Metal fusion bonding inventions 07/07

20070170226 - Ferritic stainless steel welded pipe superior in expandability: A ferritic stainless steel welded pipe is ferritic stainless steel welded pipe contains, by wt %, C: 0.001 to 0.015%, N: 0.001 to 0.020%, Cr: 11 to 25%, Mo: 0.01 to 2.0%, one or both of Ti and Nb in 0.05 to 0.5%, and B: 0.0003 to 0.0030%, having an... Agent: Kenyon & Kenyon LLP

20070170227 - Soldering method: An object of the invention is to provide a high-quality soldering method, by reducing, to a vacuum, the pressure in a vacuum room (2) in which a workpiece (10) having solid solder placed thereon consisting solely of tin or including tin and one or more components selected from silver, lead,... Agent: Duane Morris, LLPIPDepartment

20070170228 - Three-dimensional multi-chips and tri-axial sensors and methods of manufacturing the same: Devices for providing tri-axial measurements in an x-direction, a y-direction, and a z-direction and methods of their manufacture are disclosed. The devices comprise a leadframe, at least one X- and Y-axis sensor die, at least one integrated circuit, and a Z-axis sensor. The Z-axis sensor is encapsulated in a pre-molding... Agent: Weingarten, Schurgin, Gagnebin & Lebovici LLP

20070170229 - Friction spot joint structure: In a friction spot joint structure, a first plate member is pressed against a second plate member by using a rotary tool and a receiving member. A concave portion is formed by a rotating pin portion of the rotating tool, with an interface between the first plate member and the... Agent: Nixon Peabody, LLP

20070164077 - Weld nut part detector for welding applications: A sensor assembly includes a pin housing and a fiber optic sensor. The pin housing receives an end of the fiber optic sensor. The fiber optic sensor has a side-view probe type sensing end which permits right angle sensing. The pin housing includes a side hole that corresponds to a... Agent: Gifford, Krass, Sprinkle,anderson & Citkowski, P.c

20070164082 - Alignment plate: A mounting material alignment plate of the present invention is operative to allow an electronic component to be mounted on a printed circuit board and has a plurality of bores that admit terminals of the electronic component to be placed. The mounting material alignment plate has dents formed on one... Agent: Armstrong, Kratz, Quintos, Hanson & Brooks, LLP

20070164083 - Alignment plate: A mounting material alignment plate of the present invention is operative to place an electronic component to be mounted on a printed circuit board and has a plurality of bores that admit terminals of the electronic component to be placed. The mounting material alignment plate has first dents formed on... Agent: Armstrong, Kratz, Quintos, Hanson & Brooks, LLP

20070164084 - Electronic carrier board: An electronic carrier board is provided, including a carrier, at least two paired bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings corresponding in position to the two bond pads. The openings are aligned in the same direction and... Agent: Edwards Angell Palmer & Dodge LLP

20070164079 - Electronic component mounting method, and circuit substrate and circuit substrate unit used in the method: An electronic component mounting method comprising: supplying an unhardened reinforcing resin on a circuit substrate; supplying a solder paste on bond areas of the circuit substrate on which electrodes of the electronic components are to be bonded; placing the electronic components on the circuit substrate; and heating and then cooling... Agent: Greenblum & Bernstein, P.L.C

20070164085 - Method for applying an isolation layer to a brazed end of a generator armature winding bar: A method of forming a brazed joint between an armature bar and a hydraulic header clip including: assembling free ends of hollow strands and of solid strands of the armature winding bar and positioning the assembly within the hydraulic header clip; interleaving a silver based braze alloy between the strands,... Agent: Nixon & Vanderhye P.C.

20070164080 - Mounting system and method for mounting objects: A mounting system and method for mounting objects are provided. The mounting system includes a mounting component having an angled engagement portion configured to an engage an object and a leveling component having an angled portion configured to abuttingly engage the angled engagement portion of the mounting component. The leveling... Agent: Patrick W. Rasche Armstrong Teasdale LLP

20070164081 - Portable friction forge welder: A portable friction forge welder that applies a direct rotational load to workpieces via a rotational actuator and a direct axial load to workpieces via an axial actuator, where the rotational actuator and the axial actuator have separate and independent power sources. The portable friction forge welder relies on a... Agent: Taylor Russell & Russell, P.C.

20070164078 - Spin welding device: A rotary friction welding system is provided comprising a first rotary spindle (14) and a second dead spindle (15), wherein the first spindle (14) carries a first mutually connectable component (11) and the second spindle (15) carries a second mutually connectable component (12). The rotary friction welding system also comprises... Agent: Davidson, Davidson & Kappel, LLC

20070164086 - Rotatable tool and apparatus therefor: A friction stir weld apparatus having a linear drive actuator and a separate friction stir weld device. The linear actuator and the friction stir weld device are driven by concentric motors. In the preferred embodiment, the thrust member of the actuator is connected to the friction stir weld device within... Agent: Dorsey & Whitney LLP Intellectual Property Department

20070164087 - Method for repair of housings: A method is provided for repairing a housing having a bore formed therein, wherein the bore has an original diameter and a surface defined in part by the housing. The method may include the steps of preparing the housing bore by removing wear or damage near the bore surface, brazing... Agent: Honeywell International Inc.

