Metal fusion bonding inventions 07/08

20080179377 - Restotration method for deteriorated part and restoration apparatus for deteriorated part: The present invention has as its object the provision of a restoration method for a deteriorated part, which is capable of easily and reliably repairing and restoring a deteriorated part generated in a metal member to reliably prolong the lifetime of the metal member. Specifically, a local heating step of... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20080179378 - Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore: A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage, a load and transfer device and a control device... Agent: Wenderoth, Lind & Ponack L.L.P.

20080179379 - Solder joint structure, soldering method, and electronic-component manufacturing apparatus using the same structure and the method: A structure of solder joint structure formed of zinc-based lead-free solder having excellent characteristics is disclosed. Between a first lead-free solder layer and a soldering pad, the following layers are formed: a tin-copper alloy layer formed on the pad; a first alloy layer formed of second lead-free layer of which... Agent: Ratnerprestia

20080179380 - Radiation-emitting semiconductor component and method for producing the semiconductor component: A radiation-emitting semiconductor component has an improved radiation efficiency. The semiconductor component has a multilayer structure with an active layer for generating radiation within the multilayer structure and also a window having a first and a second main surface. The multi-layer structure adjoins the first main surface of the window.... Agent: Fish & Richardson PC

20080179381 - Diffusion braze repair of single crystal alloys: A method for repairing a metal component having a crack, the method comprising depositing a brazing material into the crack of the metal component, and exposing the metal component to a plurality of heating cycles. Each successive heating cycle has a temperature that is less than a temperature of a... Agent: Kinney & Lange, P.A.

20080179382 - Termination bonding: Disclosed are methodologies for producing lead type electrical components. Components are placed in a lead frame with termination paste applied to selected portions of the component. Upon firing of the assembled lead frame and electrical components, the electrical components are concurrently terminated, and provided with strongly secured leads.... Agent: Dority & Manning, P.A.

20080179383 - Solder paste composition and solder precoating method: A solder paste composition used in a solder precoating method of forming solder bumps by forming a dam around electrodes on a substrate, filling a solder paste composition on the electrodes within opening parts surrounded by the dam, and heating the solder paste composition filled, so that solder is adhered... Agent: Sughrue Mion, PLLC

20080173694 - Ultrasonic welding system: An ultrasonic welding system is provided for creating an ultrasonically welded seam in a plurality of layers of a material, for example a foil bag having a plurality of foil layers. The system preferably includes a sonotrode and an anvil constructed and arranged to apply a welding force at an... Agent: Stroock & Stroock & Lavan LLP

20080173695 - Friction stir welding apparatus and robot employing the apparatus: A friction stir welding apparatus capable of stably applying a pressure force without enlarging the apparatus, and a robot having thereof are provided. A rotating tool is provided with a rotational shaft and a hollow surrounding shaft is provided to surround the rotational shaft. The rotational shaft is movable along... Agent: Marshall, Gerstein & Borun LLP

20080173696 - Joining method and structure of metal members: In a first step, a roof panel and a front header are joined at plural frictional spot joint portions at a front-end frictional joint area, and the roof panel and a rear header are joined at plural frictional spot joint portions at a rear-end frictional joint area. The roof panel... Agent: Studebaker & Brackett Pc

20080173697 - Method and apparatus for the correction of defective solder bump arrays: Disclosed is a method and apparatus for the correction of defective solder bump arrays arranged in a plurality of cavities in a mold. In the method, a faulty solder bump is searched, identified and located (i.e., its position is determined) in an arrangement of solder bumps disposed in cavities of... Agent: Heslin Rothenberg Farley & Mesiti Pc

20080173698 - Materials for use with interconnects of electrical devices and related methods: Certain examples disclosed herein are directed to materials that are designed for use in interconnects of electrical devices such as, for example, printed circuit boards and solar cells. In certain examples, a two-step solder may be used to reduce stresses on the materials used in the production of the electrical... Agent: Lowrie, Lando & Anastasi, LLP

20080173699 - Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board: A method for the attachment of solder powder includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness thereto to form a tackified part, attaching solder powder by a dry or wet process to the tackified part, and then... Agent: Sughrue Mion, Pllc

20080173700 - System and method for solder bonding: A volatile soldering aid for solder bonding surfaces. A thermally decomposable solid that is suspended in a carrier or dissolved in a solvent is incorporated in a solder assembly having two surfaces separated by a solder preform. The solvent or carrier is subsequently evaporated, and the assembly is heated to... Agent: Mehlin Dean Matthews

20080173701 - Chromium-free welding consumable: A chromium-free welding consumable and a method of welding stainless steel to reduce the presence of chromium emissions. The consumable is made from an alloy that reduces the emission of chromium during a welding process, and include predominantly nickel, with between approximately five and ten weight percent copper, up to... Agent: Dinsmore & Shohl LLP

20080169334 - Copper welding solid wire with good arc stability: Disclosed is a copper plating solid wire for MAG welding with excellent arc stability during welding, in which the solid wire for MAG welding is manufactured by high-speed copper plating by being immersed in a copper plating solution to make a plating layer of 0.2-1.0 μm in thickness, and the... Agent: Saliwanchik, Lloyd & Saliwanchik

