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USPTO Class 228 | Browse by Industry: Previous - Next | All 11/2007 | Recent | 09: Oct | Sept | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | | 08: Dec | Nov | Oct | Sp | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | | 07: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | | 06: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Metal fusion bonding inventions 11/07Recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.Listing format for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 11/29/2007 > patent applications in patent subcategories. 20070272723 - Vibration welding apparatus and welding method: A vibration welding apparatus and a method for executing vibration welding of three or more work pieces made of a thermoplastic material to make them integral in a sandwich shape, comprises an upper tool means supporting a first work piece so as to apply a lateral motion to it by... Agent: Westerman, Hattori, Daniels & Adrian, LLP 20070272724 - Powder metal friciton stir welding tool and method of manufacture thereof: A friction stir tool has an axis of rotation and a welding tip that is made of powdered metal material.... Agent: Dickinson Wright PLLC 20070272725 - Soldering iron: Disclosed is a soldering iron comprising at least one replaceable soldering tip and a tip holder which supports the same and is provided with a handle section and a terminal housing section that adjoins the tip holder. In order to be able to remove a soldering tip from the remainder... Agent: Coats & Bennett, PLLC 20070272727 - Die pick and place tool: A die pick and place tool is used to pick up a semiconductor die and place it on a substrate. The die pick and place tool comprises a moving shaft, an adjustable bearing or an elastic element, and a pick-up head. The adjustable bearing or the elastic element is connected... Agent: Birch Stewart Kolasch & Birch 20070272726 - Method for jointing golf club head: A method for jointing a golf club head is provided, which uses a brazing joint process to perform the jointing operation. The method includes steps of providing a first component, providing a second component, coating a layer of active metal suitable for jointing with an active metal solder on the... Agent: Birch Stewart Kolasch & Birch 20070272728 - Apparatus and method for rotary friction welding: A rotary friction welding machine and method is disclosed. The rotary friction welding machine has a first rotating spindle and a second non-rotating spindle, where a first component of the components being connected to one another is positioned on the first spindle and a second component of the components being... Agent: Crowell & Moring LLP Intellectual Property Group 11/22/2007 > patent applications in patent subcategories.20070267461 - Process apparatuses: An apparatus includes an enclosure, at least one process chamber, a robot and at least one valve. The enclosure has a gas therein and at least one door configured to cover an opening into the enclosure. The gas includes at least one reduction gas. The robot is disposed within the... Agent: Duane Morris LLPIPDepartment (tsmc) 20070267462 - Method and apparatus for friction stir welding using spindle-in-spindle: A spindle head for performing friction stir welding includes concentric spindle shafts driven by stacked, coaxial motors contained within a spindle housing. The coaxial arrangement of the motors results in a more compact package. Each of the motors is concentrically arranged around one of the spindles by directly connecting a... Agent: Tung & Associates 20070267463 - Apparatus for mounting columns for grid array electronic packages: A vacuum controlled fixture is provided for positioning columns on sites of an electronic substrate. The fixture includes an internal chamber having spaced apart first and second surfaces extending beneath its principal face. A regular array of column receiving holes extends from the principal face through the first surface of... Agent: International Business Machines Corporation Dept. 18g 20070267464 - Cyclic hydrofluoroether compounds and processes for their preparation and use: A hydrofluoroether compound comprises at least one five- or six-membered, perfluorinated heterocyclic ring, each ring comprising four or five ring carbon atoms and one or two catenated heteroatoms selected from divalent ether oxygen atoms and trivalent nitrogen atoms, at least one of the catenated heteroatoms being a divalent ether oxygen... Agent: 3m Innovative Properties Company 20070267465 - Reflowing apparatus and reflowing method: A reflowing apparatus for mounting parts on a printed wiring board, has a fixed heating portion for blowing the hot air to the printed wiring board, and a moving heating portion for locally varying the temperature of the hot air blown by the fixed heating portion to the printed wiring... Agent: Arent Fox LLP 11/15/2007 > patent applications in patent subcategories.20070262122 - Apparatus for forming a body: An atmospheric shield for isolating a component from