Metal fusion bonding inventions 09/08

20080230584 - Method for manufacturing a workpiece by friction welding to reduce the occurrence of abnormal grain growth: A method of manufacturing a workpiece is provided. The method generally includes friction stir welding at least one structural member, selectively removing material from the surfaces of the workpiece at the location of a friction stir weld joint, and thereafter subjecting the workpiece to a solution treat, quench, and age... Agent: Alston & Bird, LLP

20080230585 - Different materials bonded member and production method thereof: A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given metalized layer and the solder... Agent: Burr & Brown

20080230586 - Method of manufacturing electric resistance welding pipes having excellent characterization of welded seams: A method of efficiently manufacturing electric resistance welding pipes having excellent characterization of welded seams is provided, by which each lateral edge of a rounded strip immediately before electric resistance welding is securely shaped with desired tapering flexibly in response to change in strip thickness, so that welding quality may... Agent: Ip Group Of Dla Piper US LLP

20080230587 - Method for manufacturing electric connections in wafer: A method for manufacturing electrical connections in wafer is provided. A plurality of openings is formed on the upper surface of a wafer by dry etching or laser drilling and then solder paste is applied to the openings. Next, the wafer is positioned in a vacuum environment and is heated... Agent: Lowe Hauptman Ham & Berner, LLP

20080230588 - Hemming working method and panel assembly manufacturing method: A hemming working is performed by a positioning step of positioning a first panel formed with a projected portion for welding on a second panel formed with a flange portion; a first bending step of bending the flange portion; and a second bending step of pressing the flange portion on... Agent: Rankin, Hill & Clark LLP

20080230589 - Apparatus and method for connecting a component with a substrate: An apparatus for connecting a component with a substrate by means of diffusion soldering in a closed evacuated chamber is disclosed. The component and the substrate to be connected are displaceable separate from one another in the chamber, and the chamber comprises a combined transfer and pressing unit being displaceable... Agent: Coats & Bennett/infineon Technologies

20080230590 - Method for fabricating dissimilar material jointed body: A method for producing a bonded body of different materials of the present invention is a method for producing a bonded body of different materials (1), where two plate members (2 and 3) are bonded to each other, the method including: laminating two plate members (2 and 3) consisting of... Agent: Oliff & Berridge, PLC

20080230591 - Device and method for pretreating electronic components prior to soldering: A device and method are provided for reflow soldering workpieces wherein a plasma device for an atmospheric plasma treatment of the workpiece is upstream of a solder application and/or upstream of a soldering zone, and wherein the method subjects the workpiece to an atmospheric plasma treatment with the aid of... Agent: The Boc Group, Inc.

20080223905 - Fixing structure for printed circuit board of micro motor: The present invention relates to a fixing structure for printed circuit board (PCB) of micro motor, including a base and a PCB. The base has a shaft tube disposed centrally therein; at least a circuit board fixing pin is protruded beyond the base peripheral to the shaft tube; the PCB... Agent: Bacon & Thomas, PLLC

20080223906 - Soldering structure and method using zn: A soldering structure using Zn includes a bonding layer which contains Zn; and a lead-free solder which bonds and reacts to the bonding layer. The bonding layer can be a Zn alloy layer or a multilayer including a Zn layer. Accordingly, the characteristics of the soldering structure can be improved... Agent: Sughrue Mion, PLLC

20080217377 - Fracture resistant friction stir welding tool: Friction stir welding tool to facilitate stress reduction within the tool that may include a body, a pin, a tension member, and an end assembly, the tension member and end assembly facilitating axial compression of the pin. The tension member may be decoupled from the pin and/or body of the... Agent: Intellectual Property

20080217378 - Device for centering and clamping tubular parts, comprising means for the real-time mesurement and regulation of the moisture content: The invention relates to a device for centring and clamping conduits which are preferably made from alloy steel and which are positioned end to end in order to be welded to form a pipeline. The invention comprises: means for centring and clamping two conduits that are to be welded, optional... Agent: Trego, Hines & Ladenheim, Pllc

