Metal fusion bonding inventions 02/08

20080048003 - Resonator, ultrasonic head, and ultrasonic bonder using the same: A resonator 15 includes: a main shaft 12 that is coupled to an ultrasonic vibrator 11 and extends in an advancement direction of an ultrasonic wave generated from the ultrasonic vibrator 11; and protrusions 13a and 13b protruding in a direction intersecting a longitudinal direction from a center plane Lc... Agent: Arent Fox LLP

20080048004 - Resonator, ultrasonic head, and ultrasonic bonder using the same: A resonator 15 includes: a main shaft 12 that is coupled to an ultrasonic vibrator 11 and extends in an advancement direction of an ultrasonic wave generated from the ultrasonic vibrator 11; and protrusions 13a and 13b protruding in a direction intersecting a longitudinal direction from a center plane Lc... Agent: Arent Fox LLP

20080048005 - Friction stir welding system and method: A friction stir welding method where a friction stir welding device is moved through a plurality of points that form an essentially conical shape as the device engages substrates to be welded to form a mechanical interlocking structure at an interface between the substrates.... Agent: Daimlerchrysler Intellectual Capital Corporation Cims 483-02-19

20080048006 - Wire bonder: A wire bonder suitable for wire bonding a chip disposed on a carrier and bonding pads of the carrier is provided. The wire bonder includes a stage, a heater plate, a compression plate, a pair of clamping bases, a pair of extended blocks and a capillary. The heater plate is... Agent: Jianq Chyun Intellectual Property Office

20080048007 - Tab lead soldering apparatus and tab lead soldering method: A tab lead soldering apparatus soldering a tab lead to a front face and a rear face of a solar cell has a first pressing mechanism pressing the tab lead toward the front face of the solar cell, a second pressing mechanism pressing the tab lead toward the rear face... Agent: Rader Fishman & Grauer PLLC

20080048008 - Method for step-down transition of a solder head in the injection molding soldering process: A method for dispensing solder bumps on a mold plate includes the steps of: relatively moving a fill head comprising an o-ring from a first location to a second location such that the o-ring decompresses as it crosses from the first location to the second location; filling at least one... Agent: Michael J. Buchenhorner

20080048009 - Paste for soldering and soldering method using the same: It provides metal-powder-contained flux disposed between bumps and circuit electrodes when electronic parts are mounted by soldering, the metal powder comprises a core metal formed of metal such as tin and zinc and a surface metal covering surfaces of the core metal formed of noble metal such as gold and... Agent: Mcdermott Will & Emery LLP

20080048010 - Clading complex piping geometry: A mounting fixture for a power plant nozzle which allows the user to perform a single set-up and alignment on a nozzle location for overlay, matching, and inspection technologies. Once the fixture is set-up, the user can mount and dismount welding, machining, and inspection equipment in less time than traditional... Agent: Vytas R. Matas

20080041919 - Devices for manipulating a work piece in a welding system: A welding system includes a resistance type or other type welder with a support member and a tool for holding a work piece supported on the supported member. The support member and tool are configured to provide a substantially gaseous fluid bearing between the support member and the tooling to... Agent: Krieg Devault LLP

20080041920 - Assembly for the interconnection of at least two components by means of an assembly and a receptacle element: An assembly for the interconnection of at least two components includes a press-station, a joining-station and a welding station. A receiver element with first base material and second receiver element with second base material is provided. In the press-station a first press assembly is located for pressing of the first... Agent: Robert L. Stearns Suite 2000

20080041921 - Friction stir fabrication: A low-temperature friction-based coating method termed friction stir fabrication (FSF) is disclosed, in which material is deposited onto a substrate and subsequently stirred into the substrate using friction stir processing to homogenize and refine the microstructure. This solid-state process is capable of depositing coatings, including nanocrystalline aluminum and/or metal matrix... Agent: Pietragallo, Bosick & Gordon LLP

20080041922 - Hybrid resistance/ultrasonic welding system and method: A hybrid resistance heating/ultrasonic welding method is used to join substrates. The resistance heating sufficiently softens or melts the substrates at an interface, and an ultrasonic wave is used solid state bond the substrates at the interface. The hybrid method can be used for both spot welding as well as... Agent: Daimlerchrysler Intellectual Capital Corporation Cims 483-02-19

20080041923 - Apparatus and method for forming solder wicking prevention zone and electronic part: The present invention provides an apparatus for forming a solder wicking prevention zone operating when a connector member with a connector is processed using molten solder, to hinder the solder from spreading to a contact site of the connector in a wettable manner. The apparatus includes a main forming agent... Agent: Frishauf, Holtz, Goodman & Chick, PC