an external atmosphere is provided and comprising an envelope, and a base carrying a continuous channel, wherein the base and the envelope are arranged to define an enclosure within which the component to be isolated in use is located and such that... Agent: Oliff & Berridge, PLC 20070262118 - Component mounting apparatus and component mounting method: First components and second components in which bumps are formed on the lower surface thereof and laminate structures are formed by mounting them to stack with each other on a circuit board 13 are picked up from a component supply unit 1 using a placement head 16, and by lifting... Agent: Pearne & Gordon LLP 20070262120 - Lubricant for quick plastic forming of aluminum sheet: An aqueous lubricating composition comprising at least one divalent metal nitrate; at least one alkali metal hydroxide; at least one ionic surfactant; and at least one lubricant/release agent. Upon application to aluminum and titanium, the lubricating composition forms a dry film lubricant stable to heating to a temperature of 200... Agent: Henkel Corporation 20070262121 - Method of soldering component to substrate and electronic device made by the same: A method for soldering an electronic component to a substrate is provided. The method includes the steps of forming a metal layer on the substrate; applying a solder material on the metal layer; and performing a thermal process to transfer the solder material into a solder joint so as to... Agent: Reed Smith LLP 20070262117 - Earth/ground attachment for welding and cutting equipment: A contact assembly for mounting to a clamp to provide an earth/ground connection for arc equipment, the assembly comprising an outer metal housing providing a mounting body of generally cylindrical form, a solid metal contact block mounted within the body and extending through an open end of the body to... Agent: Harness, Dickey & Pierce, P.L.C 20070262119 - Wire bonding process for insulated wires: A process for bonding insulated wires is provided wherein a conforming free air ball is formed from an insulated wire to create a ball bond. A tip of the insulated wire is first positioned close to an electronic flame-off device and a first electric discharge is produced from the electronic... Agent: Ostrolenk Faber Gerb & Soffen 20070262123 - Method for producing metal strips: The invention relates to a method for joining cathode metal sheets to form crude strips that can be coiled and rolled and for the production of metal strips of a constant thickness from crude strips that have been produced from cathode metal sheets of varying thicknesses. The aim of the... Agent: K.f. Ross P.C. 20070262124 - Method and device for butt welding metal sheets of differing thicknesses with the aid of at least one height-adjustable tension roller that is located below the metal sheets: The invention relates to a method for butt welding metal sheets (1, 2), preferably sheet metal strips or blanks of differing thicknesses by the relative displacement of a laser beam or electron beam in relation to the metal sheets (1, 2), along the line of contact of said sheets (1,... Agent: Mcglew & Tuttle, PC 11/08/2007 > patent applications in patent subcategories.20070257084 - Cordless welding machines: A cordless welding machine includes first and second batteries being connected in parallel, a ground clamp connected to the first and second batteries, and a first welding electrode connected to the first and second batteries. The batteries providing a current output of at least about 40 amps.... Agent: The Black & Decker Corporation 20070257083 - Transducer and method for mounting the same: A transducer is provided that comprises a horn having a longitudinal axis, a bonding tool attached to the horn, and an ultrasonic generator attached to the horn and spaced from the bonding tool along the longitudinal axis of the horn. A flexure is attached to the horn between the bonding... Agent: Ostrolenk Faber Gerb & Soffen 20070257086 - Adaptive continuous acoustic welding system for incompatible materials: A system and method are provided which enable the joining of two materials via ultrasonic welding, including materials normally considered incompatible in traditional ultrasonic welding techniques. The system permits ultrasonic welding of a first material to a second material, the second material including material types normally considered incompatible with the... Agent: Mathews, Shepherd, Mckay, & Bruneau, P.A. 20070257085 - Heat processing method, computer-readable storage medium, and heat processing apparatus: In the present invention, a plurality of suction ports are provided in a heating plate of a heat processing apparatus. The suction ports are provided at a central portion, an intermediate portion, and a peripheral portion of a substrate mounting surface of the heating plate, respectively. The warped state of... Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C. 20070257087 - Ultrasonic press using servo motor with integrated linear actuator: An ultrasonic welding system includes an ultrasonic welding stack mounted for linear movement and for applying a controlled force, speed, or a combination of force and speed to a first workpiece to press the first workpiece against a second workpiece to which the first workpiece is to be joined, and... Agent: Stephen G. Rudisill Nixon Peabody LLP 20070257088 - Arrangement for welding workpieces by means of an ultrasonic device: An arrangement for the welding of cables by means of an ultrasonic welding device with a compression chamber for housing the cables defined by at least sections of a sonotrode transmitting ultrasonic vibrations, a counter electrode and lateral defining elements. In order to guarantee a desired layout for the cables,... Agent: Dennison, Schultz & Macdonald 20070257089 - Method for manufacturing spoke of diverse diameters: A method for manufacturing a spoke with diverse diameters is disclosed. A wire is drawn, and at least two rollers sequentially press the wire to form diverse diameters with circular, oval or flat cross section. A multi-layer spoke with diverse diameters and good roundness is achieved. This method is efficient... Agent: Troxell Law Office PLLC 20070257090 - Method and device for applying a solder to a substrate: A method for applying a solder to a substrate by positioning solder in a solid state, melting it and then impacting it against a substrate by means of compressed gas. The method utilizes a holder having a capillary bore whose diameter, at the substrate end, has a contraction whose diameter... Agent: Ralph H. Dougherty 20070257091 - Chip module having solder balls coated with a thin cast polymer barrier layer for corrosion protection and reworkability, and method for producing same: A chip module apparatus includes one or more chips electronically connected to a substrate by controlled collapse chip connection (C4) solder joints. A thin cast polymer barrier layer is cast from solution and covers the C4 solder joints. The chips are enclosed within a cavity that includes a gaseous environment.... Agent: Ibm Corporation RochesterIPLaw Dept. 917 11/01/2007 > patent applications in patent subcategories.20070251977 - Device for processing workpieces: A device for processing workpieces uses ultrasound, with an resonant system comprising an ultrasound generator, an ultrasound sonotrode, and an anvil, wherein a workpiece is processed between the anvil and the ultrasound sonotrode. The ultrasound generator comprises a regulation means which has a regulation member connected upstream of the ultrasound... Agent: Dreiss, Fuhlendorf, Steimle & Becker 20070251978 - Device for processing workpieces using ultrasound: The invention concerns a device for processing workpieces using ultrasound, comprising an ultrasound sonotrode and an anvil, wherein a workpiece is processed between the ultrasound sonotrode and the anvil, the ultrasound sonotrode having a recess with open edges in the axial direction and a die is disposed in the recess... Agent: Dreiss, Fuhlendorf, Steimle & Becker 20070251979 - Fastening element for friction-welding to a flat component: The invention relates to a fastening element with a face, which has a concentric annular bead (3), for being friction welded to a flat component (12, 26) by rotational force acting upon the fastening element and a pressing force directed toward the component (12, 26). The annular bead (3) has,... Agent: Birch Stewart Kolasch & Birch 20070251980 - Reduced oxidation system for wire bonding: A wire bonding machine is provided. The wire bonding machine includes (1) a bond site area for holding a semiconductor device during a wire bonding operation, and (2) a gas supply line configured to provide a gas at the bond site area from above the bond site area.... Agent: Kulicke And Soffa Industries, Inc. 20070251981 - Selective rework process and apparatus for surface mount components: An apparatus and method for selective rework for surface mount components. A shield assembly encloses a circuit board on which Surface Mount Technology (SMT) modules are soldered. The shield assembly includes a top shield member having an opening over an SMT module to be removed from the circuit board, and... Agent: John E. Campbell IBM Corp. Intellectual Property Law Previous industry: Elongated-member-driving apparatusNext industry: Envelopes, wrappers, and paperboard boxes ###### RSS FEED for 20091112: Integrate FreshPatents.com into your RSS reader/aggregator or website to track weekly updates. For more info, read this article. ###### Thank you for viewing Metal fusion bonding patents on the FreshPatents.com website. These are patent applications which have been filed in the United States. There are a variety ways to browse Metal fusion bonding patent applications on our website including browsing by date, agent, inventor, and industry. If you are interested in receiving occasional emails regarding Metal fusion bonding patents we recommend signing up for free keyword monitoring by email. ### FreshPatents.com Support Results in 0.28364 seconds |
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