Metal fusion bonding inventions 09/07

20070221703 - Method of reinforcing a structure and a clamp: In performing an SPS overlay to reinforce an existing metal structure, restraint beams are held down by magnetic clamps.... Agent: Nixon & Vanderhye, PC

20070221706 - Methods for making aluminum clad copper wire: A method for making an aluminum clad copper wire from a copper wire and at least one aluminum strip solid phase bonded together may include treating a surface of the copper wire by heating the copper wire during exposure to an oxidizing ambient followed by a reducing ambient as the... Agent: Allen, Dyer, Doppelt, Milbrath & Gilchrist P.A.

20070221707 - Solid brazed laminate structures: An example method of manufacturing a solid brazed laminate structure includes stacking a first lamina on a second lamina with an interfacial spacing between them, aligning mating portions of the first lamina and the second lamina, and introducing a braze material at least partially into the interfacial spacing to join... Agent: Carlson, Gaskey & Olds, P.C.

20070221705 - Buttered welding of superalloys: Disclosed herein is a method of welding superalloy articles. A buttered layer is attached to a first article formed from a superalloy. A buttered layer is attached to a second article formed from a superalloy. Residual stresses are relieved between the buttered layer and the superalloy. Matching faying surfaces are... Agent: Cantor Colburn, LLP

20070221708 - Method of brazing pipe member to counterpart member: This invention is intended to provide a method of brazing the pipe member to the counterpart member, in which the pipe end portion of the pipe member and the counterpart member can be certainly secured by brazing at the desired position while this brazing operation is performed at a low... Agent: Jordan And Hamburg LLP

20070221704 - Method of manufacturing circuit device: A method of manufacturing a circuit device of the present invention comprises the steps of: forming a conductive pattern including a first pad and a second pad on the surface of a substrate; applying a solder paste to the surface of the first pad and then thermally melting the solder... Agent: Watchstone P + D

20070221709 - Ultrasonic welding method, ultrasonic welding device and pipe joined by the same: An ultrasonic welding method and an ultrasonic welding device are provided to join a first member having a substantial pipe shape and a second member at a joining surface by pressure-applying and vibration-exciting. In an arranging process, each of a first horn member and a second horn member is slantways... Agent: Harness, Dickey & Pierce, P.L.C

20070221710 - Soldering flux and method for bonding semiconductor element: The method for bonding a semiconductor element comprises the step of applying to solder bumps 10 of a semiconductor chip 12 a soldering flux 16 which contains a thermosetting resin, a polyhydric alcohol and an organic acid and in which the thermosetting resin remains uncured after reflow-bonding, the step of... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20070221711 - Method of packaging electronic component: A method of packaging an electronic component, which is capable of enhancing electrical and mechanical bonding reliability of the electronic component. Terminal (4) is provided on the side face of electronic component (1). Electrode (6) is formed on one or the other major surface of substrate (5) and terminal (4)... Agent: Wenderoth, Lind & Ponack L.L.P.

20070221712 - Thermosetting flux and solder paste: The invention aims to provide a thermosetting flux suitable for solder bonding of a semiconductor element and an electronic part and making solder bonding with a high bonding strength and a high heat resistant strength at a high temperature possible and a paste containing the flux and a non-lead type... Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070215671 - Manufacturing plant in particular a rotational friction welding plant with at least one adjuster device comprising two interleaved frames: A manufacturing plant, in particular, a rotational friction welding plant for the joining of two components, with two part systems for mutual alignment is disclosed. According to the invention, at least one of both part systems for mutual alignment is provided with an adjustment device, comprising two interleaved frames, whereby... Agent: Davidson, Davidson & Kappel, LLC

20070215673 - Bonding apparatus and bonding method: To provide a bonding apparatus capable of increasing product quality by realizing high-precision control of a pressing force applied upon mounting of an electronic component on a substrate by bonding, and to a bonding method capable of providing high-quality products stably. The bonding apparatus includes: at least a bonding head... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20070215674 - Method of brazing an aluminum alloy material and method of producing an aluminum alloy heat exchanger:

20070215672 - System for removal of an integrated circuit from a mount material: A system for removal of an integrated circuit from a mount material including holding and stretching the mount material using linear and rotary motion, and removing the integrated circuit from the mount material when the mount material is stretched by linear and rotary motion.... Agent: Ishimaru & Zahrt LLP

