Metal fusion bonding inventions 05/08

20080121679 - Flanged transducer having improved rigidity: A transducer is provided that comprises a horn that is configured to transmit vibrations along its length during operation in the form of an oscillatory waveform, such oscillatory waveform having a plurality of vibration nodal points. An ultrasonic generator is coupled to one end of the horn and a bonding... Agent: Ostrolenk Faber Gerb & Soffen

20080116245 - Lamp-based swet welding apparatus: A welding apparatus for welding a workpiece includes a welding-containment box of sufficient size to contain the workpiece at a welding position, and a welder disposed within the welding-containment box to be operable on the workpiece at the welding position. A heating apparatus includes four heaters disposed within the welding-containment... Agent: Mcnees, Wallace & Nurick Llc

20080116246 - Method for making a component including fluid flow channels: Grooves (12) are made in at least one face (21) of a base plate (10); the grooves (12) are sealably blocked by means of thin strips (16); a lid (22) is diffusion-welded with hot isostatic compression on the face (21) of the base plate (10) with the grooves above the... Agent: Anderson, Kill & Olick, P.c.

20080116247 - Motor vehicle body framing apparatus: A motor vehicle body framing apparatus located at a welding station of a motor vehicle assembly line for use in precisely positioning body panels arriving at the welding station for welding. The apparatus includes a base structure positioned at the welding station and having a longitudinal extent in the direction... Agent: Young & Basile, P.c.

20080110962 - Process for joining materials using a metallic heat source within a controlled atmosphere: This invention is directed to a process for joining materials comprising providing an assembly comprising at least one material layer; at least one metal heat source; and at least one solder layer, each solder layer disposed between each metallic heat source and each material layer; placing the assembly in a... Agent: The Boc Group, Inc.

20080110963 - Methods of securing a thermocouple to a ceramic substrate: Methods of securing a thermocouple to a ceramic substrate are provided. The thermocouple includes a pair of wires that define a junction, and the method comprises directly bonding the junction of the thermocouple to the ceramic substrate. In one form, the junction is directly bonded using an active brazing material.... Agent: Brinks Hofer Gilson & Lione

20080105731 - Measurement method and device for bead cutting shape in electric resistance welded pipes: To precisely measure bead cutting shapes of electric resistance welded pipes without being affected by difference in luminance level between cut and uncut portions in optical cutting images, an image is obtained by overlaying an optical cutting image with the optical cutting image subjected to thinning processing. A profile of... Agent: Young & Thompson

20080105732 - Method of manufacturing expansion joint: A method of manufacturing an expansion joint includes steps of: marking parts, which will form the expansion joint, on a piece of raw material, so that the original 360 degree shape of the expansion joint is equally divided by the parts, and cutting the marked parts from the raw material;... Agent: W. Norman Roth

20080105733 - System and method for assembling motor-vehicle body structures or sub assemblies thereof: Motor-vehicle bodies or sub-assemblies thereof are assembled in a welding-assembly station with the aid of frames arranged at the two sides of the conveying line that traverses the station, said frames being provided with fixtures for locating and clamping the various parts of the body. The side frames are moved... Agent: Young & Basile, P.C.

20080105734 - Solder ball mounting method and solder ball mounting apparatus: A solder ball mounting method includes a step of providing a flux on electrodes of a substrate, a step of arranging a plurality of solder ball mounting masks in which ball feeding openings are formed in positions opposing to the electrodes and opening areas of the ball feeding openings are... Agent: Rankin, Hill & Clark LLP

20080099531 - Apparatus for delivering shielding gas during wire bonding: An apparatus is provided for supplying a shielding gas during the bonding of wires to electronic components with a bonding tool comprising a horn and a capillary. The apparatus comprises a main body with an elongated slot having a width that extends into the main body from a side of... Agent: Ostrolenk Faber Gerb & Soffen

20080099532 - Wire bonding apparatus and wire bonding method:

20080099533 - Method for controlling microstructure via thermally managed solid state joining: A method for creating a solid state joint is disclosed. The method includes providing an adjoining apparatus that includes a pin tool, a backing plate and a thermal control plate disposed below the backing plate. The method also includes rotating the pin tool and traversing the pin tool relative to... Agent: General Electric Company Global Research

20080099534 - System, method, and apparatus for reinforcing friction stir processed joints: Friction stir welded joints are reinforced with a strengthening material that is applied directly to the joint surfaces to counteract the loss of desirable physical properties in the workpieces being joined. The strengthening material is stirred into the weld nugget during processing and locates at the bond interfaces to form... Agent: Bracewell & Giuliani LLP

20080099535 - Method for mounting electronic component on substrate and method for forming solder surface: A method for mounting an electronic component on a substrate includes: forming an Au bump (24) on a surface of an electrode (20) of a substrate (10); placing an Sn-based solder sheet (26) on the Au bump; subjecting the Sn-based solder sheet and the Au bump to reflow soldering, to... Agent: Rankin, Hill & Clark LLP

20080099536 - Micro component removing method and micro component removing apparatus: A method and a apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surface (12a) of a micro component (12) opposite to the... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20080099538 - Braze pre-placement using cold spray deposition: Methods are described for applying braze filler material onto a component part interface having a uniform thickness regardless of the interface contour using cold spray deposition technology.... Agent: Bachman & Lapointe, P.C. (p&w)

20080099537 - Method for sealing vias in a substrate: According to one embodiment of the invention, a method for sealing one or more vias comprises providing a first substrate having vias, forming an adhesion layer on an inner surface of the vias, sandwiching a solder layer between the first substrate and a second substrate, and elevating of the first... Agent: Baker Botts LLP

20080099539 - Solder printing process to reduce void formation in a microvia: In one embodiment, a method is provided. The method comprises filling a microvia formed in a bond pad with solder paste comprising solder balls of the first size; and coating the bond pad with solder paste comprising solder balls of the second size, wherein the second size is greater than... Agent: Blakely Sokoloff Taylor & Zafman