Metal fusion bonding inventions 08/08

20080203136 - Horn attachment arm: A horn attachment arm for a bonding apparatus that performs high speed bonding with high accuracy to a large sized workpiece is provided. The horn attachment arm includes a fixing bracket fixed to a moveable member of a driving motor and a ultrasonic horn attaching bracket for attaching an ultrasonic... Agent: Quinn Emanuel Urquhart Oliver & Hedges, LLP Koda/androlia

20080203137 - Substrate bonding methods and system including monitoring: Bonding methods and a bonding system including monitoring are disclosed. In one embodiment, a method of monitoring bonding a first and second substrate includes: providing a plurality of piezoelectric sensors to a substrate mounting stage of a substrate bonding system; and monitoring a force change measured by the plurality of... Agent: Hoffman Warnick LLC

20080203138 - Method of mounting an electronic component and mounting apparatus: In a method of mounting an electronic component on a substrate, electrode terminals on at least one of the substrate and the electronic component are composed of solder bumps. The electrode terminals of the substrate and the electrode terminals of the electronic component are placed in contact and ultrasonic vibration... Agent: Staas & Halsey LLP

20080203139 - Method for controlling weld metal microstructure using localized controlled cooling of seam-welded joints: The present invention provides a method for welding and heat-treating seam-welded constructions of hardenable steel and ferrous alloys with reduced weld-zone hardness and improved weld-zone ductility and toughness. This method consists of controlling the cooling rate of the seam weld with a secondary heat source, applied after the weld cools... Agent: Russo & Duckworth, LLP

20080203140 - Method and device for brazing material application, method for producing a honeycomb body, exhaust gas treatment unit and vehicle: A device and a method for applying brazing material to an at least partially structured metal foil include a) providing at least one flat metal foil, b) shaping the at least one metal foil to produce a structure, and c) applying brazing material to the at least one metal foil.... Agent: Lerner Greenberg Stemer LLP

20080197168 - Wire cleaning guide: A wire cleaning guide for guiding a wire in a feed direction and to clean the wire, including a gas supply nozzle for supplying plasma generating gas, a plasma generating chamber with plasma generating gas supplied from the gas supply nozzle thereto for transforming the plasma generating gas into plasma... Agent: Quinn Emanuel Urquhart Oliver & Hedges, LLP Koda/androlia

20080197169 - Method and device for providing an electric connection: A brazing gun (18) is electrically connected to a power supply (19), the brazing gun having an opening for holding a brazing pin, and the brazing pin having a circular cross section. A bending tool is used for bending a stripped section of an electric wire to a circular shape,... Agent: Intellectual Property Group Fredrikson & Byron, P.A.

20080197170 - Single and multi-spectral illumination system and method: A stencil printer apparatus for depositing a solder paste onto the surface of the electronic substrate, comprising a frame, a stencil coupled to the frame, the stencil having a plurality of apertures, a dispenser coupled to the frame, the stencil and the dispenser being configured to deposit the solder paste... Agent: Lowrie, Lando & Anastasi, LLP

20080197171 - Bond head link assembly for a wire bonding machine: A bond head assembly for use with a bonding machine includes a wire bonding tool and a link mechanism coupled between the wire bonding tool and the wire bonding machine. The link mechanism includes a frame, a plurality of arm links pivotably connected to the frame, and a tool support... Agent: Kulicke And Soffa Industries, Inc.

20080197173 - Method for forming solder bump and method for mounting semiconductor device: [Means for Solving Problem] A flat plate 10 or 30 having a plurality of projections 12 or recesses 32 thereon is prepared; the flat plate is aligned to oppose an electronic component 14 or 34 and a resin composition 18 or 19 including a solder powder 22 or 23 is... Agent: Mcdermott Will & Emery LLP

20080197172 - Bonding tool: Means to increase the UPH of TAB bonding on an HSA manufacturing line to allow a higher UPH to keep cost down and also allow the use of one or more grounds to be add to an HSA to help control ESD without lowering the UPH or redesigning the lines... Agent: Carr & Ferrell LLP

20080190992 - Apparatus and method for hot bonding metal plates: The present invention relates to an apparatus and a method for hot bonding metal plates having advantages that removing an oxidation film of the metal plates and bonding the metal plates are simultaneously accomplished and a bonding force between the metal plates is enhanced by applying a strong bonding pressure... Agent: Lexyoume Ip Group, Llc

20080190993 - Ribbon bonding tool and process: An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underlying bonding surface.... Agent: Macpherson Kwok Chen & Heid LLP

20080190994 - Method for forming a tight-fitting silver surface on an aluminium piece: The invention relates to a method for forming a highly electroconductive surface on an aluminum piece. A highly conductive layer of silver is formed on the piece by means of a eutectic join. The temperature of the aluminum piece is raised gradually and the oxide layer formed on the surface... Agent: Smith-hill And Bedell, P.c.

20080190995 - Welding tape and method of use: A protective tape for use while welding together two metal components is provided. The protective tape includes a non-metal carrier sheet that is extensible and substantially flexible such that it closely conforms to irregular surfaces of a metal component. The protective tape also includes a covering on a first side... Agent: Wolf Greenfield & Sacks, P.c.

20080185420 - Apparatus and method for removing weld flash: An apparatus and method for removing weld flash from a structural assembly are provided. The apparatus generally includes a tool with a head that defines an edge and first and second opposite surfaces disposed at an angle converging toward the edge. A shaft, which extends from the first surface of... Agent: Alston & Bird, LLP

20080185421 - Process for reflow soldering: The invention relates to a process for the reflow soldering of printed circuit board assemblies provided with solder paste in a sealed chamber with heating in the chamber. In a first process step, the pressure in the chamber is amplified in comparison with the atmospheric pressure and the temperature in... Agent: Birch Stewart Kolasch & Birch

20080185422 - Stainless steel for fume extracters: A stainless steel for a fume extractor which has a main body formed by stamping and soldering includes a stainless steel base board of a selected thickness. The stainless steel base board has the surface treated to form a coarse surface. Then the surface of the stainless steel base board... Agent: Joe Mckinney Muncy