Metal fusion bonding inventions 06/07

20070145101 - Method for mounting chip component and circuit board: A method for mounting a chip component includes the steps of: flattening a solder deposit adhering onto a land terminal of a circuit board; forming grooves on the solder deposit simultaneously with or after flattening the solder deposit; coating the solder deposit with a flux; and placing a chip component... Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070145098 - Can and lithium secondary battery using the same: A can for a lithium secondary battery and a lithium secondary battery using the same, where guide slots are formed in a bottom wall and a sidewall of the can of the lithium secondary battery so that the can is symmetrically bent about a longitudinal axis thereof when the lithium... Agent: Robert E. Bushnell

20070145097 - Carbon nanotubes solder composite for high performance interconnect: An embodiment of the present invention is an interconnect technique. Carbon nanotubes (CNTs) are prepared. A CNT-solder composite paste is formed containing the CNTs and solder with a pre-defined volume fraction.... Agent: Blakely Sokoloff Taylor & Zafman

20070145103 - Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas: Methods and associated apparatus are disclosed for use in mounting particles on and de-mounting particles from a substrate having an array of tacky and non-tacky areas. The particles can be either electrically conducting or electrically non-conducting. Selection of electrically conducting particles is preferred. The substrate having an array of tacky... Agent: Medlen & Carroll, LLP

20070145100 - Low alternating-current loss oxide superconductor and fabricating method thereof: The present invention is configured such that, in a low AC loss oxide superconductor constituted by providing an oxide superconducting layer 6 on a substrate 1, said oxide superconducting layer 6 is separated into a plurality of filament conductors 2 in parallel to the lengthwise direction of said substrate 1... Agent: Grossman, Tucker, Perreault & Pfleger, PLLC

20070145102 - Method for mounting a flip chip on a substrate: The invention concerns a method for mounting a semiconductor chip with bumps on one surface onto a substrate location of a substrate, whereby the bumps are brought into contact with corresponding pads on the substrate location. Reference marks are attached to the bondhead that enable measurement of the actual position... Agent: Thelen Reid Brown Raysman & Steiner LLP

20070145099 - Particle resonance sensing apparatus for identifying particles suspended in air using ping and ring functions: A particle identification detector of airborne particles of interest is contained in a battery operated 4″×4″×1.5″ box. Air is drawn through an internal chamber for analysis by pinging a sampling pad along the chamber with scanning microsecond bursts varying from 2 to 4 gHz. Resultant emf rings received from the... Agent: Leo J. Aubel

20070145104 - System and method for advanced solder bumping using a disposable mask: According to some embodiments, a process, an apparatus, and a system are provided. In some embodiments, the process includes reflowing solder located in an opening formed through both a solder resist material disposed on a substrate and a mask material disposed on top of the solder resist material; and removing... Agent: Buckley, Maschoff & Talwalkar LLC Attorneys For Intel Corporation

20070131733 - Apparatus and method for arranging devices for processing: An apparatus is provided for arranging for processing a semiconductor device having surface components on its surface. A device support comprising a set of protrusions for contacting a surface of the semiconductor device supports the semiconductor device on a plane. The protrusions are arranged and positioned such that they avoid... Agent: Ostrolenk Faber Gerb & Soffen

20070131734 - Method for the planar joining of components of semiconductor devices and a diffusion joining structure: A method for the planar joining of components of semiconductor devices involves coating the components with diffusion materials on their upper sides and rear sides, respectively. Subsequently, the components to be joined one on the other are introduced into a reducing atmosphere. The components are aligned and a compressive pressure... Agent: Edell, Shapiro & Finnan, LLC

20070131735 - Method and arrangement for friction welding: Method and arrangement for friction welding, wherein one of the parts to be joined is oscillated by means of an electromagnetic oscillator. The oscillator is electrically braked after controlled stimulation of oscillations and a pre-determinable oscillation period.... Agent: Milde & Hoffberg, LLP

20070131736 - Addition of d2 to h2 to detect and calibrate atomic hydrogen formed by dissociative electron attachment: A method of detecting and calibrating dry fluxing metal surfaces of one or more components to be soldered by electron attachment using a gas mixture of reducing gas comprising hydrogen and deuterium, comprising the steps of: a) providing one or more components to be soldered which are connected to a... Agent: Air Products And Chemicals, Inc. Patent Department

20070131737 - Solder deposition and thermal processing of thin-die thermal interface material: A solder is deposited on a heat sink. The solder is first reflowed at a first temperature that is below about 120° C. The solder is second heat aged at a temperature that causes the first reflowed solder to have an increased second reflow temperature. The heat aging process results... Agent: Schwegman, Lundberg, Woessner & Kluth, P.A.

20070125829 - Bi-material ultrasonic horn with integral isolation member: Disclosed is an ultrasonic horn for transporting ultrasonic energy to an operating location including a horn member, an energy transfer surface disposed on the horn member and an axle member joined to the horn member. The axle member can be provided by a first material. The ultrasonic horn can also... Agent: Kimberly-clark Worldwide, Inc.

20070125831 - Capillary for a bonding tool: A capillary is provided for a wire bonding tool that comprises a holding portion for clamping the capillary, a conical portion at a tip of the capillary for performing bonding and a substantially frustoconical portion located between the holding portion and the conical portion. The sidewalls of the frustoconical portion... Agent: Ostrolenk Faber Gerb & Soffen

20070125830 - Holding tool for fixing an electronic component and circular table manufacturing unit: A holding tool for fixing an electronic component (2) during a manufacturing process, said electronic component (2), comprising a winding assembly (20) and an electronic circuit (24), the holding tool (1) comprising a holding tool body (10), first an second jaws (12, 14) disposed at the holding tool body (10)... Agent: Griffin & Szipl, PC

20070125832 - Machining station and method for producing vehicle bodies: A machining station and a method produce vehicle bodies of different types. A clamping station has interchangeable clamping frames, at least one clamping frame magazine, into which the interchangeable clamping frames are deposited when not in use and from which the interchangeable clamping frames are removed when in use, and... Agent: Lerner Greenberg Stemer LLP

20070125833 - Method for improved high current component interconnections: A printed circuit board having at least one conductive region covered in solder paste has preformed solder elements placed on the solder paste in the conductive region. A component package is placed onto the printed circuit board over the conductive region and the solder is reflowed, forming a wide solder... Agent: Intel/blakely

20070125834 - Solders: A substantially lead-free solder, comprising: from around 96.8% to around 99.3% tin; from around 0.2 % to around 3.0% copper; and from around 0.02% to around 0.12% silicon.... Agent: Patrick W. Hughey