogen formed by dissociative electron attachment: A method of detecting and calibrating dry fluxing metal surfaces of one or more components to be soldered by electron attachment using a gas mixture of reducing gas comprising hydrogen and deuterium, comprising the steps of: a) providing one or more components to be soldered which are connected to a... Agent: Air Products And Chemicals, Inc. Patent Department

20090008427 - Driving unit of welding equipment: There is provide a driving unit of welding equipment capable of surely stopping turning of a pressure application shaft while shortening the entire length of welding equipment without enlarging a hole diameter of a rotary shaft of a motor, thereby rendering a welding gun small-sized, lightweight and compact as a... Agent: Flynn Thiel Boutell & Tanis, P.C.

20090008428 - Method of manufacturing an article by superplastic forming and diffusion welding: The invention relates to plastic metal forming, particularly to methods of manufacturing articles of titanium alloys by superplastic forming and diffusion welding. The method is particularly applicable to aircraft engine building for manufacturing articles, e.g. fan blades. A method of manufacturing an article by superplastic forming and diffusion welding from... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20090008429 - Method and device for producing tubular jackets: In at least one embodiment, for producing segments of tubular jackets, a strip-shaped sheet material is continuously reshaped transverse to the strip axis into a closed form and following the welding of a longitudinal seam, jacket sections are cut off the jacket strip. In at least one embodiment, a support... Agent: Harness, Dickey & Pierce, P.L.C

20090008430 - Solder-bonding process: Methods include providing substrate having substrate surface, forming metal-containing pad on substrate surface, and forming metal-containing protective shell enclosing metal-containing body on metal-containing pad. Methods may include forming sacrificial layer on metal-containing pad and including top surface and cavity, cavity having side wall extending between metal-containing pad and top surface;... Agent: Jay M. Brown

20090008431 - Solderable emi gasket and grounding pad: Apparatus, which is useful as both a conductive gasket and a grounding pad, which has a compressible elastomeric substrate having at least one side surface and two ends, a conductive elastomeric layer adjacent to all of the side surfaces of the compressible substrate, and a metal layer adjacent to the... Agent: W. L. Gore & Associates, Inc.

20090008432 - Heating device, reflow device, heating method, and bump forming method: A solder bump is formed on a substrate by using a heating device where a lid structure blocks hot air from directly blowing against a solder composition. The heating device can reduce high-temperature oxygen molecules that come into contact with the solder composition, oxidation of the solder composition is suppressed.... Agent: Greenblum & Bernstein, P.L.C

20090008433 - Conductor ball mounting apparatus, conductor ball mounting method, mask used for mounting conductor ball, and mask manufacturing method: There is provided a conductive ball mounting apparatus. The conductive ball mounting apparatus includes: a conductive ball mounting mask disposed to oppose a substrate having a plurality of pads coated with an adhesive flux, the conductive ball mounting mask having a plurality of ball mounting through holes for mounting each... Agent: Rankin, Hill & Clark LLP

20090008434 - Lead-free solder alloy: A lead-free solder alloy includes a tin-copper alloy that also includes a minor amount of cobalt, which has been found to provide a shiny and reflective appearance to the solder alloy. Methods of soldering using such an alloy, as well as a solder joint including such an alloy also are... Agent: Pearne & Gordon LLP

20090001131 - Method of manufacturing cylindrical body, friction stir welding method, and friction stir welding device: A friction stir welding apparatus (120) brings end faces (1, 2) of a plate material (W1), having fingers (7a through 7d) at corners thereof, into abutment against each other to form a hollow cylindrical body (W2), and friction-stir-welds the end faces (1, 2) to each other. The apparatus includes a... Agent: Carrier Blackman And Associates

20090001132 - Micro-ball loading device and loading method: A device for loading electro-conductive ball onto the terminal regions of a substrate more correctly and reliably is disclosed. Micro-ball loading device (200) may have the following parts: backing plate (220) supporting substrate (100) such that plural terminal regions (108) formed on one surface of substrate (100) are free, transfer... Agent: Texas Instruments Incorporated

