Metal fusion bonding inventions 10/07

20070246509 - Multilayer braze-able sheet: A multi-layer aluminum brazing sheet including a core layer, interliner, braze clad layer and a sacrificial layer, in which the post-braze strength of the brazing sheet is optimized by controlling the manganese (Mn), silicon (Si), copper (Cu) and magnesium (Mg) contents of the core layer and the Mn, Si and... Agent: Intellectual Property

20070246513 - Tail wire cutting method and bonding apparatus: A tail wire cutting method and bonding apparatus executing the same, in which a capillary raised to a predetermined height and a clamper disposed above the capillary and gripping a wire are caused to make reciprocating oscillation movement on, for instance, a circular arc that has an apex at the... Agent: Quinn Emanuel Koda & Androlia

20070246512 - Use of tunable diode lasers for controlling a brazing processes: Methods and apparatus for controlling a brazing process. In one embodiment, a method includes receiving a signal from a tunable diode laser indicating a measured concentration of a gas present in an atmosphere in which the brazing process is performed. Responsive to the received signal, a control signal is issued... Agent: Ms. Linda K. Russell

20070246511 - Conductive bonding material fill techniques: A system, method, and apparatus of providing conductive bonding material into a plurality of cavities in a circuit supporting substrate is disclosed. The method comprises placing a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or... Agent: Fleit, Kain, Gibbons, Gutman, Bongini & Bianco Pl

20070246510 - Rotating type soldering device: A rotating type soldering device is used for soldering a heat pipe and includes a transmission mechanism having a transmission platform on which heat pipes are disposed and transmitted. A rotation mechanism and a material-sending mechanism are arranged on topside and bottom side of the transmission platform The rotation mechanism... Agent: Hdsl

20070246514 - Method for reflow soldering: The invention relates to a method and a device for the reflow soldering of circuit-board conductors with components and modules applied to a printed-circuit board by means of a solder paste, wherein, through radiation of an electromagnetic wave, an absorption material absorbing the radiation is heated and said heating is... Agent: Birch Stewart Kolasch & Birch

20070246515 - Rotational fill techniques for injection molding of solder: A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a non-rectangular mold. The non-rectangular mold includes a plurality of cavities. The fill head is placed in substantial contact with the... Agent: Fleit, Kain, Gibbons, Gutman, Bongini & Bianco Pl

20070246516 - Universal mold for injection molding of solder: A system, method, and device for applying conductive bonding material to a substrate are disclosed. The method includes providing conductive bonding material in a plurality of cavities of a mold. A total number of cavities in the plurality of cavities being greater than a total number of at least one... Agent: Fleit, Kain, Gibbons, Gutman, Bongini & Bianco Pl

20070246517 - Monobloc cooling device component: A cooling device component of monobloc design has a heat shield made from tungsten, a tungsten alloy, a graphitic material or a carbidic material provided with a through-hole. A cooling pipe for carrying coolant is joined in the through-hole. The heat shield is in turn joined or metallurgically joined to... Agent: Lerner Greenberg Stemer LLP

20070246518 - Fill head for injection molding of solder: A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further includes placing the fill head in substantial contact with... Agent: Fleit, Kain, Gibbons, Gutman, Bongini & Bianco Pl

20070241163 - Apparatus and method for friction stir spot welding: An apparatus for welding a workpiece has a welding head and a rotating tool. The welding head has a recessed portion and a welding head end to be placed in contact with a surface of the workpiece. The rotating tool is disposed within the recessed portion of the welding head.... Agent: Baker Botts L.L.P.

20070241168 - Arrangement of parts and a respective manufacturing method: An arrangement of parts having a first part in the form of sheet metal which is in contact with the second part along an edge and is fixedly connected to the second part via at least one weld. To reduce stress peaks at the ends of welds, the first part... Agent: Plevy, Howard & Darcy, P.C.

20070241166 - Carbon fiber heating plate device: A carbon fiber heating plate device includes an insulating plate with two opposite edges each of which has a plurality of spaced apart turning sites, a carbon fiber wiring disposed over at least one face of the insulating plate, extending from one edge to the other edge of the insulating... Agent: Ladas & Parry

20070241167 - Joining method and joining apparatus: A metal plating applied on a joining portion of a first metal member is heated before a rotating tool under rotation being pressed against a second metal member. Herein, the rotating tool under rotation starts being pressed against the second metal member when the metal plating is heated at least... Agent: Nixon Peabody, LLP

20070241164 - Perforated composites for joining of metallic and composite materials: Embodiments in the present invention provide a system and method of joining structural members. This method involves aligning the first structural member to a metallic substrate when the first structural member has at least one tapered hole or cavity. A metallic or other like material suitable to cold spraying technology... Agent: Robert A. Mclauchlan

20070241165 - Thermoconductimetric analyzer for soldering process improvement: Performance of a flux in a soldering process is assessed by monitoring the activity of the flux via its electrical conductance measured using a probe having interdigitated metallic traces and a temperature sensor. The measured conductance-temperature time profile provides information useful for selecting a suitable flux formulation and soldering conditions... Agent: D. Morgan Tench

20070241169 - Method for welding nickel-based superalloys: A method of welding superalloy components comprising: (a) forming a weld prep groove at an interface of the components; (b) welding the components using a filler material at ambient temperature; (c) covering the filler material and adjacent surfaces of the components with a braze paste; and (d) heat treating the... Agent: Nixon & Vanderhye P.C.

