Metal fusion bonding inventions 08/07

20070199972 - Transducer assembly for a bonding apparatus: A transducer assembly for a bonding apparatus is provided that comprises a horn having first and second base ends and a bonding tool attached to the horn between the first and second base ends. First and second ultrasonic generators are secured to the first and second base ends respectively. A... Agent: Ostrolenk Faber Gerb & Soffen

20070199973 - Tubular filter material machine and methods: A machine for continuously making spirally wrapped tubular filter material screens utilizes a mandrel around which one or more strips of filter material are wrapped. The resulting spirally wrapped tubular filter material screen may or may not comprise multiple layers of filter material. In one embodiment, the strips of filter... Agent: Kenneth L. Nash

20070199974 - Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine: The present invention is a method and apparatus for forming a bump for semiconductor interconnect applications, such as reverse wire bonding or stud bumping for flip chip interconnections. The bump is formed by (1) ball bonding at the bump site, (2) raising the capillary a predetermined height after forming the... Agent: Kulicke And Soffa Industries, Inc.

20070199975 - Locking mechanism for soldering iron: A cartridge system for a cartridge type soldering iron has a sleeve stopper with hooks and a sleeve which goes over the stopper. The hooks of the sleeve stopper lock with a socket assembly of the soldering iron which connects to an electrical source. A tip cartridge of the soldering... Agent: Hisako Muramatsu Squire, Sanders & Dempsey LLP

20070199976 - Process of forming a polyol: A process of forming a polyol includes the steps of providing an alkylene oxide, providing an initiator composition having an average functionality of at least four, and providing an alkaline earth metal hydroxide and an amine. The process also includes the step of reacting the initiator composition and the alkylene... Agent: Basf Aktiengesellschaft

20070199977 - Turbocharger turbine and shaft assembly: The present disclosure includes a turbocharger. The turbocharger may include a titanium-aluminide turbine and a shaft. A single joint connects the turbine to the shaft. The joint may include an alloy comprising at least 80 atomic percent nickel and palladium.... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20070199978 - Friction stir welding method: There is provided a friction stir welding method for forming a satisfactory weld portion by two steps when members having different thicknesses are butted together and friction stir welded. A first member 10 having a thickness T1 and the second member 20 having a thickness T2, which is smaller than... Agent: Antonelli, Terry, Stout & Kraus, LLP

20070194086 - Case, portable device, and method for laser welding resin parts: A technique for preventing the extrusion of fused material from between resin parts when the resin parts are laser welded. A case has a resin first case part transmissive to laser light and including a peripheral portion. A resin second case part absorbs laser light joined with the first case... Agent: Synnestvedt & Lechner, LLP

20070194085 - High velocity metallic powder spray fastening: The present invention provides a low temperature joining method that is compatible with multiple materials and results in a bond between joined structures without reducing the mechanical properties of the joined structures base materials. The method of the present invention includes the steps of contacting a first structure to a... Agent: Harry A. Hild, Jr. Alcoa Technical Center

20070194084 - Method and system for utilizing an interlocking dissimilar metal component in the formation of a hard disk drive: A method and system for utilizing an interlocking dissimilar metal component in the formation of a hard disk drive is disclosed. The method provides a hard disk drive component having at least one interlocking dissimilar metal component, the at least one interlocking dissimilar metal component having at least two dissimilar... Agent: Wagner, Murabito & Hao LLP Third Floor

20070194083 - Process and device for soldering in the vapor phase: The invention provides a process for soldering in the vapor phase in which after the solder has melted onto the item to be soldered a vacuum is generated around the item to be soldered in the vapor phase. Also provided is a device for soldering in the vapor phase comprising... Agent: Ohlandt, Greeley, Ruggiero & Perle, LLP

20070194087 - Welding electrode rating method using double cap pass test: Methods for rating welding electrodes are presented, in which a standardized vertical-down double cap pass welding procedure is performed using a test electrode to create a test weld on a substantially flat workpiece surface, and the electrode is rated according to the amount of porosity in the test weld. A... Agent: Fay Sharpe / Lincoln

20070194088 - Assembly means for parts comprising at least one weld bead produced by transparency: The invention relates to assembly means (101) for parts, comprising at least one weld bead (106,206) produced by transparency and intended to fix at least two parts (2, 4) to each other, each weld bead (106) having a start point (114) and an end point (126). According to the invention,... Agent: Anderson, Kill & Olick, P.C.

