Metal fusion bonding inventions 12/08

20080314963 - Bonding tool with improved finish: A bonding tool includes a body portion terminating at a tip portion. The tip portion is formed from a material, wherein a grain structure of the material is exposed for at least a portion of the tip portion.... Agent: Kulicke And Soffa Industries, Inc.

20080314964 - Wire bonding apparatus and process: A wire bonding machine includes (1) a support structure for supporting a work piece and (2) a pre-heat structure for supporting the work piece during a pre-heat operation. The pre-heat structure is moveable with respect to the support structure.... Agent: Kulicke And Soffa Industries, Inc.

20080308609 - Bond head for a wire bonder: A bond head for a wire bonding comprises a platform which is movable in a horizontal plane and on which a rocker is arranged which is rotatable about a first horizontal axis. An ultrasonic transducer which is rotatably held about a second horizontal axis is fastened to the rocker. A... Agent: Mccormick, Paulding & Huber LLP

20080308610 - Hollow structures formed with friction stir welding: A hollow structure, and a method of forming the hollow structure, where the hollow structure includes first and second metal parts, the second metal part having an interior surface and a tapered support member extending from the interior surface. The hollow structure also includes a friction stir welded joint that... Agent: Kinney & Lange, P.A.

20080308611 - Linear friction welding apparatus and method: A linear friction welding head apparatus for dual axis forging, the apparatus including three sets of orthogonal actuators for providing X-, Y-, and Z-planes of apparatus movement for providing Y-axis oscillation, a first forge load along a first forge axis, and a second forge load along a second forge axis.... Agent: Adams Intellectual Property Law, P.A.

20080308612 - Manual method for reballing using a solder preform: A method for manually reattaching solder balls onto a plurality of contact areas arranged in a pattern on a device to be reballed is provided. First, a single use preform with a plurality of solder balls arranged in a pattern corresponding to the pattern of contact areas on the device... Agent: Leydig Voit & Mayer, Ltd

20080302856 - Conductive ball arraying apparatus: A conductive ball arraying apparatus includes an arraying jig including conductive ball insertion parts in a predetermined array pattern, a ball cup that has an opening formed in a bottom surface thereof and is capable of housing a plurality of conductive balls along with the arraying jig, moving means that... Agent: Drinker Biddle & Reath (dc)

20080302857 - Wire clamp for a wire bonder: A wire clamp for a wire bonder comprises a first arm and a second arm, which is mounted on the first arm so that it is rotatable around a predetermined axis. The first arm and the second arm each have a clamping jaw on an end distal from the axis.... Agent: Mccormick, Paulding & Huber LLP

20080302858 - Wiring method and device: To permanently apply lead terminals to corresponding electrodes of electronic or electro-optic components, the following steps are carried out: a. providing a frame including at least one tensioned wire, b. providing a holding jig including at least one seat in which a respective one of the components can be removably... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20080302859 - Method of reflow soldering a printed circuit board wherein an electroconductive coating material is used: A reflow soldering method for use with circuit patterns and land patterns formed by an electoconductive coating material. Reflow soldering is performed in an air atmosphere within a range of 150°-190° C. and with a preheating time set within a range of 60±30 sec. Alternatively, preheating is performed in a... Agent: Darby & Darby P.C.

20080302860 - Air bearing gap control for injection molded solder heads: An air bearing gap control arrangement for injection molded solder filler heads. Also provided is a method of providing for a gap control for injection molded solder filler heads utilizing an air bearing arrangement. Provided is a C-ring seal, at the lower or dispensing region of the solder filler head... Agent: Scully, Scott, Murphy & Presser, P.C.

20080302861 - Method and apparatus for wave soldering an electronic substrate: A wave soldering apparatus includes a solder supply and a first wave soldering nozzle in fluid communication with the solder supply. The first wave soldering nozzle includes a flat plate having a plurality of square-shaped openings formed therein to generate a first solder wave. An inert system is configured to... Agent: Lowrie, Lando & Anastasi, LLP

20080302862 - Concave face wire bond capillary and method: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the... Agent: Trask Britt, P.C./ Micron Technology

20080302863 - Method and device for transferring a solder deposit configuration: Method and device for transferring a solder deposit configuration having multiple solder deposits onto a terminal surface configuration of a contact surface of a substrate (36) using a removal of multiple solder deposits from a solder deposit reservoir (25) accommodated in a solder deposit receptacle unit (11) via an isolation... Agent: Quarles & Brady

20080296348 - Heater for select solder machine: A select solder machine configured to solder a circuit board using a solder material. The select solder machine includes a solder head movable with respect to the circuit board. The solder head is configured to position the solder material with respect to the circuit board to solder the circuit board.... Agent: Michael Best & Friedrich Casimir F. Laska

20080296349 - Method for treating metal member: A metal member is treated and vibrated with a number of vibrating particles to have the particles to strike and act onto an outer peripheral portion of the metal member in order to smooth the outer peripheral portion of the metal member, the particles are immersed with an additive for... Agent: Charles E. Baxley, Esquire

20080296350 - Friction-stir tool with form-adaptable shoulder: A friction-stir tool including a rotary-drivable tool body, at whose end facing away from the drive is provided a shoulder, from which extends in the direction of that end of the tool body that faces away from the drive, a rotatable rod-shaped projection that has a smaller diameter than the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080296351 - Diffusion bonded fluid flow apparatus useful in semiconductor manufacturing: The present invention relates to a method of diffusion bonding of steel and steel alloys, to fabricate a fluid delivery system of the kind which would be useful in semiconductor processing and in other applications which require high purity fluid handling.... Agent: Shirley L. Church, Esq.

20080296352 - Bonding method for cylindrical target: The present invention generally comprises a method and apparatus for bonding a cylindrical sputtering target to a backing tube. The cylindrical sputtering target may be disposed over the outside surface of the backing tube and melted bonding material may be vacuum pulled through the gap formed between the sputtering target... Agent: Patterson & Sheridan, LLP - - Appm/tx

20080296353 - Multi-angle, articulated-jig-supported, beam-end component welding: Adjustable, elongate, beam-offset jig structure for assisting in welding a pair of beam-end, column-interface components to the opposite ends of an elongate beam. The jig structure includes spaced, adjustable head-stock and tail-stock structures, each capable of holding such a component adjacent a beam end for adjustment to an infinite number... Agent: Robert D. Varitz, P.C.

20080296354 - Stainless steel or stainless steel alloy for diffusion bonding: The present invention relates to stainless steel sheets which would be useful in semiconductor processing and in other applications which require high purity fluid handling. The invention also relates to a method of selecting and processing such sheets.... Agent: Shirley L. Church, Esq.

20080296355 - Direct ball dispenser: In a method and apparatus for dispensing solder balls, a container having an opening for dispensing solder balls is positioned to enable a flow of the solder balls through the opening. The solder balls have a common configurable solder ball diameter. A proximal opening of a tube is coupled to... Agent: Texas Instruments Incorporated