20070164088 - Brazing process for stainless steel heat exchangers: An improved brazing process increases the strength and longevity of joints between stainless steel tubes and aluminum fins. The process is especially useful in joining tubes and fins of HVAC secondary heat exchangers and high chrome steels and aluminum. The process is comprised of first plating stainless steel tubes with... Agent: Carstens & Cahoon, LLP

20070164089 - Method of dispensing small amounts of liquid material: A method of dispensing a solder paste comprising at least a flux carrier and solder onto a substrate, wherein the flux carrier and solder each have a melting temperature with the melting temperature of the solder being higher than the flux carrier, includes providing a reservoir of the solder paste... Agent: Wood, Herron & Evans, LLP (nordson)

20070158391 - Method for joining electronic parts finished with nickel and electronic parts finished with electroless nickel: A method for joining an electronic part finished with nickel and an electronic part finished with electroless nickel, comprising: (1) reflowing solder to a nickel portion of an electronic part finished with nickel to obtain an electronic part where an intermetallic compound and a solder are formed; (2) obtaining an... Agent: Technology & Intellectual Property Strategies Group PC Dba Tips Group

20070158392 - Semiconductor device and a method of manufacturing the same: A semiconductor device has a package substrate having, at the periphery of the main surface thereof, a plurality of bonding leads disposed in a row, a semiconductor chip mounted inside of the row of the bonding leads on the main surface of the package substrate, wires for connecting pads of... Agent: Miles & Stockbridge PC

20070158386 - Aluminium alloy strip for brazing: The invention relates to a method for assembling sheets of aluminium alloy, comprising a welding without flux, in a controlled atmosphere, at a temperature of 580 to 620° C. a rapid cooling and, optionally, reheating to a temperature of 80 to 250° C. in which at least one of the... Agent: Banner & Witcoff, Ltd.

20070158388 - Apparatus and method for welding superalloys: A heating apparatus is provided for use during a welding operation on a component. In one embodiment, the apparatus includes a die having a cavity having at least a portion shaped to complement a first portion of the component and an opening providing a space through which a second portion... Agent: Honeywell International Inc.

20070158390 - Forge welding tubulars: Tubular ends are heated to a predetermined temperature above 1200 degrees Celsius and surrounded by a shield gas when the tubular ends are pressed together to form forge welded tubular ends. The forge welded tubular ends are then cooled down rapidly from said temperature above 1200 to at most 600... Agent: Shell Oil Company

20070158387 - Heater, reflow apparatus, and solder bump forming method and apparatus: An apparatus characterized by a feature that in a stage on which a substrate or a jig holding a substrate is mounted, an opening closed when the substrate or the jig is mounted is provided and the substrate or the jig is heated by blowing hot air against the lower... Agent: Greenblum & Bernstein, P.L.C

20070158393 - System for use in tapping a pipe: A mechanical weldable fitting for use in tapping a pipe includes a first and second metal collar, each formed of attachable upper and lower semi-toroidal portions that when assembled on the pipe providing spaced-apart external cylindrical surfaces. Each collar having at least one internal circumferential sealing groove therein that receives... Agent: Gable & Gotwals

20070158389 - Turbine element repair fixture: A blade processing fixture has first and second jaws. The second jaw is movable relative to the first jaw from a disengaged position for accepting a root of the blade. The blade is accepted in a receiving area between the first and second jaws. The second jaw is movable to... Agent: Bachman & Lapointe, P.C. (p&w)

20070158394 - Welded tailored blanks that allow for part curvature: A method of making tailored blanks in accordance with one embodiment comprises the steps of: (a) friction welding first and second structural members together along a straight interface to form a weld joint, each of the first and second structural members having a respective polygonal profile that is not a... Agent: Ostrager Chong Flaherty & Broitman, P.C.

20070158395 - Method for preparing and assembling a soldered substrate: A method to form solder microsockets on a first substrate (for example a chip carrier) so that when the first substrate is aligned with a second substrate having shaped solder elements (for example a semiconductor device), the shaped solder elements fit into the solder microsockets. At least one of the... Agent: International Business Machines Corporation Dept. 18g

20070158396 - Crankshaft arrangement and structural part for said crankshaft arrangement: The invention starts with a crankshaft arrangement, especially for a windshield wiper system, in which a shaft (10) is connected to a crank (12) so as to drive it. It is proposed that the crank (12) be connected to the shaft (10) via a structural part (16). In addition, a... Agent: Michael Best & Friedrich, LLP

20070158397 - Method for applying braze end isolation layer for generator armature winding bar: A method of forming a brazed joint between an armature bar and a hydraulic header clip including the steps of: locating ends of a plurality of hollow strands and a plurality of solid strands within a cavity in an end fitting such that free ends of said hollow strands extend... Agent: Nixon & Vanderhye P.C.