20070194089 - Facility and method for high-performance circuit board connection: A circuit assembly has two circuit boards parallel to each other and having major faces facing each other. Each major face has a signal contact connected to a signal trace. At least one of the major faces has a ground contact surrounding the signal contact. The signal and ground contacts... Agent: Thomas F. Lenihan Tektronix, Inc.

20070187457 - Component mounting method, component mounting apparatus, and ultrasonic bonding head: A component mounting apparatus includes a component feeder that feeds a component with its bump electrodes facing down, a mounting head that mounts the component onto a substrate, a supporting base that secures the substrate, and a positioning device that aligns the component with the substrate. The mounting head includes... Agent: Jordan And Hamburg LLP

20070187458 - Stainless steel weld overlays with enhanced wear resistance: Compositions for stainless steel weld overlays having enhanced wear resistance are provided by incorporating second phase Titanium Carbide (TiC) and/or Niobium Carbide (NbC) into matrices of various types of stainless steel such as 316L and 420. Preferably, TiC and NbC precipitates are formed in-situ during the weld overlay process while... Agent: Harness, Dickey, & Pierce, P.l.c

20070187466 - Friction stir welding apparatus and method of operating same: A friction stir welding apparatus and a method of operating the friction stir welding apparatus are disclosed. The friction stir welding apparatus includes a rotary tool whose extremity constitutes a probe, a retaining arm which supports the rotary tool, and a roller provided at a position of the retaining arm... Agent: Carrier Blackman And Associates

20070187467 - Method for forming a stud bump: A method for forming stub bumps in, for instance, semiconductor device fabrication, including a bonded ball formation step for bonding a ball formed at a tip end of a wire passing through a capillary to a pad to form a bonded ball on the pad; a scratching step for, next,... Agent: Koda & Androlia

20070187463 - Nanosized semiconductor particles: Nanosized semiconductor particles of a core/shell structure is disclosed, wherein the particles each comprise a core and a shell and exhibit an average particle size of not more than 100 nm and a coefficient of variation in core size distribution of not more than 30%.... Agent: Lucas & Mercanti, LLP

20070187460 - Thermal interface material and semiconductor device incorporating the same: A semiconductor device (10) includes a heat source (12), a heat-dissipating component (13) for dissipating heat generated by the heat source, and a thermal interface material (14) filled in spaces formed between the heat source and the heat-dissipating component. The thermal interface material includes 30% to 60% by weight of... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang Jeffrey T. Knapp

20070187464 - Joining of advanced materials by plastic deformation: A method for utilizing plastic deformation resulting from grain boundary sliding with or without a novel joint compound that leads to the joining of advanced ceramic materials, intermetallics, and cermets. A joint formed by this approach is as strong as or stronger than the materials joined. The method does not... Agent: Cherskov & Flaynik

20070187462 - Method of manufacturing a brazed assembly: The present invention relates to a method of manufacturing a shaped product by means of brazing. The method includes the steps of: producing an intermediate object of metal by rolling or extrusion and having at least one flat surface, coating the at least one surface with a brazing composition comprising... Agent: Stevens Davis Miller & Mosher, LLP

20070187459 - Novel method and a novel combined device for performing a pre- and postbrazing temperature controlled martensit-free brazing process using a controlled brazing temperature: The present invention (FIG. 1) relates to a new formula-controlled method of joining by brazing a connecting piece with a workpiece where the temperature is controlled during all phases of the process before, during and after the brazing temperature phase so that adverse structural changes of the work material (martensite... Agent: Intellectual Property Group Fredrikson & Byron, P.A.

