Metal fusion bonding inventions 03/08

20080073406 - Multi-part capillary: A bonding tool for bonding a wire to a substrate. The bonding tool has a cylindrical body portion formed from a first material and a conical tip portion separately formed from a second material. The conical tip portion is coupled to one end of the body portion.... Agent: Kulicke And Soffa Industries, Inc.

20080073407 - Deep access large ribbon bond head: A ribbon bond head capable of deep access bonding is configured to pass the bonding ribbon outside the transducer, e.g., in front of the transducer, instead of through the transducer. A clamping mechanism includes a stationary flat clamp base and a movable clamp arm with an opening, where the bonding... Agent: Macpherson Kwok Chen & Heid LLP

20080073408 - Movable electronic flame-off device for a bonding apparatus: A bonding apparatus is provided that comprises a bonding tool for bonding wire onto an electronic device secured by a clamping device. The clamping device is locatable at a first position to clamp the electronic device during bonding and a second position at a raised height to release the electronic... Agent: Ostrolenk Faber Gerb & Soffen

20080073409 - Friction stir welding head and method for controlling a friction stir welding head: The invention relates to a friction stir welding head having a housing and a welding tool with a rotating welding pin and a rotating shoulder tool for welding workpieces which rest on a workpiece rest, with the shoulder tool, which rotates in synchronism with the welding pin, coaxially surrounding the... Agent: Jenkins, Wilson, Taylor & Hunt, P. A.

20080073410 - Method of testing bonded connections, and a wire bonder: A method of testing wire-bond connections between a bonding wire and a substrate surface. The wire-bond connections are produced by a bonding head with a bonding tool and a wire clamp associated with the bonding tool under pressure and the action of ultrasound and/or heat. After the bonded connection has... Agent: Knobbe Martens Olson & Bear LLP

20080073411 - Sputtering target and method for preparation thereof: A sputtering target prepared by the butt joining of metal sheets being made of the same material, wherein an intermetallic compound in a joined portion has an average particle diameter of 60% to 130% of the average particle diameter of the intermetallic compound in a non-joined portion is provided. In... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080073412 - Method for manufacturing a cutting pick and the resulting pick: A cutting pick comprising a cutting tip 10 formed such as from SiC-D and a metal pick body 11. The pick body 11 has a greater coefficient of thermal expansion than the cutting tip 10. The pick body 11 includes a generally cylindrical cavity 14 within which is received a... Agent: Drinker Biddle & Reath (dc)

20080073413 - Apparatus and method for supplying electrically conductive material: In a conductive material supply apparatus that can connect a small slider electrode and a wiring electrode on a flexure in a miniaturized magnetic head, electrically conductive material is supplied, with the aid of flow of nitrogen gas that is pressurized to a first pressure, into the interior of a... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080073414 - Flux composition for solder, solder paste, and method of soldering: Soldering flux compositions, solder pastes, and methods of soldering using the same are provided, that exhibit excellent wettability, give highly reliable solder joints, and have superior storage stability. The flux composition contains at least one compound having at least one blocked carboxyl group selected from the group including compound (X)... Agent: Darby & Darby P.C.

20080067214 - Dissimilar metal transition for superheater or reheater tubes: A tube joint (16) for joining dissimilar metal sections (12, 14) of a superheater or reheater tube (10) is formed using a hot isostatic press process applied to at least two different metals. A first end of the tube joint (16) is formed from a first metal which has substantially... Agent: Alstom Power Inc. Intellectual Property Law Dept.

20080067215 - Friction spot joining method: A plurality of steel plates including at least one first non-coated steel plate and at least one metal-coated steel plate are prepared. The plurality of steel plates are overlaid in such a fashion that at least one of the two steel plates located on the respective sides in the overlaying... Agent: Nixon Peabody, LLP

20080067216 - Bonding structures for containers and method of bonding same: A bonding structure for a container member is disclosed. The container member has an opening and a covering member for covering the opening. The container member and covering member are abutted with each other and bonded by a friction stir welding operation. The bonding structure for the container and covering... Agent: Young & Basile, P.C.

20080067217 - Connection of a steel fastening element to a flat aluminium component: The invention relates to a connection of a rotationally symmetrical steel fastening element to a flat aluminium component. The fastening element is provided with an electroplated aluminum coating and, at its end facing the component, forms a cone with a cone angle of at least α=174°, wherein, through rotation and... Agent: Birch Stewart Kolasch & Birch

20080067218 - Method and computer program for the self-assembly of a nanostructure: Method for assembling a micro-, sub-micro- or nano-scale structure includes the steps of providing a set of cells (1A-5A) designed to assemble into a cell structure (C) in a predetermined order. The set of cells (1A-5A) are brought into contact with at least one seed so that a cell structure... Agent: Dilworth & Barrese, LLP

20080067219 - Apparatus and method for wave soldering: A device and method for wave soldering work pieces is disclosed which moves the workpiece to undergo soldering along a specific path across at least one wave of solder created by a solder reservoir. An inert gas atmosphere is located above the solder reservoir, with oxygen largely excluded, where the... Agent: Crowell & Moring LLP Intellectual Property Group

20080067220 - Welded component: A welded component includes at least one high temperature segment of a high alloy Cr steel with high creep strength and a low temperature segment of a low alloy steel with high toughness and/or a high yield strength which are connected materially to one another via a weld joint. In... Agent: Buchanan, Ingersoll & Rooney PC

20080061110 - System for welding motor vehicle bodies: In a welding system comprising a welding station and various pairs of side frames, which can be positioned selectively in the welding station for clamping in the welding position bodies of different types, are provided magazines of side frames both upstream and downstream of the welding station. There are moreover... Agent: Young & Basile, P.C.

