Metal fusion bonding inventions 04/08

20080093417 - Wave soldering tank: A wave soldering tank includes a soldering tank body for housing molten solder and a solder feed chamber disposed within the soldering tank body. An axial-flow, multiple-blade screw-type pump is disposed so as to draw molten solder into the solder feed chamber through an inlet and discharge the molten solder... Agent: Michael Tobias

20080093416 - Wire bonding and wire bonding method: A tip end portion and an outer surface of a capillary (or of a wedge tool) used in, for instance, a wire bonding apparatus and method, being covered by a diamond layer with a heating element attached to the outer surface thereof. The inside of the capillary is formed by... Agent: Quinn Emanuel Koda & Androlia

20080093418 - Multifunctional reactive composite structures fabricated from reactive composite materials: A reactive composite structure having selected energetic and mechanical properties, and methods of making reactive composite structures enabling the construction of complex parts and components by machining and forming of reactive composite materials without compromising the energetic or mechanical properties of the resulting reactive composite structure.... Agent: Polster, Lieder, Woodruff & Lucchesi

20080093419 - Method for connecting switch parts made of austenitic manganese steel casting, or austenitic manganese steel rails, with a rail of carbon steel: In a method for connecting switch or crossing parts made of austenitic manganese steel casting, or austenitic manganese steel rails, with rails of carbon steel, the parts to be connected, optionally upon interposition of an intermediate piece, are connected by friction welding, wherein the weld with the austenitic manganese steel... Agent: Chapman And Cutler

20080093420 - Process for the friction-welding of components: The invention relates to a method for friction welding components (35) during which both components are rotated relative to one another during a heating phase under mutual axial pressing force (F) generated by a pressing force actuator (8a) at the location to be welded when component (3) is at rest... Agent: Birch Stewart Kolasch & Birch

20080093421 - Device for purifying exhaust gases of a motor vehicle and method for the production thereof: A vehicle exhaust gas purification device has a multipart outer housing (10) including a tube (12) and end walls (14) that have been reshaped into funnels. The tube (12) and the end walls (14) are fitted into each other and brazed, soldered or welded to each other.... Agent: Barnes & Thornburg LLP

20080093422 - Low viscosity precursor compositions and methods for the deposition of conductive electronic features: A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low... Agent: Jaimes Sher, Esq. Cabot Corporation

20080093423 - Low viscosity precursor compositions and methods for the deposition of conductive electronic features: A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low... Agent: Patent Administrator Cabot Corporation

20080093424 - Probe arrays and method for making: Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating... Agent: Microfabrica Inc. Att: Dennis R. Smalley

20080087708 - Resonator, ultrasonic die bonding head, and ultrasonic die bonding apparatus: A resonator is disclosed that may includes a vibrating member holding an electronic component and applying a vibration to the electronic component, and a depressing member applying a depressing force for a side of a substrate to the electronic component through the vibrating member. The depressing member includes leg portions... Agent: Arent Fox LLP

20080087709 - Bumping electronic components using transfer substrates: A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic component; and removing the sacrificial substrate. The transfer substrate may... Agent: Fish & Associates, PC Robert D. Fish

20080087710 - Rapid, reduced temperature joining of alumina ceramics with ni/nb/ni interlayers: Multilayer Ni/Nb/Ni interlayers form thin transient liquid films at reduced temperatures that enable the rapid joining of alumina ceramics, and produce joints of reliably high strength. Bulk alumina with polished and as-ground bonding surfaces have been successfully joined. The overall interlayer composition can exceed 95% Nb, and thereby provide an... Agent: Lawrence Berkeley National Laboratory

20080087711 - Conveying apparatus for objects and welding apparatus with such a conveying apparatus: A conveying apparatus with a first conveyor and a second conveyor is used a the welding apparatus and a welding method for container bodies and in particular can bodies between which conveyors the object to be welded is handed over. A control unit determines the take over position and/or the... Agent: Mccormick, Paulding & Huber LLP

20080083814 - Combination wedge bonding and ball bonding transducer: A transducer configured for use with a manual wire bonding machine includes a body portion including an end portion, the end portion defining a bonding tool aperture configured to receive at least a portion of a bonding tool. The transducer also includes a first tightening mechanism for securing a ball... Agent: Kulicke And Soffa Industries, Inc.