20070187465 - Thermally enhanced tool for friction stirring: A friction stirring tool and a method for removing the catalytic phase from the friction stirring tool having a superabrasive coating by chemically etching, electrolytic etching or similar means to thereby at least partially remove a portion of the secondary catalytic phase metal from the superabrasive coating to thereby enhance... Agent: Morriss Obryant Compagni, P.C.

20070187461 - Welding shielding dam for automated welding of impellers and blisks: A dam is provided for localizing gas around an outer periphery of an impeller. In one embodiment, by way of example only, the dam includes a skirt, a flange, and a fastener. The skirt includes an inner section, an outer section, and an outer peripheral edge. The inner section is... Agent: Honeywell International Inc.

20070187468 - Low inductance via arrangement for multilayer ceramic substrates: A low inductance via arrangement for multilayer ceramic (MLC) substrates is provided. With the MLC substrate and via arrangement of the illustrative embodiments, the via-field inductance for a given contact pad array is reduced. This reduction is achieved by the introduction of T-jogs and additional vias. These T-jogs and additional... Agent: Ibm Corp. (wip) C/o Walder Intellectual Property Law, P.C.

20070187469 - Friction stir weld bonding of metal-polymer-metal laminates: In an assembly of facing metal sheets separated by a polymer layer, welded metallurgical bonds are formed between the metal sheets by use of a friction stir weld tool. A rotating tool penetrates the first sheet, locally displaces the encountered portion of polymer film and penetrates into the second sheet.... Agent: General Motors Corporation Legal Staff

20070187470 - Wire bonding apparatus, record medium storing bonding control program, and bonding method: A bonding method involving detection of non-bonding of a bonding wire to a first bonding point, the method including an electrical non-bonding detection step and an optical non-bonding detection step, wherein data on whether the respective first bonding points are predetermined bonding points where an electrical non-bonding detection is not... Agent: Koda & Androlia

20070181633 - Elastic interface for wafer bonding apparatus: An apparatus for bonding a lid wafer to a device wafer includes an elastic interface having a first surface and a second surface. Relieved areas may be created in the elastic interface by removing at least some of the elastic material of the interface, leaving a mesh with nodes. Raised... Agent: Jaquelin K. Spong Apt. A1

20070181634 - Wave solder apparatus: A wave solder apparatus. A conveyer carries a circuit board. A solder tank is disposed under the conveyer and includes a turbulent nozzle and a laminar nozzle separated therefrom by a predetermined distance. A first heater is disposed under the conveyer and adjacent to the solder tank, heating the bottom... Agent: Thomas, Kayden, Horstemeyer & Risley, LLP

20070181642 - Electrode, electronic component and substrate: The present invention is an electrode 10 so provided as to be soldered to an electronic component 12 and, when the electronic component 12 is mounted on a substrate 13, soldered to the substrate 13. The electrode 10 includes a column-like electrode body 11 soldered to the electronic component 12... Agent: Armstrong, Kratz, Quintos, Hanson & Brooks, LLP

20070181646 - Friction stir welding method: The present invention provides a friction stir welding method in which a plurality of members are lapped and a welding tool is pressed into one of the members, while being rotated, to cause friction stir to weld the members. A small diameter projected part is disposed at a tip end... Agent: Antonelli, Terry, Stout & Kraus, LLP

20070181649 - Friction stir welding method: The invention provides a friction stir welding method of forming a weld portion having an excellent fatigue property in the case of welding a weld material by using a friction stir welding method. The invention provides a friction stir welding method structured such as to insert a tool provided in... Agent: Antonelli, Terry, Stout & Kraus, LLP

20070181651 - Method for setting capillary contact position data and wire bonding apparatus using the same: In wire bonding, a clearance measurement between the capillary and reference member being performed by an image capturing device for capturing elevation images of the used and new (replaced) capillaries and the reference member and by a clearance measuring device that processes the elevation images of the capillaries and the... Agent: Koda & Androlia