20080035703 - Oxidation resistant solder preform: A solder preform includes a solder material, a diffusion barrier disposed adjacent to a surface of the solder material, and an oxidation barrier disposed adjacent to the diffusion barrier wherein the diffusion barrier is interposed between the solder material and the oxidation barrier. The solder preform can be disposed adjacent... Agent: Blakely Sokoloff Taylor & Zafman

20080035704 - Thermowelding apparatus and method for manufacturing battery module: An apparatus for performing thermowelding of, e.g., a battery module or the like. The surface of a heater of a thermowelding apparatus is subjected to surface treatment through coating of Teflon, fluoroplastics, or the like. Moreover, both side surfaces of the heater are folded. Surface treatment of the heater obviates... Agent: Christensen, O'connor, Johnson, Kindness, PLLC

20080035705 - Welding shield for coupling heaters: Systems for coupling end portions of two elongated heater portions and methods of using such systems to treat a subsurface formation are described herein. A system may include a holding system configured to hold end portions of the two elongated heater portions so that the end portions are abutted together... Agent: Shell Oil Company

20080035706 - Wire-bonding apparatus and wire-bonding method thereof: A wire-bonding apparatus is used for wire-bonding at least a first chip and a second chip on a substrate at the same time. The wire-bonding apparatus includes at least a first capillary, a second capillary, a driving unit, a processing unit and a database. The driving unit is used for... Agent: Birch Stewart Kolasch & Birch

20080035707 - Transient-liquid-phase joining of ceramics at low temperatures: A novel method for bonding components has been disclosed. For bonding ceramic components the method involves placing at least three metal interlayers between the components. There is a central core metal layer and two other metal layers placed on either side of the core layer adjacent the ceramic components. The... Agent: Lawrence Berkeley National Laboratory

20080035708 - Method of joining strands by mirror welding: The invention relates to a method of making a join between two strands (10, 20). The method comprises cutting each of the two strands at an angle relative to its longitudinal axis so as to obtain a cut surface (13, 23) on each strand. The cut surfaces of the two... Agent: Connolly Bove Lodge & Hutz LLP (for Cabinet Beau De Lomenie)

20080035709 - Bonding apparatus, ball forming device in said bonding apparatus, and ball forming method using said bonding apparatus: A ball forming device and method used in a bonding apparatus, including a bonding arm, a capillary attached to the bonding arm, an electronic flame off probe for forming a ball at the tip of a wire passing through the capillary, and a gas atmosphere forming unit for bringing the... Agent: Quinn Emanuel Koda & Androlia

20080035710 - Solder composition and solder layer forming method using the same: [Problem to be Solved] [Solution] A solder composition 10 is for forming a solder layer on an electrode 21 provided on a substrate 20. The solder composition 10 includes solder powder composed of a plurality of solder particles 12 coated with organic films 11, and a medium 13 having a... Agent: Greenblum & Bernstein, P.L.C

20080035711 - Cooling apparatus comprising metal tubes connected through soldered lap joints: A cooling apparatus, e.g. a refrigerator or a freezer, comprises an insulated chiller or freezer box, accessible by a door, and means for cooling the interior of the box, said means comprising a heat exchanger including a tube evaporator system, wherein a first part of the system is located inside... Agent: Pepper Hamilton LLP

20080029579 - Heating device: The invention relates to a heating device for heating an electrical or electronic component, with the heating device comprising a blower for conveying a gas stream and a heating apparatus through which the gas stream can be guided and heated. The heating device further comprises a heating storage apparatus which... Agent: Baker & Hostetler LLP

20080029578 - Out-of position friction stir welding of high melting temperature alloys: A system and method for performing friction stir welding of non-planar materials having high melting temperatures, wherein a process is provided for performing longitudinal and radial welds on objects such as pipes, flanges, tanks, and shrouds, and wherein an active or passive mandrel provides support for the friction stir welding... Agent: Morriss Obryant Compagni, P.C.

20080029581 - Method of joining together dissimilar metal members: A method of joining together dissimilar metal members, by superposing a first member formed of an aluminum plate and a second member formed of a steel plate on each other, and performing a friction stir welding operation by rotating a probe located coaxially with and at an end of a... Agent: Burr & Brown

20080029580 - Methods and apparatus for efficiently generating profiles for circuit board work/rework: A system includes a first module to store times and temperatures for phases in a profile to rework a populated printed circuit board (PCB) for a first integrated circuit (IC) on the PCB and a second module to store suggestions for modifying one or more of the times and the... Agent: Raytheon Company C/o Daly, Crowley, Mofford & Durkee, LLP

20080029582 - Positive hold tube weld stud assembly: A positive hold tube weld stud assembly connectable to a vehicle body panel includes a substantially hollow tubular-shaped body. The body includes an inner body wall defined by a body internal aperture. A raised engagement portion extends inwardly from the inner body wall. A first chamfer positioned proximate an end... Agent: Harness, Dickey & Pierce, P.L.C