Metal fusion bonding inventions 05/07

20070119903 - Two-step high bottleneck type capillary for wire bonding device: A two-step high bottleneck type capillary for a wire bonding device having a height of 1.5˜5.0 mm and taper of 10˜15° from the capillary end is disclosed. The capillary consists of a straight portion; a first bottleneck portion extending upwards from the end of the capillary to a first step... Agent: Peter T. Kwon G W I P S

20070119905 - Component mounting tool, and method and apparatus for mounting component using this tool: Component 3 is pressed onto a circuit board 4 so that their respective metal interconnects 5, 6 are in close contact with each other, and ultrasonic vibration is applied to the suction nozzle 14 holding the component 3. Friction is thereby generated between metal interconnects 5, 6 whereby the component... Agent: Snell & Wilmer LLP (oc)

20070119904 - Electrical circuit apparatus: An electrical circuit apparatus that includes; a substrate having a top side, a ground layer, at least one thermal aperture, and at least one solder aperture; a heat sink; and an adhesive layer for mechanically coupling the heat sink to the ground layer of the substrate, the adhesive layer having... Agent: Motorola, Inc.

20070119906 - Deposition friction stir welding process and assembly: A deposition friction stir weld process of joining work pieces includes placing a filler material on and about a joint line formed by butting a first work piece surface against a second work piece surface; and frictionally heating the filler material to soften the filler material and portions of the... Agent: General Electric Company Global Research

20070119907 - Process for producing composite body: A composite body which can withstand high thermal stresses is formed by high-temperature soldering at least a part of a high-temperature-resistant, metallic or nonmetallic component and at least a part of a high-temperature-resistant, nonmetallic component. Prior to soldering, a metallic barrier layer, which is impervious to the solder melt, of... Agent: Lerner Greenberg Stemer LLP

20070119908 - Titanium-aluminide turbine wheel and shaft assembly: A titanium-aluminide turbine wheel (120, 220, 320, 420) is joined to the end of a shaft (110, 210, 310, 410) by utilizing a titanium surface on the end of the shaft to be joined to the wheel, and electron-beam welding the wheel onto the titanium surface on the shaft. A... Agent: Alston & Bird LLP

20070119909 - Method of processing seals like leaf seals: A method of processing seals (20), like leaf seals, in which seals (20) an annular gap, formed between two coaxial, cylindrical surfaces, is sealed off in the axial direction by a multiplicity of individual, thin sealing elements (22; 22a, b) which, with an orientation deviating from the radial direction, extend... Agent: Cermak & Kenealy LLP

20070119910 - Process for attaching components with near-zero standoff to printed circuit boards: The present invention relates to a method and apparatus for mounting electrical components to electric circuit boards. Specifically, the present invention relates to a method for mounting electrical components having near-zero standoff height to electrical printed circuit boards.... Agent: Delphi Technologies, Inc.

20070119911 - Method of forming a composite standoff on a circuit board: A composite standoff is formed on a circuit board during the processing of the circuit board while an array of electrical circuit traces including contact pads are formed, portions of the electrical circuit traces are covered by a solder mask, and legend ink is applied to the circuit board for... Agent: Delphi Technologies, Inc.

20070114263 - Friction stir welding method and friction stir welding tool: In a friction stir welding method for friction stirring and welding a material by using a rotating tool 2 having a shoulder 4 and a pin 5 at a front portion of a shaft portion 3 and injecting a cooling agent Ac from a cooling nozzle 11 to the tool... Agent: Rankin, Hill, Porter & Clark LLP

20070114264 - Mesotube electode attachment: A device for positioning a shaped element on a surface of another element mounted on a mechanism to permit welding the element to the surface. An insulating fixture mounts the device on the mechanism and positions an extension having a clamp locating end that positions a clamp for holding the... Agent: Kris T. Fredrick Patent Services

20070114266 - Method and device to elongate a solder joint: A method and device to elongate a solder joint are provided. The method begins by forming an elongator on a first substrate. The elongator comprises an expander and an encapsulant to encapsulate the expander. A solder joint is formed to connect the first substrate to a second substrate. Thereafter, the... Agent: Martine Penilla & Gencarella, LLP

20070114265 - Supporting device of a transport device of a soldering apparatus: The invention relates to a supporting device of the transport device of a soldering apparatus for the conveying of printed-circuit boards with at least two revolving, endless transport chains, said transport chains running in guide rails in the transport zone and each passing through two guide elements at the ends... Agent: Birch Stewart Kolasch & Birch