20080061111 - Solar cell fabrication apparatus: A solar cell fabrication apparatus includes a lower belt carrying a solar cell main body and tab lead to convey the same, and an upper belt pressing the same. A phosphor bronze plate is provided to apply an urging force against upper belts towards the lower belt. A plurality of... Agent: Kratz, Quintos & Hanson, LLP

20080061112 - Method for soldering charge coupled device and tooling thereof: A method for soldering charge coupled device to improve the yield, working efficiency and imperfection of manual soldering. The method includes the steps of heating a base of a tooling by a heating board; putting a circuit broad having solders on the base; melting the solders on the circuit board... Agent: Rosenberg, Klein & Lee

20080061113 - Welding condition monitoring device: A welding condition monitoring device for monitoring the welding state of a welding work portion by taking an image thereof by an image sensor having a wide dynamic range and capable of taking an image covering a very bright welding portion and relatively dark portion. The monitoring device selectively emphasizes... Agent: Fulbright And Jaworski LLP

20080061114 - Method for the fabrication of low temperature vacuum sealed bonds using diffusion welding: A method for fabricating low temperature vacuum-sealed bonds through the use of cold diffusion welding comprising the steps of depositing high adhesion layers on the working surfaces of details, depositing soft layers on working surfaces, and the mechanical attachment of the working surfaces under pressure at substantially low temperatures.... Agent: Borealis Technical Limited

20080061115 - Method for electrically connecting to a contact of a microelectronic component on a circuit board or substrate: A method is provided for making an electrical connection with a microelectronic component arranged on or embedded within a surface of a circuit board layer or a substrate. The microelectronic component has an electrical contact face that is accessible on a surface of the microelectronic component. An electrically conducting bump... Agent: Venable LLP

20080061116 - Method and device for reflow soldering with volume flow control: According to one aspect of the invention it is possible to rapidly heat a soldering item by reducing an initially larger volume flow at a constant or increasing temperature, effectively preventing small components from overheating. By using the volume flow of a convection heater to control effective heat transmission occurring... Agent: Sterne, Kessler, Goldstein & Fox P.l.l.c.

20080061117 - Lead-free solder alloy: A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one element of... Agent: Michael Tobias

20080054048 - Method of joining a microwave transparent component to a host component: A method of joining a microwave transparent component 36 to a host component 34 or 18 includes the steps of applying a Titanium-Tungsten (TiW) coating 44 to the microwave transparent component, applying a metal layer 46 over the TiW coating and brazing the microwave transparent component to the host. In... Agent: Pratt & Whitney

20080054047 - Microball placement solutions: Microball delivery solutions for solder bumping are generally described. In this regard, according to one example embodiment, a microball delivery assembly includes a mask with at least two microball holder(s) to hold at least two different sizes of microball(s) that may correspond with at least two different-sized openings on a... Agent: Intel Corporation C/o Intellevate, LLC

20080054049 - Mold and method for making a trim component: A method of forming a vehicle trim component includes providing a first component layer having a vent aperture formed therethrough. A second component layer is then formed adjacent a surface of the first component layer, wherein gas may flow through the vent aperture of the first component layer during the... Agent: International Automotive Components Group, LLC C/o Macmillan, Sobanski & Todd, LLC

20080054050 - Method for producing a welded connection and method for repairing a welded connection: A method produces a welded connection between first and second components each having inner and outer sides interconnected by an end face. The first component has a ferritic basic body carrying a plating at the inside and having an end face with a buffer layer of Ni-based alloy. The second... Agent: Lerner Greenberg Stemer LLP

20080054051 - Ultrasonic welding using amplitude profiling: An ultrasonic welding apparatus has a power supply coupled to a weld stack. The weld stack has an ultrasonic transducer coupled to a horn by a booster. The horn has a horn tip. The weld cycle of the ultrasonic welding apparatus is amplitude profiled so that during an initial period,... Agent: Harness, Dickey & Pierce, P.L.C

20080054052 - Method of manufacturing semiconductor device: A manufacturing method of a semiconductor device which can cut a wire easily, can obtain a suitable-shaped bump electrode, and can pull out a wire easily from a capillary is obtained. The method includes the step of forming a bump electrode on a pad with the wire which passed to... Agent: Mattingly, Stanger, Malur & Brundidge, P.C.