20070215676 - Adjustable overlap joint and structure produced thereby: A friction stir welding method and a structural body formed using a friction stir welding method. In particular, a friction stir welding method and a structural body made of an aluminium alloy extruded frame member formed by friction stir welding of a number of extruded frame members. Joining is performed... Agent: Venable LLP

20070215675 - Friction stir welding process to join two or more members in forming a three-dimensional joint: A three dimensional joint is formed by coupling (joining) a first structural member and a second structural member. This involves first aligning a first structural member to a second structural member. The first structural member has a channel with which to receive a portion of the second structural member. Once... Agent: Robert A. Mclauchlan

20070215677 - Cold gas-dynamic spraying method for joining ceramic and metallic articles: A method for joining a first component surface to a ceramic component surface includes cold gas-dynamic spraying a first metal powder onto the ceramic component surface to form a first metal coating. The first component surface is then bonded to the metal coating on the ceramic component surface. The bonding... Agent: Honeywell International Inc.

20070210139 - Electronic component with lead using pb-free solder: The present invention proposes a semiconductor device including a semiconductor chip having a plurality of electrodes, a plurality of leads electrically connected to the plurality of electrodes of the semiconductor chip by bonding wires, and a resin for implementing the semiconductor chip, wherein the plurality of leads are comprised of... Agent: Antonelli, Terry, Stout & Kraus, LLP

20070210140 - Friction stir welder and method for friction stir welding: The present invention provides a friction stir welder that includes a stage on which at least two material pieces to be welded are mounted and stacked, a pressing member that covers and presses end faces of the material pieces to be welded that are mounted and stacked on the stage,... Agent: Carrier Blackman And Associates

20070210137 - Base dispensing tool for tube supports and method of utilizing same: A tool (62) retains a plurality of bases (36) for tube supports (30). Each base (36) includes a body (44) having a finger (52) extending into an interior (46) of the body (44) and a foot (54) extending outwardly from the body (44). The tool (62) includes a rod (64)... Agent: Reynaldo P. Lugo, Jr.

20070210138 - Circuit board pallet with magnetized pins: The circuit board pallet comprises one or more flat metallic spring arms positioned over magnetized pins. The magnetized pins comprise a magnetic material, such as steel. The magnetized pains contact a permanent magnet embedded inside or attached under the pallet. The metallic spring arms comprise a flexible magnetic material, such... Agent: Rudolf O. Siegesmund

20070205248 - Flexible processing method for metal-insulator-metal capacitor formation: A method for forming a metal-insulator-metal (MIM) capacitor includes forming a capacitor bottom plate and a metal interconnect feature on a substrate. A dielectric layer having a predetermined thickness is then formed. The dielectric layer has a first portion overlying the capacitor bottom plate and a second portion overlying the... Agent: Slater & Matsil, L.L.P.

20070205249 - Compliant wirebond pedestal: A wire bonder (900) with a rigid pedestal (902) having resilient inserts (920). A package (904) placed on the pedestal (902) contains an electrical device (906). The bond pads on the electrical device (906) are electrically connected to bond pads on the package (904) by a series of bond wires... Agent: Texas Instruments Incorporated

20070205252 - Horn-holder pivot type bonding apparatus: A horn-holder pivot type bonding apparatus including a horn holder for holding an ultrasonic horn, and a motor for driving the horn holder to pivot, with an imaginary pivot point of the horn holder being positionally fixed on a bonding surface. The motor is provided substantially in the center of... Agent: Koda & Androlia

20070205250 - Printed circuit board apparatus and method for assembly: A surface mounting assembly (SMA) process for manufacturing a printed circuit board (PCB), with the SMA process including the steps of: providing a circuit board with a plurality of metallic pads; depositing solder paste on at least a portion of the plurality of metallic pads; and mounting at least one... Agent: Motorola, Inc.

20070205251 - Soldering structure of through hole: A through hole is formed in a printed board. Conductor patterns are formed on an upper face and a lower face of the printed board in such a manner that the conductor patterns are electrically connected to each other, by means of a through hole solder. A lead terminal of... Agent: Morgan Lewis & Bockius LLP

20070205253 - Method for diffusion soldering: A method for connecting at least two metal layers by means of a diffusion soldering process, wherein each of the metal layers that is to be connected is plated with a respective solder layer prior to the diffusion soldering process.... Agent: Dickstein Shapiro LLP