20070114267 - Method for making a backlight module frame: A method for making a backlight module frame includes: providing at least two starting components; welding the starting components at the edges to form a semi-manufactured frame; pressing the semi-manufactured frame to form a backlight module frame. The backlight module frame can be manufactured easily by said method and has... Agent: Morris Manning Martin LLP

20070114268 - Heat exchanger and manufacturing method for the same: In a heat exchanger, a core portion includes a plurality of plate fins each shaped like a flat plate and a plurality of tubes in which a fluid flows and each of which is inserted into each of the plate fins to be mechanically bonded thereto. Further, an end portion... Agent: Harness, Dickey & Pierce, P.L.C

20070114269 - Formed metal core sandwich structure and method and system for making same: A method and apparatus for producing a metal core sandwich structure that is lightweight and many times stiffer than regular sheet metal, and which is easily formable into curved structures as well as structures having compound curves. In one embodiment, a formed metal core includes a plurality of cells comprising... Agent: Morrison & Foerster LLP

20070108253 - Gold/nickel/copper/aluminum/silver brazing alloys for brazing wc-co to titanium alloys: A brazing material including about 2 to about 30 percent by weight gold, about 4 to about 14 percent by weight nickel, about 25 to about 65 percent by weight copper, about 1 to about 3 percent by weight aluminum and about 20 to about 55 percent by weight silver.... Agent: General Electric Company

20070108254 - Circuit board: A circuit board (A1) comprises an insulating base board (1), a conductive pad (4a) provided on the base board, and a metal member (3) bonded to the pad via a solder layer (6). The metal member (3) includes a welding portion (3a) to be welded to a terminal (5) for... Agent: Hamre, Schumann, Mueller & Larson, P.C.

20070108255 - Process for the pressureless sintering of metal alloys; and application to the manufacture of hollow spheres: Hollow metal spheres are heated in a high vacuum in the presence of an organic substance, at a temperature at least equal to the melting point of a eutectic between carbon and the metallic constituents of the said spheres.... Agent: Christie, Parker & Hale, LLP

20070108256 - Wire bonding method: A wire bonding method including the steps of: descending a capillary 5 from above an external lead 1 to press a wire 10 to such an extent that the wire is not completely connected to the external lead 1, thus forming a thin part 16 in the wire; next ascending... Agent: Koda & Androlia

20070108257 - Padless substrate for surface mounted components: A semiconductor package having a low profile is disclosed. In embodiments, a surface mounted component may be mounted directly to the core of the semiconductor package substrate, so that there is no conductive layer, plating layers or solder paste between the component and the substrate core. The surface mounted component... Agent: Vierra Magen/sandisk Corporation

20070102477 - Imaging system and method for a stencil printer: A stencil printer for depositing solder paste onto a plurality of pads of an electronic substrate includes a frame and a stencil coupled to the frame. The stencil has a plurality of apertures formed therein. The stencil printer further includes a support assembly coupled to the frame, the support assembly... Agent: Lowrie, Lando & Anastasi

20070102478 - Optimal imaging system and method for a stencil printer: A stencil printer for depositing solder paste onto an electronic substrate includes a frame and a stencil coupled to the frame. A dispenser is coupled to the frame, with the dispenser and the stencil being configured to deposit solder paste onto the plurality of pads of the electronic substrate. An... Agent: Lowrie, Lando & Anastasi

20070102479 - Control system: A control system for controlling a work machine like a workpiece attitude changing device, by the welding torch of a welding robot. The system includes detecting members for detecting the welding torch at multiple locations in a casing; a plurality of air supply tubes with one end connected to an... Agent: D. Peter Hochberg Co. L.p.a.

20070102484 - Angled caulking tip attachment: A tip attachment for use in dispensing products from tubes or squeeze bottles, such as caulking, sealants, adhesives, lubricants or the like. An elongate tip attaches to a threaded base member, the threaded base member adapted for engagement with a standard straight tip of the product tube. The tip is... Agent: Patenttm.us

20070102482 - Assembly of a component mounted on a transfer surface: An optical component to be mounted on a transfer surface. At least one face of the optical component includes at least one metallized bonding land arranged in a notch for assembly by transfer of the component and soldering of metallized bonding lands on the transfer surface.... Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070102487 - Bonding structure of substrate and component and method of manufacturing the same: A bonding structure and method of manufacturing the same are provided. The bonding structure of a substrate and a component include an electrode formed of metal powder and a resin component on the substrate. A low melting point solder that bonds the component to the electrode. The metal powder contains... Agent: Brinks Hofer Gilson & Lione

20070102490 - Circuit board,method of mounting surface mounting component on circuit board, and electronic equipment using the same circuit board: A through hole 2 in a circuit board 1 and to be joined to a lead 5 in a surface mounting component 6 is prepared from a material such as nickel, and palladium having a thermal conductivity equal to or less than 100 W/m.K, the circuit board 1 involving a... Agent: Sughrue Mion, PLLC

20070102491 - Flip chip dip coating encapsulant: A method for encapsulating a flip chip in one step is disclosed. The flip chip is immersed in a polymer bath to apply a coating of the polymer to the surface of the flip chip except for the distal end of the conductive projections on the flip chip electrically conductive... Agent: Whyte Hirschboeck Dudek S.c.