20070241170 - Flux for soldering and circuit board: A flux contains resin having film forming ability, activator, solvent and at least one complex selected from silver complex and copper complex. The flux is used when soldering is performed onto a circuit having electroless nickel plating or further having gold plating on the electroless nickel plating. Allowing a barrier... Agent: Sughrue Mion, PLLC

20070235495 - Wire bonding capillary tool having multiple outer steps: A bonding tool for bonding a fine wire to a substrate, said bonding tool comprising an at least substantially cylindrical portion having a concentric capillary therein through which the fine wire runs; a working tip portion formed at an end of the cylindrical portion being tapered towards the tip thereof,... Agent: Intellectual Property / Technology Law

20070235496 - Multi-orifice collet for a pick-and-place machine: The invention relates to a system and method for simultaneously transferring multiple components using multi-orifice collets with a pick-and-place apparatus. Multiple electronic components, such as light emitting diodes can be picked and place simultaneously while maintaining the spacing and orientation of the components found in the original location.... Agent: Kathy Manke Avago Technologies Limited

20070235497 - Rotating type soldering device: A rotating type soldering device is used for soldering a heat pipe and includes a rotation mechanism. The rotation mechanism includes an actuator and a plurality of wheels. The heat pipe is arranged between the wheels. A soldering mechanism with a solder gun is arranged on one side of the... Agent: Hdsl

20070235498 - Rotating type soldering device: A rotating type soldering device is used for soldering a heat pipe and includes a rotation mechanism. The rotation mechanism includes an actuator and a plurality of wheels. The heat pipe is arranged between the wheels. A soldering mechanism with a solder gun is arranged on one side of the... Agent: Hdsl

20070235499 - Rotating type soldering device: A rotating type soldering device is used for soldering a heat pipe and includes a rotation mechanism and a soldering mechanism. The rotation mechanism includes an actuator and a pair of wheels driven by the actuator. The wheels are conductive and electrically connected to a first electrode. The heat pipe... Agent: Hdsl

20070235503 - Solder alloy and soldering method: A solder alloy is provided in which generation of an oxide film of Zn—Sn based or Zn—In based solder alloy, which can be easily oxidized, can be restrained without deteriorating the mechanical characteristics, and a soldering method that causes less joining defects is provided. Soldering is performed in an inert... Agent: Buchanan, Ingersoll & Rooney PC

20070235502 - Condenser microphone: An electronic device suitable for a condenser microphone includes: first and second electrodes; and a housing defining an accommodating space for receiving the first and second electrodes therein and having a base that confines one side of the accommodating space and that has an outer surface which is provided with... Agent: Ladas & Parry LLP

20070235500 - Room temperature joining process with piezoelectric ceramic-activated reactive multilayer foil: Apparatus comprising a multilayered reactive foil preform including alternating layers of first and second materials deposited on foils. The layers also include piezoelectric ceramic particles to provide an electrical stimulus when pressure is applied to activate an exothermic reaction between the first and second materials.... Agent: Schwegman, Lundberg & Woessner, P.A.

20070235501 - Self-packaging mems device: Microelectronic packages are disclosed. In one aspect, a microelectronic package may include a substrate, a cap layer over the substrate, and a sealed chamber defined between the substrate and the cap layer. The package may include one or more openings to the sealed chamber that are closed by a reflowed... Agent: Blakely Sokoloff Taylor & Zafman

20070235504 - Method and apparatus for testing solderability of electrical components: The described embodiments relate generally to methods and apparatus for use in determining solderability of an electrical component. One particular aspect relates to apparatus comprising a vacuum chamber, a load sensor, a platform and a control module. The load sensor has a contact portion disposed within the vacuum chamber and... Agent: Bereskin And Parr

20070235505 - Method for repairing or manufacturing a component: The invention relates to a method for repairing a structural component, especially a stator-side structural component of a gas turbine such as a housing or a guide vane ring, whereby a damaged section is separated-out from the structural component, and whereby a new section that replaces the damaged as well... Agent: Fasse Patent Attorneys, P.A.

20070228102 - Retractable shoulderless variable penetration friction stir welding tool: A method of friction stir welding and a non-consumable retractable shoulderless variable penetration friction stir welding tool. The tool includes a substantially cylindrical body portion, a head portion, and a tip section, each integral to the tool. The body portion has a longitudinal axis about which it is rotable, a... Agent: Gallagher & Dawsey Co., L.p.a.

