Metal fusion bonding inventions 12/07

20070295781 - Tool assembly used with friction stir welding: A tool assembly which is particularly suitable for friction stir welding applications. The tool assembly includes a holder having an axis and one end adapted to be rotatably driven by a rotary drive mechanism about the holder axis. A tool having an axis is also provided and includes a tool... Agent: Gifford, Krass, Sprinkle,anderson & Citkowski, P.c

20070295782 - Endothermic connector for copper welding: The present invention provides a device to weld metallic elements. The device is an endothermic connector that comprises a chassis that is assembled by joining two equal halves around the end of a metallic rod with an assembling nut and a pressure nut. The chassis also accommodates a metallic cable,... Agent: John J. Martinez Md. Jd.

20070295783 - Multiple tip soldering with individually compliant tip: A multiple tip soldering tool is provided having a conductor adapted for conducting power from an external supply. The tool also has a segmented hot bar having first and second independent suspensions. Each suspension depends at a proximal end from the conductor and conductively supports a soldering tip at a... Agent: Fellers, Snider, Blankenship, Bailey & Tippens Suite 1700

20070295784 - Transition joint and method for attaching dissimilar metal tubes: A method is provided for welding together a tubular member of a first metal and a tubular member of a second metal that is dissimilar to the first metal. The method includes making a transition attachment by friction welding together end-to-end a first end of a rod of the first... Agent: General Motors Corporation Legal Staff

20070295785 - Microwave brazing using mim preforms: A method of producing a braze preform for microwave brazing includes providing a mixture of a brazing alloy in metallic powder form and a binder, and melting the binder and forming the mixture into a preform having a preselected shape. A method of bonding together two metallic components includes: providing... Agent: Adams Evans P.A.

20070295786 - Semiconductor device, manufacturing method and apparatus for the same: A highly reliable semiconductor chip electrode structure allowing control of interface reaction of bonding sections even in the case of using two- or three-element solder used conventionally is disclosed. A solder alloy making layer for preventing dissolving and diffusion of tin into tin-based lead free solder is thinly formed on... Agent: Sughrue Mion, PLLC

20070290023 - Tool for coating penetrating holes of heat-dissipating fins: A tool for coating a heat-conducting medium on penetrating holes of heat-dissipating fins mainly includes a hollow pipe body. One end of the pipe body has an annular recessed portion. The upper and lower ends of the recessed portion are formed respectively with an annular guiding slope. Further, on the... Agent: Hdsl

20070284408 - Reflow furnace: A reflow furnace comprises: carrier device to carry a printed circuit board with electronic components mounted thereon; a heating chamber to heat through an ambient gas the printed circuit board carried therein to solder the electronic components on a surface of the printed circuit board; and an ambient gas purification... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20070284407 - Joint-site structure for a friction welding method and method for producing said structure: A joint-site structure for a shaft/disk composite workpiece, in particular for joining a shaft 1 to a connection flange 2 of a hub part of the disk by means of friction welding. A respective defined gap 4, 4′ is incorporated between shaft 1 and connection flange 2 of the hub... Agent: Davidson, Davidson & Kappel, LLC

20070284409 - Highly compliant plate for wafer bonding: The present invention discloses a method that includes: providing two wafers; forming raised contacts on the two wafers; aligning the two wafers; bringing together the raised contacts; locally deflecting the two wafers; and bonding the raised contacts. The present invention also discloses a bonded-wafer structure that includes: a first wafer,... Agent: Intel/blakely

20070284414 - Assembly and method of assembling by soldering an object and a support: This assembly of an object and a support is achieved by using solder bumps. At least two wettability areas are made respectively on object and on support. Each solder bump ensures electrical contact and mechanical fixing firstly to one of the wettability areas of object and secondly to one of... Agent: Burr & Brown

20070284413 - Heat shield assembly: A heat shield assembly for use in soldering, brazing, or welding applications, and more specifically in plumbing, refrigeration, or air conditioning systems where it is desirable to shield a temperature sensitive component from the heat source used to perform a soldering, brazing, or welding operation. An additional use for the... Agent: Robert Charles Hill

20070284410 - Mim braze preforms: A method of making a braze preform includes: providing a mixture of a brazing alloy in metallic powder form and a binder; melting the binder and forming the mixture into a preform having a preselected shape; removing a majority of the binder from the preform; and heating the preform to... Agent: Adams Evans P.A.