20080169335 - Welding apparatus and method: One embodiment of a welding apparatus includes a stationary welding device that defines a stationary weld zone, and a support that moves a weld member through the stationary weld zone.... Agent: Ingrid Mctaggart

20080169336 - Apparatus and method for deep groove welding: A welding apparatus is disclosed. The welding apparatus includes a torch body comprising at least one core, a plurality of contact tips extending in a direction from the at least one core, and a plurality of gas supply tubes disposed proximate the plurality of contact tips, the plurality of gas... Agent: Cantor Colburn, LLP

20080169337 - De-soldering tool: A de-soldering tool includes an upper heating device having an upper heating element for applying heat to an upper mating structure, the upper mating structure arranged in a pattern matching contacts in an electrical connecter soldered to a printed wiring board; a lower heating device having a lower heating element... Agent: Cantor Colburn, LLP

20080164298 - Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece: Stenciling machines and methods for forming solder balls on microelectronic workpieces are disclosed herein. In one embodiment, a method for depositing and reflowing solder paste on a microelectronic workpiece having a plurality of dies includes positioning a stencil having a plurality of apertures at least proximate to the workpiece. The... Agent: Perkins Coie LLP Patent-sea

20080164299 - Heat sink liner for welding to chrome-plated workpieces: A method and apparatus for welding a first workpiece to a second workpiece having a first surface to be chrome plated welds a heat sink liner to a second surface of the second workpiece opposite the first surface. The first surface of the second workpiece is them chrome plated. The... Agent: Harness, Dickey & Pierce, P.L.C

20080164300 - Method of making circuitized substrate with solder balls having roughened surfaces, method of making electrical assembly including said circuitized substrate, and method of making multiple circuitized substrate assembly: A method of making a circuitized substrate (e.g., a chip carrier) with solder balls thereon which are each formed in such a manner so as to have rough surfaces thereon, thereby providing enhanced connections with conductors (e.g., conductive sites) of an electronic device (e.g., a semiconductor chip). Methods of making... Agent: Lawrence R. Fraley Hinman, Howard & Kattell, LLP

20080164301 - High temperature laser welding: A method of welding superalloy components comprising: pre-heat one or more components to be welded to a temperature of at least 1500° F. in a substantially enclosed inert gas atmosphere; supplying multiple fillers to the weld zone, at least two of said fillers having different compositions; and welding the one... Agent: Nixon & Vanderhye, PC

20080156847 - Continuous motion spin welding apparatus, system, and method: An apparatus, system, and method for friction (spin) welding separate parts of a plastic component to one another. The apparatus includes a rotational drive assembly coupled to a turret assembly arranged to be rotationally driven thereby about a longitudinal axis. The turret assembly includes at least one drive mechanism and... Agent: Miles & Stockbridge Pc

20080156846 - Friction stir welding of metal matrix composites: A method of making a fiber-reinforced component includes: providing a first composite member having a metal matrix with reinforcing fibers distributed therein; providing a second composite member having a metal matrix with reinforcing fibers distributed therein; and joining the first member to the second member by friction stir welding along... Agent: Adams Intellectual Property Law, P.a.

20080156848 - Method for direct bonding of metallic conductors to a ceramic substrate: A method to provide direct bonding of wires to silicon for microelectronic and micro-electromechanical systems (MEMS). The method includes preparing a rough “pothole” during one of the many deep etch steps already provided in MEMS fabrication. The method also includes roughening of the smooth silicon surface in and around the... Agent: Edward Langer C/o Shiboleth Yisraeli Roberts Zisman & Co.

20080156849 - Mold shave apparatus and injection molded soldering process: An apparatus and a method for the removal of excess solder or contaminant, which are encountered on the surfaces of injection mold prior to the transfer of a solder on a silicon wafer. More particularly, there is provided for the removal of excess solder, which may be present on a... Agent: Scully, Scott, Murphy & Presser, P.c.

20080156850 - Apparatus and method for preventing accumulation and adhesion of weld spatter: A tooling fixture is adapted to preserve the dimensional accuracy of critical dimension locating components associated with the fixture. The tooling fixture has a plurality of component locators having a body with at least one surface for accurately constraining at least one component part within the tooling fixture. The surfaces... Agent: Mckee, Voorhees & Sease, P.L.C

20080156851 - Flux spray atomization and splash control: Methods and apparatus to improve flux spray atomization and/or splash control are described. In one embodiment, a flux nozzle includes a plurality of injection holes to deposit flux fluid through an exit hole of an air cap onto a substrate (such as a printed circuit board). The flux fluid may... Agent: Caven & Aghevli C/o Intellevate, Llc

20080156852 - Solder flux composition and process of using same: A solder flux composition is formulated to lower contact wetting angles on bond pads, and to remain stable until the reflow temperature of the solder. A process includes contacting a bond pad with the solder flux composition and reflowing the solder bump that is in contact with the bond pad... Agent: Schwegman, Lundberg & Woessner, P.a.