20070228103 - Solder spray jig: A solder spray jig includes: a main body having an opening acting as a spray outlet for solder, and recesses formed on two opposite sides of the main body and communicating with the spray outlet; a movable unit disposed on each of the two opposite sides of the main body,... Agent: Fulbright And Jaworski LLP

20070228104 - Friction stir welding spindle assembly: A friction stir welding system is provided that can afford a versatile and efficient welding operation. The friction stir welding spindle assembly can have a shoulder spindle and a pin spindle independently rotatable in relation to each other. The shoulder spindle and the pin spindle can be rotatably supported by... Agent: Dickstein Shapiro LLP

20070228106 - Process and device for form locked joining of two components: A process is described for form locking joining of two components through plastic deformation of one of the two components. In order for the tool for forming the form locking connection not to get in direct contact with the plasticized area of the joining partners, a third component between the... Agent: Browdy And Neimark, P.l.l.c. 624 Ninth Street, Nw

20070228105 - Solder layer and electronic device bonding substrate and submount using the same: A solder layer and an electronic device bonding substrate using the layer are provided which avoid deteriorating qualities of the electronic device to be bonded. In a solder layer 14 free from lead and formed on a substrate 11 or an electronic device bonding substrate 10 having such a solder... Agent: Masao Yoshimura, Chen Yoshimura, LLP

20070228107 - Ultrasonic joining method, ultrasonic joining device and unit joined by ultrasonic joining: In an ultrasonic joining method for joining a flange portion of a first member to a portion of a second member, a first horn and a second horn are arranged on the flange portion on a side opposite to the second member, and the first horn is vibrated in a... Agent: Harness, Dickey & Pierce, P.L.C

20070228108 - Repair soldering method for repairing a component which comprises a base material with an oriented microstructure: The invention relates to a method for repairing components comprising a base material with an oriented microstructure, wherein the repair point comprises a correspondingly oriented microstructure as the surrounding base material. According to the inventive method, solder is applied in the region of a point which is to be repaired... Agent: Siemens Corporation Intellectual Property Department

20070228109 - Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium: An active solder alloy, an electronic device package including the active solder alloy bonding an electronic device to a substrate, and a method of forming high-strength joints by soldering using the solder alloy. The alloy contains up to about 10% by weight of an element or a mixture of elements... Agent: Stradley Ronon Stevens & Young, LLP

20070228111 - Microelectronic package and method of forming same: A method of forming a microelectronic package, a microelectronic package formed according to the method, and a system including the microelectronic package. The method comprises: providing a die-substrate combination including: providing a die having die bumping sites thereon each including a layer comprising a stabilizing element; providing a substrate having... Agent: Intel Corporation C/o Intellevate, LLC

20070228110 - Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out: Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer... Agent: N. Kenneth Burraston Kirton & Mcconkie

20070228112 - Method and arrangement for forming a microelectronic package: A method of forming a microelectronic package, and an arrangement to attach a solder preform onto a microelectronic die in order to form the package. The method comprises: providing a reinforced solder preform including a solder preform and a backing layer attached to a backside of the solder preform; placing... Agent: Intel Corporation C/o Intellevate, LLC

20070228113 - Method of manufacturing metallic foam based heat exchanger: A method of manufacturing a metallic foam based heat exchanger includes positioning an aluminum foam block, for example, within a housing defining a first fluid passage, and placing the block in contact with a second portion of the housing defining at least one other fluid passage, the second housing portion... Agent: Caterpillar C/o Liell & Mcneil Attorneys PC

20070228114 - Methods of mark-off suppression in superplastic forming and diffusion bonding: The invention provides methods of superplastic forming and diffusion bonding and a gas inlet tube that facilitates the methods which produce structures that are substantially mark off free. Methods include disposing a sealed pack into a die having a patterned surface and an opposite surface; applying a first pressure within... Agent: Ingrassia Fisher & Lorenz, P.C. (boeing)

20070228115 - Method of manufacturing an electronic component: A method of manufacturing an electronic component which can reduce voids in a solder and can reliably melt the solder is provided. The method of manufacturing an electronic component including a member (substrate 1) having a metal junction (electrode 11) includes: the step of supplying a solder 5 containing a... Agent: Sughrue Mion, PLLC

20070228116 - Method for adhering a heat pipe wall and a wick structure: A method for adhering a heat pipe wall and a wick structure includes the steps of preparing a hollow heat pipe body; placing at least one layer of wick structure at an internal wall of the pipe body; putting an appropriate quantity of metal powder in the pipe body so... Agent: Hdsl

20070228117 - Structure and method to gain substantial reliability improvements in lead-free bgas assembled with lead-bearing solders: Methods of forming and assemblies having hybrid interconnection grid arrays composed of a homogenous mixture of Pb-free solder joints and Pb-containing solder paste on corresponding sites of a printed board. The aligned Pb-free solder joints and Pb-containing solders are heated to a temperature above a melting point of the Pb-free... Agent: Law Office Of Delio & Peterson, LLC.