20070181650 - Micro heat flux sensor array: Provided is a micro heat flux sensor array having reduced heat resistance. A micro heat flux sensor array may include a substrate, a plurality of first sensors formed on a first side of the substrate, and a plurality of second sensors formed on a second side of the substrate. Each... Agent: Harness, Dickey & Pierce, P.L.C

20070181638 - Apparatus for cooling and cleaning emission gas generated from reflow furnace: This invention provides an apparatus for cooling and cleaning emission gas which does not affect working environment even indoor in processing of emission gas including hot gas (hot wind) and volatile gas generated by heating of flux and can operate stably in a long period without replenishment of cooling water... Agent: Flynn Thiel Boutell & Tanis, P.C.

20070181647 - Application of high integrity welding and repair of metal components in oil and gas exploration, production and refining: A method for welding and repairing cracks in metal parts is provided by subjecting the metal parts to be welded to friction stir welding and the cracks to be repaired to friction stir processing under conditions sufficient to provide a weld joint or crack repair having a preselected property or... Agent: Exxonmobil Research & Engineering Company

20070181641 - Automotive p.s.i.r. milling burr control tape: An injection molded plastic instrument panel P.S.I.R. hidden door milling method including applying a stiff tape, having a hardness greater than a hardness of the plastic instrument panel, to a plastic instrument panel surface to be milled to prevent flexing of the surface during milling. The method may further include... Agent: Dykema Gossett PLLC

20070181652 - Bond capillary design for ribbon wire bonding: A device (100) and method (200) for bonding a ribbon wire (104) to a workpiece (106) comprising feeding the ribbon wire through a passageway (116) of an ultrasonic bond capillary (102) and clamping the ribbon wire against an engagement surface (120) of the bond capillary via a clamping jaw (118)... Agent: Texas Instruments Incorporated

20070181644 - Component mounting method and component mounting apparatus: A method and an apparatus for mounting electronic components that enables precise mounting of electronic components, such as deformation-prone thin IC chips or fine-pitch and high-pin-count IC chips, on a substrate. Thin IC chips, which conventionally tend to lose flatness because of warping that occurs during production or deformation that... Agent: Greenblum & Bernstein, P.L.C

20070181648 - Electronic device and process for forming same: An electronic device includes a substrate, a first organic electronic component overlying the substrate, wherein, from a plan view, the first organic electronic component defines a perimeter of a first pixel area, and at least one post structure, wherein the at least one post structure lies within the perimeter of... Agent: E I Du Pont De Nemours And Company Legal Patent Records Center

20070181635 - Forging method forged product and forging apparatus: A forging apparatus 1A includes a swaging apparatus 2 equipped with a fixing die 10, a guide 20 having an insertion passage 22 for inserting and holding a bar-shaped raw material 5 in a buckling preventing state, and a punch 30. The raw material 5 is fixed to the fixing... Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070181636 - Guide element, use of a guide element and method for the production of a guide element: Disclosed is a guide element comprising a base body having at least two guide surfaces disposed on various non-parallel planes. In order to provide the guide surfaces disposed on various non-parallel planes with a sliding lining, the guide surfaces are provided with at least one pre-fabricated strip of material consisting... Agent: Dickinson Wright PLLC

20070181640 - Lead-free solder reworking system and method thereof: A lead-free solder reworking method. A solder tank including a nozzle and containing molten lead-free solder is provided. A printed circuit board assembly is placed on the solder tank. The printed circuit board assembly has a printed circuit board and a first electronic member. The printed circuit board has at... Agent: Daniel R. Mcclure Thomas, Kayden, Horstemeyer & Risley LLP

20070181643 - Method and system for weld bead sequencing to reduce distortion and stress: In one embodiment, the present invention relates to a method and system of determining the weld bead sequence on a mechanical component is disclosed. In one specific embodiment, the sequence is determined by numerical analysis of a plurality of weld bead sequences to determine the weld bead sequence. Then, after... Agent: Greenberg Traurig, LLP