20070158398 - Process of brazing superalloy components: A process for brazing components formed of superalloys that contain elements prone to oxidation during brazing. At least one braze tape is applied to at least one faying surface of at least a first of the components being joined by brazing. The braze tape comprises a braze tape alloy containing... Agent: Hartman And Hartman, P.C.

20070152015 - Methods and apparatus for retractable pin friction stir welding and spot welding: An apparatus for friction stir welding is described that includes a stationary assembly having a bore therethrough, the bore having an inner diameter, and a rotational assembly having a welding end. At least the welding end of the rotational assembly extends through the bore. A portion of the rotational assembly... Agent: John S. Beulick C/o Armstrong Teasdale, LLP

20070152016 - Solder foams, nano-porous solders, foamed-solder bumps in chip packages, methods of assembling same, and systems containing same: A foamed solder or a nano-porous solder is formed on a substrate of an integrated circuit package. The foamed solder exhibits a low modulus that resists cracking during shock and dynamic loading. The foamed solder is used as a solder bump for communication between an integrated circuit device and external... Agent: Schwegman, Lundberg, Woessner & Kluth, P.A.

20070152017 - Method for depositing solder material on an electronic component part: A method for accurately depositing a required volume of solder material on a specific area of a lead frame, substrate or other part of an electronic component to be bonded by reflow of solder material to another part into a reliable, void-free connection during a subsequent assembly step comprises the... Agent: Charmasson, Buchaca & Leach, LLP

20070152020 - Optical structures including liquid bumps: A liquid prime mover can be used to position a component on a substrate. For example, a liquid material can be provided on the substrate adjacent the component such that the component has a first position relative to the substrate. A property of the liquid material can then be changed... Agent: Myers Bigel Sibley & Sajovec

20070152019 - Solder compositions; method of soldering, and a laminated transparency having bus bars: A low temperature solder including indium in the range of 62-65 weight percent and tin in the range of 31-33 weight percent uses the heat generated during thermal treatment of one or more glass sheets to melt the solder. In one non-limiting embodiment, a lead providing external access to an... Agent: Intellectual Property Department Ppg Industries, Inc.

20070152018 - Solder-bearing wafer for use in soldering operations: According to one embodiment, an electrical connector for electrical connection to a second electronic device having at least one second contact includes a substrate having a first surface and an opposing second surface, with a recess being formed in the first surface. The connect also has a first contact securely... Agent: Darby & Darby P.C.

20070152021 - Ultrasonic transducer comprising a sensor disposed in the mounting: The invention relates to an ultrasonic transducer comprising at least one sensor, particularly for use in ultrasonic bonders. At least one sensor (4, 6) is arranged in/on a mounting (2, 3) of the ultrasonic transducer and, in particular, by means of which a transverse extension perpendicular to a propagating exciting... Agent: St. Onge Steward Johnston & Reens, LLC

20070152022 - Methods of friction welding in a groove: A method of friction welding in accordance with one embodiment comprises the steps of inserting a protruding portion of one structural member into a groove of another structural member, and then friction welding the two structural members together to form a non-planar weld joint at an interface of the protruding... Agent: Ostrager Chong Flaherty & Broitman, P.C.

20070152023 - Solder deposit method on electronic packages for post-connection process: A method for accurately depositing a continuous and homogeneous line of a minute, metered volume of solder to a delineated area of an electronic component comprises positioning over said area a template made of high temperature withstanding material such as high density graphite and having a series of spaced-apart bores... Agent: Charmasson, Buchaca & Leach, LLP

20070152024 - System, apparatus, and method for advanced solder bumping: According to some embodiments, a method, apparatus, and system are provided. In some embodiments, the method includes providing solder resist material on a surface of a substrate, applying mask material on top of the solder resist material, reflowing solder located in an opening formed through both the solder resist material... Agent: Buckley, Maschoff & Talwalkar LLC Attorneys For Intel Corporation

20070152025 - Electronic part mounting method: The present invention provides an electronic part mounting method which enables joining of electrodes at a low temperature and within a short time, can obtain the high reliability and, further, enables joining at a fine pitch. In an electronic part mounting method which joins circuit electrodes which are formed over... Agent: Rossi, Kimms & Mcdowell LLP.

20070152026 - Transient liquid phase bonding method: A bonding method, comprising locating a composition between and in contact with first and second pieces, the composition including a bonding metal which is one of Zn, Sn, In, and Bi, and a melting temperature depressing metal which is different than the bonding metal and is one of Zn, Sn,... Agent: Stephen M. De Klerk Blakely, Sokoloff, Taylor & Zafman LLP