20070102483 - Low temperature diffusion braze repair of single crystal components: The present invention is directed to a process for repairing cracks in a turbine engine component. The process comprises the steps of providing a component, preferably formed from a single crystal nickel based material, with at least one crack, applying a repair alloy composition containing a single crystal nickel based... Agent: Bachman & Lapointe, P.C. (p&w)

20070102488 - Method and apparatus for weld profiling: A method for removing a weld crown from a weld joint between first and second work pieces includes steps of positioning a rotary milling tool proximate to the joint and at an offset angle to set a cutting arc relative to the joint. The milling tool is positioned so the... Agent: Bacon & Thomas, PLLC

20070102481 - Solder paste: In reflow soldering using a solder paste formed by mixing a flux and a solder powder, the present invention suppresses the formation of voids and prevents the formation of large-diameter voids which have an adverse effect on the reliability of soldering. The flux contains a solder for which the temperature... Agent: Michael Tobias

20070102485 - Soldering method and apparatus: It is a soldering method for bonding, by solder, each bonding pad formed on respective bonding targets to be bonded to each other. The method comprises the steps of: a pad heating step for irradiating heating beams while the solder is placed on irradiation paths of the heating beams in... Agent: Greenblum & Bernstein, P.L.C

20070102489 - Ultrasonic welding head: An ultrasonic welding head for ultrasonic welding connection of a chip to a substrate is described, in which the welding parameters have a negligibly slight variation or are constant. This is attained by providing that a static friction element that increases the static friction relative to the chip to be... Agent: Cohen, Pontani, Lieberman & Pavane

20070102480 - Welded connections: A method for welding an end of a polygonal hollow section (PHS) to a member comprises the step of forming a weld across a surface of the PHS. The weld extends continuously from a connection weld connecting the PHS and the member to a location remote from the connection weld.... Agent: Bromberg & Sunstein LLP

20070102486 - Wire embedded bridge: A wire embedded bridge made by the apparatus and method disclosed by example herein may be commonly used for the formation of an RFID circuit or chip strap. The process uses flexible polyester and/or other films as a base component of the bridge. A wire is heated and embedded into... Agent: Caesar, Rivise, Bernstein, Cohen & Pokotilow, Ltd.

20070102492 - Friction stir welding using a superabrasive tool: A probe for friction stir welding MMCs, ferrous alloys, non-ferrous alloys, and superalloys, as well as non-ferrous alloys, the probe including a shank, a shoulder, and a pin disposed through the shoulder and into the shank, wherein the pin and the shoulder at least include a coating comprised of a... Agent: Morriss O'bryant Compagni, P.C.

20070102493 - Titanium stretch forming apparatus and method: A stretch-forming apparatus includes a main frame which carries a die enclosure between jaw assemblies. An insulated die is mounted in the enclosure. A method of forming a component includes placing a workpiece in the enclosure, heating the workpiece to a working temperature using electrical resistance heating, and then stretching... Agent: Adams Evans P.A.

20070102494 - Superplastic forming of titanium assemblies: A method of superplastic forming of titanium packs and an associated assembly is provided. The titanium packs can include sheets having different granular structures so that the different sheets are adapted to superplastically form at different temperatures. One or more of the sheets can be formed at a temperature that... Agent: Alston & Bird LLP

20070095878 - Method and system for monitoring and controlling characteristics of the heat affected zone in a weld of metals: Method and system for monitoring and controlling at least one of the plurality of quantifiable heat affected zone (“HAZ”) characteristics in a weld of metal pieces provides a user with information concerning at least a first quantifiable HAZ characteristic for a weld, and also provides for control of an operating... Agent: Norris Mclaughlin & Marcus, P.A.

20070095879 - Methods and apparatus for assembling a printed circuit board: A method for manufacturing a printed circuit board includes providing a board including a plurality of electrical traces, a first surface, and a second surface opposite the first surface. The method further includes providing at least one surface mount component having a plurality of electrical terminals. The method also includes... Agent: John S. Beulick (13307)