20070181637 - Method of friction stir-spot welding and welding apparatus: In order to solve the problem, after a tool (1) is inserted into a member (4) to be welded, a rotation shaft of the welding tool is tilted around a predetermined point (13) as a fulcrum, and the tip portion of the welding tool (1) is swung to enlarge a... Agent: Antonelli, Terry, Stout & Kraus, LLP

20070181639 - Pressure welding machine and pressure welding method: The invention relates to a pressure welding method and a pressure welding machine (1) which is provided with a frame (10), two welding heads (13, 14), mobile along a feed axis (41), and two adjusting units (17, 18) comprising feed drives (23) for the welding heads (13, 14). The two... Agent: Mcglew & Tuttle, PC

20070181645 - Wire bonding method and apparatus: A wire bonding method and apparatus are provided for electronic components to enable PR processing and wire bonding to be carried out substantially concurrently. The apparatus comprises a bond head carrying a bonding tool for performing wire bonding and a rotary motor coupled to the bond head that is configured... Agent: Ostrolenk Faber Gerb & Soffen

20070181653 - Magnetic alignment of integrated circuits to each other: Utilizing magnetic features located on different structures having semiconductor devices to align the structures when contacting the structures together. The magnetic features on each structure are of opposite polarity and provide magnetic forces for alignment of the structures. The magnetic forces can also be used to sense position and move... Agent: Freescale Semiconductor, Inc. Law Department

20070181654 - Flashless welding method and apparatus: A method and apparatus for welding two separate ends of an extrusion or two separate extrusion ends to form a flashless extrudate or gasket by having a first and a second mold for supporting and clamping the extrusion ends, and a spacer bar for positioning the extrusion ends to a... Agent: Tarolli, Sundheim, Covell & Tummino L.L.P.

20070181655 - Wave solder apparatus: A wave solder apparatus. A conveyer carries a circuit board. A solder tank is disposed under the conveyer and includes a turbulent nozzle and a laminar nozzle separated therefrom. The turbulent nozzle includes a plurality of turbulent spouting holes. The ratio of the cross-sectional area of the turbulent spouting holes... Agent: Daniel R. Mcclure Thomas, Kayden, Horstemeyer & Risley LLP

20070175965 - System and method of providing endless welding wire: A system for providing an endless welding wire to a welding station from a first and second container each having a top opening with a top, inwardly facing surface and a coil of welding wire with a feed end and a trailing, transfer end where the trailing end of the... Agent: Fay Sharpe / Lincoln

20070175966 - System, method, and apparatus for metallic-composite joint with compliant, non-corrosive interface: A metallic-composite joint is formed by inserting a metallic member into a slot of a pi-shaped composite preform. The preform is formed from woven carbon fiber in a binder of resin and may or may not be cured prior to assembly. An inert compliant layer is located between the legs... Agent: Bracewell & Giuliani LLP

20070175967 - High integrity welding and repair of metal components: A method for welding and repairing cracks in metal parts is provided by subjecting the metal parts to be welded to friction stir welding and the cracks to be repaired to friction stir processing under conditions sufficient to provide a weld joint or crack repair having a preselected property or... Agent: Exxonmobil Research And Engineering Company

20070175968 - Formed structural assembly and associated preform and method: A superplastically formed structural assembly is provided, as is an associated preform and method for forming such an assembly. The assembly includes a skin member and a support member that are joined to define a space between the members and between the joints. The assembly can be produced by joining... Agent: Alston & Bird LLP

20070175969 - Electronic component mounting method and electronic component mounting device: In order to mount an electronic component, a connection terminal of the electronic component is bonded to electrodes of a substrate. This is done by using solder paste which mixes solder particles in a thermosetting adhesive. The solder paste is supplied to the electrodes and a recess. Solder print parts... Agent: Ratnerprestia