20070284412 - Solder flux composition: A composition, a method, and a system for a solder flux are disclosed herein. In various embodiments, a solder flux composition may comprise a surfactant and less than about 20% of a carboxylic acid. In some of these embodiments, the solder flux composition may be used in lead-free soldering processes.... Agent: Schwabe, Williamson & Wyatt, P.C.

20070284416 - Wire bonding method for forming low-loop profiles: A method of forming a wire bond with a bonding tool is provided that comprises the steps of forming a ball bond onto a bonding surface, raising the bonding tool away from the ball bond to form a neck portion integrated with a top of the ball bond, locating a... Agent: Ostrolenk Faber Gerb & Soffen

20070284411 - Investment casting core assembly: In a method for manufacturing a combination investment casting core, a plurality of cores are each formed by cutting a metallic sheet to define a first portion and a number of separate second portions linked by the first portion. The second portions are bent out of local alignment with the... Agent: Bachman & Lapointe, P.C. (p&w)

20070284418 - Package structure of inverter apparatus and method of manufacturing the same: A package structure of an inverter apparatus includes at least four metal column supports arranged vertically to be spaced apart from each other, and sheet-metal bent beams connecting the column supports in transverse direction and longitudinal direction to form rectangular package structure. The metal column support is an aluminum die-cast... Agent: Kanesaka Berner And Partners LLP

20070284417 - Reflow furnace: In a second horizontal plate (18a) bottoming an atmosphere recovery box (18), there are formed circular holes (21) between blowout pipes (20) adjacent to each other. Each of partition walls (2) positioned above a conveyor (5) includes an upper portion formed from a heat-insulating wall (2a) including a heat-insulative material... Agent: Kilyk & Bowersox, P.l.l.c.

20070284415 - Semiconductor having a bonding wire and process: A semiconductor device having a bonding wire is disclosed. In one embodiment, it is a bonding wire for use in a wedge-wedge bonding process for bonding a semiconductor element. One embodiment includes a metallic wire core of greater hardness and a high electric and thermal conductivity and a metallic coating... Agent: Dicke, Billig & Czaja

20070284419 - Friction stir welding tool cleaning method and apparatus: The invention is directed to a friction stir welding tool cleaning method and apparatus for fixed and retractable pin tools. The method and apparatus use a heating component, a temperature indicator component, a controller component, and a rotatable tool cleaner component for cleaning fixed pin tools. An additional bore cleaner... Agent: Duke W. Yee

20070284420 - Integrated circuit chip formed on substrate: A method for coupling a semiconductor substrate to a receiving substrate is disclosed. The method comprising the step of providing a receiving substrate having at least one receiving pad formed thereon, the at least one receiving pad having a face and a portion substantially extending from the periphery of the... Agent: Conley Rose, P.C. David A. Rose

20070284421 - Device clamp for reducing oxidation in wire bonding: A device clamp configured for use with a wire bonding machine is provided. The device clamp includes a body portion defining at least one device aperture. Each of the at least one device apertures is configured to be positioned adjacent a bond site area of the wire bonding machine. The... Agent: Kulicke And Soffa Industries, Inc.

20070278278 - Light beam bonding: A method for performing soldering using a light beam, and a mask for blocking the light beam are provided. A connecting method is provided, being a method for connecting conducting lines and contacts using a light beam, including a step for installing conducting lines in regions wherein contacts are formed,... Agent: Harrington & Smith, PC

20070278279 - Method and apparatus for producing a chip-substrate connection: A method and an apparatus for producing a chip-substrate connection by alloying or brazing, using a solder containing two or more components with at least two metal-containing constituents X and Y. The first constituent X contains in particular gold or a similar precious metal, and the second constituent Y being... Agent: Lerner Greenberg Stemer LLP