20080217379 - Method for cohesively bonding metal to a non-metallic substrate: A process for cohesive bonding between a metal surface and a nonmetallic substrate is provided. The non-metallic substrate may comprise a plurality of microfilaments and/or nanofilaments dispersed into and below the surface of the substrate. The application of pressure and laterally-oriented high frequency and low amplitude vibration may allow for... Agent: Bose Mckinney & Evans LLP 2700 First Indiana Plaza

20080217380 - Method and apparatus to relieve residual stress or distortion in a heat processed article: The application discloses a method and apparatus to apply pressure to a heated or weld region of a workpiece to relieve residual stress and distortion. In illustrated embodiments, heat is supplied via a probe that traverses a workpiece to heat a region of the workpiece. Pressure is applied to the... Agent: Westman Champlin & Kelly, P.a.

20080217381 - Method for bonding work pieces and micro-structured component: For forming very strong bond joints suited for manufacturing micro-structured components consisting of plurality of individual layers, a bonding method is proposed by which a bonding arrangement of the work pieces is formed that comprises at least one metallic bonding layer interposed therein between and by which the bonding arrangement... Agent: Paul And Paul

20080217382 - Metal-ceramic composite air braze with ceramic particulate: A method for joining together two or more ceramic and/or metal parts by providing a braze consisting of a mixture of copper oxide, silver, and ceramic particulate. The braze is placed upon the surfaces of the parts, which are then held together for sufficient time and at a sufficient temperature... Agent: Douglas E. Mckinley, Jr.

20080217383 - Manufacturing method of printed circuit board: A screen plate having a plurality of openings is placed on a suspension substrate in which a plurality of conductive pads are formed. Conductive paste is moved in one direction on an upper surface of the screen plate, so that the conductive paste is applied onto the conductive pads through... Agent: Panitch Schwarze Belisario & Nadel LLP

20080217384 - Elliptic c4 with optimal orientation for enhanced reliability in electronic packages: An arrangement for the equipping of electronic packages with elliptical C4 connects possessing optimal orientation for enhanced reliability. Furthermore, disclosed is a method providing elliptical C4 connects which possesses optimal orientation for enhanced reliability, as implemented in connection with their installation in electronic packages. Employed are essentially elliptical solder pads... Agent: Scully, Scott, Murphy & Presser, P.c.

20080217385 - Tool for diffusion bonding of multi sheet metal, method of manufacturing structural part using the same, and structural part manufactured using the method: A method of manufacturing a structural part through diffusion bonding in solid state without secondary materials after stacking multi-sheet metal and a tool thereof are disclosed. The tool for diffusion boding of multi-sheet metal includes a top tool having a top gas inlet, a central tool coupled to the top... Agent: Rabin & Berdo, Pc

20080217386 - Conductive ball mounting apparatus and conductive ball mounting method: In a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of pads which are provided on a substrate and on which an adhesive is formed, the conductive ball mounting apparatus includes: a conductive ball container for containing a plurality of conductive balls therein and... Agent: Drinker Biddle & Reath (dc)

20080210740 - Low-profile capillary for wire bonding: A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less than the first outside diameter. The wire bonding tool also includes... Agent: Kulicke And Soffa Industries, Inc.

20080210741 - Weld repair as a combined heat treatment brazing process for metallic components: A method for welding and brazing a metallic component, such as, for example, a metallic component in a turbine, such as a bucket or blade. The method includes the steps of welding the metallic component to create a welded component; covering the welded component with a braze material to create... Agent: Nixon & Vanderhye P.C.

20080210742 - Metal encapsulation: A process for encapsulating metal microparticles in a pH sensitive polymer matrix using a suspension containing the polymer. The process first disperses the metal particles in a polymeric solution consisting of a pH sensitive polymer. The particles are then encapsulated in the form of micro-spheres of about 5-10 microns in... Agent: Fish & Richardson P.C.

20080210743 - Process of fabricating stack component: A process of fabricating a stack capacitor includes the following steps. First of all, multiple energy storage units having respective first electrodes and second electrodes at opposite sides are provided. These energy storage units are then stacked to have the first electrodes contact with each other and the second electrodes... Agent: Kirton And Mcconkie