Metal fusion bonding inventions 11/08

20080290136 - Solder supplying method: Amounts of a solder are controlled to supply onto the respective connection terminals with different opening diameters such that a difference between contents of a substance diffused from the connection terminals into the solder, which is present in the solder after reflow on the connection terminals with the different opening... Agent: Rankin, Hill & Clark LLP

20080290137 - Microwave brazing process: A process for heating a braze alloy by microwave radiation so that heating of the alloy is selective and sufficient to cause complete melting of the alloy and permit metallurgical bonding to a substrate on which the alloy is melted, but without excessively heating the substrate so as not to... Agent: Hartman And Hartman, P.C.

20080290138 - Method for bonding refractory ceramic and metal: A method is disclosed for mechanically bonding a metal component to a ceramic material, comprising attaching an anchor material to at least a portion of one surface of the metal component, and then applying the ceramic material to at least a portion of the one surface of the metal component,... Agent: Corning Incorporated

20080290139 - Method of bonding probes and method of manufacturing a probe card using the same: In a method of manufacturing bonding probes, bump layer patterns are formed on terminals of a multi-layered substrate. A first wetting layer pattern having a wettability with respect to a solder paste, and a non-wetting layer pattern having a non-wettability with respect to the solder paste are formed on the... Agent: Daly, Crowley, Mofford & Durkee, LLP

20080290140 - Welding hollow flange members: An apparatus for in-line ERW welding of hollow flange steel members in a cold forming mill comprises a seem roll stand (60) rotatably supporting at least one seam roll (68) adapted in use to guide a free edge (34a,34b) of a contoured metal strip (30) into linear alignment with a... Agent: Leydig Voit & Mayer, Ltd

20080290141 - Manufacture of shape memory alloy cellular materials and structures by transient-liquid reactive joining: This invention discloses a method, using pure niobium as a transient liquid reactive braze material, for fabrication of cellular or honeycomb structures, wire space-frames or other sparse builtup structures or discrete articles using Nitinol (near equiatomic titanium-nickel alloy) and related shape-memory and superelastic alloys. Nitinol shape memory alloys (SMAs), acquired... Agent: Marshall, Gerstein & Borun LLP

20080290142 - Method and process for reducing undercooling in a lead-free tin-rich solder alloy: Briefly, a novel material process is disclosed wherein one or more nucleation modifiers are added, in trace amounts, to a lead-free tin-rich solder alloy to produce a solder composition with reduce or suppressed undercooling temperature characteristics. The modifier being a substance which facilitates the reduction of extreme anisotropic properties associated... Agent: Fleit Gibbons Gutman Bongini & Bianco P.l.

20080290143 - Method of solid phase welding of metal plates: In a method of welding of metal plates in a solid phase, wherein the metal plates are combined to form a package, and welded together by heating and deforming the package by contacting with two rotating cylinders, the improvement includes: providing a damping lining between the metal plates; placing the... Agent: Caesar, Rivise, Bernstein, Cohen & Pokotilow, Ltd.

20080283578 - Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit: An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is... Agent: Ryan, Mason & Lewis, LLP

20080283579 - Method for bonding electronic components: A first electronic component, e.g., a semiconductor die and a second electronic component, e.g., a substrate, each with a main surface, are bonded to each other by applying at least one metal layer comprising an indium layer on each of the main surfaces. Then the semiconductor die and the substrate... Agent: Buchanan, Ingersoll & Rooney PC

20080283580 - Method for manufacturing a printed wiring board: A method for manufacturing a printed wiring board having a bump. The method includes forming a solder-resist layer having a small-diameter aperture and a large-diameter aperture, each aperture exposing a respective conductive pad of the printed wiring board, and printing a solder paste in the large-diameter aperture in the solder-resist... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080283581 - Apparatus and method for connecting copper tubes: An apparatus and method for connecting copper tubes are developed to facilitate welding operation in the refrigerating device. The new apparatus will reduce the poor welding rate so that it will effectively prevent clogging of the copper tubes and leaking the refrigerant. It also has merit to easily determine a... Agent: Peter T. Kwon

20080277451 - Structural assemblies and preforms therefor formed by friction welding: A preform and method for forming a structural assembly are provided. The preform can be formed by friction welding structural members to a base member and subsequently providing a connection material to join the structural members. The resulting preform can be formed with dimensions and a configuration that approximate the... Agent: Alston & Bird, LLP