20090001133 - Electronic component mounting device and method of manufacturing electronic device: An electronic component mounting device according to the invention includes a bonding head for holding and pressure bonding an electronic component to a mounting substrate, a local stage provided with a support surface formed in an area which is almost equal to or slightly larger than that of a mounting... Agent: Rankin, Hill & Clark LLP

20090001134 - Method and apparatus for judging quality of resistance brazing: An apparatus for judgment of the quality of resistance brazing provided in a resistance brazing apparatus gripping a weld object between which a brazing material is interposed between a pair of electrodes, applying pressure to copper parts, and feeding power to the electrodes in that state, having a control unit... Agent: Harness, Dickey & Pierce, P.L.C

20090001135 - Semiconductor manufacturing apparatus and semiconductor manufacturing method: A semiconductor manufacturing apparatus operable to simultaneously apply supersonic vibration to two bonding sites located at different heights to simultaneously perform bonding of the two bonding sites, the apparatus includes: a cylindrical body; a first protrusion provided on an outer peripheral surface of the cylindrical body and receiving supersonic vibration... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090001136 - Apparatus and method for rotational friction welding: A rotational friction welding apparatus and method for joining two components is disclosed. The apparatus includes a first spindle which turns and a second spindle which does not turn. A first component of the components that are to be connected together is mounted on the first, turning spindle, and a... Agent: Crowell & Moring LLP Intellectual Property Group

20090001137 - Gold/nickel/copper/titanium brazing alloys for brazing wc-co to titanium and alloys thereof, brazing methods, and brazed articles: A brazing material for brazing tungsten/carbide/cobalt substrates (e.g., wear pads) to substrates comprising titanium or alloys thereof (e.g., fan or compressor blades). The brazing material includes gold, nickel, copper, and titanium present in respective amounts to provide a post-braze hardness of between 450 and 600 KHN to thereby increase the... Agent: General Electric Company

20090001139 - Method for manufacturing a printed wiring board: A method for manufacturing a printed wiring board, the method including forming a solder resist layer having a small-diameter aperture and a large-diameter aperture, each aperture exposing a respective joint pad. A metal ball having a first diameter is mounted in the small-diameter aperture by using a mask for small... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090001138 - Method for preventing void formation in a solder joint: In one disclosed embodiment, the present method for preventing void formation in a solder joint formed between two metallic surfaces includes forming at least one slit in a layer of solder to form a slit solder layer, positioning the slit solder layer between the two metallic surfaces, and heating the... Agent: Farjami & Farjami LLP

20090001140 - Method for soldering interconnector to photovoltaic cell: The present invention relates to the method for soldering the interconnector to the photovoltaic cell, in manufacturing the photovoltaic module, which makes it possible to significantly inhibit or almost eliminate the deformation of the photovoltaic cell due to heat of the soldering when soldering the interconnector (hereinafter, refer also to... Agent: Apex Juris, PLLC

20090001141 - Method for arc or beam brazing/welding of workspieces of identical or different metals or metal alloys with additional materials of sn base alloys; sn base alloy wire: The invention is directed to a method for arc or beam brazing/welding of workpieces (A) made of steel, cast iron, nickel, cadmium, beryllium, titanium, molybdenum, magnesium, aluminum, copper, lead, zinc, tin, hard metal and alloys thereof with workpieces (B) made of steel, cast iron, nickel, cadmium, beryllium, titanium, molybdenum, magnesium,... Agent: Knobbe Martens Olson & Bear LLP

20090001142 - Method for producing a welded rotor of a low-pressure steam turbine: A method for producing a welded rotor of a low-pressure steam turbine, the method including providing a first forging including a steel with a minimum yield strength of approximately 700 Mpa. A second forging is provided including a heat-treated 3.5 NiCrMoV stel having an average chemical composition of 3.5% of... Agent: Darby & Darby P.C.