20080083815 - Moveable arm assembly for a wire bonder: A wire bonding machine includes a moveable arm assembly and at least one component for a ball bonding operation of the wire bonding machine supported by the moveable arm assembly. The moveable arm assembly is configured to move between a ball bonding position and a wedge bonding position. When the... Agent: Kulicke And Soffa Industries, Inc.

20080083817 - Process control system for friction stir welding: A process control system for a friction stir welding machine employs a master set of parameters and subroutines to control multiple machine processes, including welding, drilling, milling and probing. Sub-sets of the master set comprising command parameters, limits parameters and measurement parameters are used to control the operation of a... Agent: Tung & Associates / Randy W. Tung, Esq.

20080083816 - Statistical process control of solder paste stenciling using a replicated solder paste feature distributed across a printed circuit board: Methods and systems for improving a solder paste stenciling process include obtaining data pertaining to solder paste deposits on a printed circuit board, the solder paste deposits deposited by a solder paste stenciling process through multiple identical apertures of a solder paste stencil, statistically analyzing the data, and correlating the... Agent: Agilent Technologies Inc.

20080083818 - Measuring the bonding of bonded substrates: A method of measuring bonding quality of a bonded substrate having an upper substrate on top of a lower substrate, the method comprising etching one or more windows in the upper substrate such that overlay measurement alignment marks on the upper substrate may be seen by a measurement system and... Agent: Pillsbury Winthrop Shaw Pittman, LLP

20080083819 - Repaired pre-soldering structure of circuit board and method thereof: A repair pre-soldering structure on a circuit board and a method thereof are proposed. A leave out on a circuit board without any pre-soldering is repaired by a micro-depositing process by applying micro droplets on the circuit board, or a short circuit formed by a pre-soldering with higher height is... Agent: Mr. Joseph A. Sawyer, Jr. Sawyer Law Group LLP

20080078813 - Carbon nanotube-reinforced solder caps, methods of assembling same, and chip packages and systems containing same: A carbon nanotube solder is formed on a substrate of an integrated circuit package. The carbon nanotube solder exhibits high heat and electrical conductivities. The carbon nanotube solder is used as a solder microcap on a metal bump for communication between an integrated circuit device and external structures.... Agent: Schwegman, Lundberg & Woessner, P.A.

20080078810 - Manufacturing method and manufacturing apparatus of printed wiring board: A solder ball is loaded on a bump having a small height (FIG. 5(B)) and the height of the bump is intensified by melting the solder ball by heating with laser (FIG. 5(C)). Thus, the heights of the bumps are adjusted within a requested allowable range. Because the bump is... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080078812 - Non-linear adaptive control system and method for welding: Nonlinear adaptive welders and power source controls are provided along with welding methods method for regulating a welding process, in which one or more welding waveform parameters are adapted in nonlinear fashion based on measured welding process feedback information.... Agent: Fay Sharpe / Lincoln

20080078809 - Saw flux system for improved as-cast weld metal toughness: A granular flux having controlled amounts of titanium and boron to facilitate in the formation of a weld metal having a high toughness without requiring refinement of the weld metal by reheating the weld metal, and enabling the slag to be easily removed from the weld bead.... Agent: Fay Sharpe LLP

20080078811 - Weld data acquisition: A weld data acquisition system collects data from the weld controller according to user selected collection parameters. The weld data acquisition system is able to transmit the data at high frequency to a weld data software utility that provides a user interface.... Agent: Calfee Halter & Griswold, LLP

20080078814 - Liquid rheology modifier: The present invention provides a liquid rheology modifier containing compounds (A) and (B) selected from combination (1) of compound (A) selected from cationic surfactants and compound (B) selected from anionic aromatic compounds and combination (2) of compound (A) from cationic surfactants and compound (B) selected from brominated compounds; and dicarboxylic... Agent: Birch Stewart Kolasch & Birch

20080078815 - Method for manufacturing sealed battery: The method for manufacturing a sealed battery of the invention includes an ultrasonic fusion process whereby layers of a positive electrode substrate exposed portion 11 are ultrasonically fused to form a positive electrode fused portion 11a at the positive electrode substrate exposed portion 11, and layers of a negative electrode... Agent: Westerman, Hattori, Daniels & Adrian, LLP