20080277452 - Method of explosion welding to create an explosion welded article having a non-planar surface: An explosion welded article having a non-planar shape is provided. A method of preparing an apparatus for explosion welding is also provided, as is a method for forming an explosion welded article having a non-planar shape.... Agent: Rader, Fishman & Grauer PLLC

20080277453 - Element mounting structure and element mounting method: An element is mounted on a carrier by removing an oxide film sufficiently. An element mounting method in which electrodes of the element are fusion bonded to electrodes of the carrier so that the element is mounted on the carrier, the method includes the steps of: positioning the electrodes of... Agent: Jackson Chen Nec Corporation Of America

20080277454 - Composite metal article and method of making: A composite metal article from two dissimilar metals is prepared. A metal base is comprised of a first metal and having first and second opposing surfaces and a least one longitudinally-positioned depression in each of the first and second opposing surfaces for receiving a wire. An elongated metal element comprised... Agent: Wilmerhale/boston

20080277455 - Method for joining components made of a high-strength aluminum material and heat exchanger assembled according to the method: The invention relates to a method for joining components made of a high-strength aluminum material, whereby at least two components of high-strength aluminum alloys are joined by soldering, both components separated from each other by at least one aluminum layer with a lower magnesium content compared with the contact surfaces... Agent: Fraser Clemens Martin & Miller LLC

20080277456 - System and a method for controlling flow of solder: An assembly including a solder wettable surface is provided. The assembly also includes a metal mask configured to restrict solder from flowing outside the solder wettable surface.... Agent: General Electric Company Global Research

20080277457 - Device and method for wave soldering: The instant invention relates to a device for wave soldering workpieces, encompassing means for moving the workpiece, which is to be soldered, along a specific path across at least one solder wave generated above a solder reservoir, with a protective and/or active gas atmosphere of a first composition being located... Agent: The Boc Group, Inc.

20080277458 - Method for the subsequent treatment of welded connections: A method for the subsequent treatment of welded connections is shown and described. The object of providing a method for the subsequent treatment of a weld by which the tensile stresses in the region of the weld are reduced is achieved by applying a top layer to the weld on... Agent: Hovey Williams LLP

20080272176 - Wedge-bonding of wires in electronic device manufacture with reversible wedge bonding: In the manufacture of electronic devices (22, 22′), e.g. discrete semiconductor power devices or ICs, a reversible bonding tool (10) is used having a bonding tip or wedge (1, 2) at each of its opposite ends (11, 12). After extensive use of the wedge-tip (1) at one end (11) for... Agent: Nxp, B.v. Nxp Intellectual Property Department

20080272177 - Conductive bonding material fill techniques: A system provides solder into cavities in a circuit supporting substrate. The system places a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit... Agent: Fleit Gibbons Gutman Bongini & Bianco P.l.

20080272178 - Vacuum wire tensioner for wire bonder: A wire tensioner is provided for a wire bonder, the wire tensioner comprising a tubular body having a bore through which bonding wire is receivable and a bore outlet at an end of the tubular body from which the bonding wire is extendable towards a bonding tool. A chamber is... Agent: Ostrolenk Faber Gerb & Soffen

20080272179 - Thermal insulation for a bonding tool: A bonding apparatus comprising a bond arm and a wire bonding tool mounted to the bond arm is provided with thermal insulation in the form of a thermal shield substantially enclosing the bonding tool for insulating the bonding tool from ambient heat.... Agent: Ostrolenk Faber Gerb & Soffen

20080272180 - Method of manufacturing heat spreader module: A heat spreader module has a pedestal, a heat spreader member joined to the pedestal by a first active hard brazing material, an intermediate layer joined to the heat spreader member by a second active hard brazing material, an insulating board joined to the intermediate layer by a third active... Agent: Burr & Brown

20080272181 - Method for making nanostructured soldered or brazed joints with reactive multilayer foils: Self-propagating formation reactions in nanostructured multilayer foils provide rapid bursts of heat at room temperature and therefore can act as local heat sources to melt solder or braze layers and join materials. This reactive joining method provides very localized heating to the components and rapid cooling across the joint. The... Agent: Patent Docket Administrator Lowenstein Sandler PC