Metal fusion bonding inventions 04/07

20070090150 - Component handling device: A component handling device is disclosed. The component handling device includes a body with a component receiving portion that has a front region defining a first opening and a rear region defining a second opening. Also, the component receiving portion includes a component encasing wall extending from the first opening... Agent: Hewlett Packard Company

20070090151 - Welding head with heat-conducting structure for a gas welding gun: A welding head with heat-conducting structure for a gas welding gun comprises: a housing, a welding head and a non-flat net-like heating member. The housing is formed with a recess and a plurality of air holes in communication with the recess. The welding head is installed on the housing and... Agent: Charles E. Baxley, Esq.

20070090169 - Cast parts with enhanced wear resistance: The invention concerns a cast wear part with its structure reinforced by at least a type metal carbide, and/or metal nitride, and/or boride, and/or metal oxides, and/or intermetallic compounds, referred to below as constituents. The invention is characterized in that the raw materials used as reagents for said constituents have... Agent: Fitch Even Tabin And Flannery

20070090161 - Casting steel strip: A method of casting steel strip by introducing molten plain carbon steel on casting surfaces at least one casting roll with the molten steel having a free nitrogen content below 120 ppm and a free hydrogen content below about 6.9 ppm. The free nitrogen content maybe below about 100 ppm... Agent: Hahn Loeser & Parks, LLP

20070090159 - Clamp apparatus, joining method, and method of manufacturing hollow member: A clamp apparatus clamps a circular cover in joining together a base having a circular recess and the cover fitted into the recess of the base, at and around an entire annular joint interface between a circumferential wall of the cover and a circumferential wall of the recess of the... Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070090160 - Electronic part manufacturing method: The objective of this invention is to prevent the generation of defects pertaining to placement of solder balls on the terminal placement parts of the electronic part main body. The solder ball 1 has spherical core 2 and coating layer 3 that covers core 2. The coating layer 3 contains... Agent: Texas Instruments Incorporated

20070090152 - Method for cladding the blade tips of rotor blades of a gas turbine power plant and device for carrying out the method: A method is for the cladding of blade tips of compressor blades of a gas turbine power plant, using a blank, which is made up of a solder foil provided with a metal layer having embedded hard particles and which is adapted to the geometry of the blade tip that... Agent: Kenyon & Kenyon LLP

20070090156 - Method for forming solder contacts on mounted substrates: A method is provided for forming a microelectronic assembly. A semiconductor substrate having a first thickness is mounted to a support substrate with a low temperature adhesive. The semiconductor substrate is thinned from the first thickness to a second thickness. At least one contact formation is formed on the semiconductor... Agent: Ingrassia, Fisher & Lorenz, P.C.

20070090157 - Method for reducing variations in the bending of rolled base plates and semiconductor module having such a base plate sensor: A method for reducing variations in the bending of rolled metal base plates for semiconductor modules is disclosed. In this method, the base plates are rolled in their longitudinal direction in a specific manner.... Agent: Dicke, Billig & Czaja, P.l.l.c.

20070090158 - Method of fabricating foil brazing member: A method of fabricating a foil brazing member is disclosed and comprises the steps of ejecting molten metal of a brazing metal alloy onto a rotating metal cooling roll from at least an opening of a nozzle, cooling and solidifying the molten metal by the cooling roll and forcibly separating... Agent: Harness, Dickey & Pierce, P.L.C

20070090154 - Method of forming a product of metal-based composite material: A forming method wherein a billet (31, 66, 77, 87, 107, 128, 136, 144, 153, 77B, 77C) comprising a metal-based composite material (27) prepared by mixing an aluminum alloy (22) and a ceramic (15) is subjected to pressure forming to manufacture a formed article, which comprises carrying out the pressure... Agent: Armstrong, Kratz, Quintos, Hanson & Brooks, LLP

20070090155 - Method of making tailored blanks using linear friction welding: A method of making tailored blanks in accordance with one embodiment comprises the steps of friction welding a first joining surface of a first structural member having a substantially non-rectangular parallelogram profile to a first portion of a joining surface of a substrate; and thereafter concurrently linear friction welding first... Agent: Ostrager Chong Flaherty & Broitman, P.C.

20070090166 - Microfluidic cell culture device: Microfluidic devices for cell culturing and methods for using the same are disclosed. One device includes a substrate and membrane. The substrate includes a reservoir in fluid communication with a passage. A bio-compatible fluid may be added to the reservoir and passage. The reservoir is configured to receive and retain... Agent: Brooks Kushman P.C.

20070090168 - Protective coating and coated welding tip and nozzle assembly: A coated welding tip and nozzle assembly is disclosed. The tip and the nozzle are coated with a coating composition comprising titanium dioxide. The coating provides resistance to adhesion and accumulation of weld spatter on the nozzle and tip and facilitates weld spatter removal. The coating also protects against thermal... Agent: Winston & Strawn LLP Patent Department

20070090162 - Reinforced sandwich structure: The present invention relates to a reinforced sandwich structure (10) comprising stacked in height direction thereof, at least one top layer (2) and at least one bottom layer (3) comprising a fibrous reinforcing material, which top and bottom layer sandwich between them at least one core (1) of a foamed... Agent: Akerman Senterfitt

20070090153 - Singlet oxygen quencher and composition using the same: A novel singlet oxygen quencher is disclosed. The quencher comprises a colloidal liquid of a platinum metal group. A composition comprising, as an active ingredient, the singlet oxygen quencher is also disclosed.... Agent: Greenblum & Bernstein, P.L.C

20070090165 - Spot weld fracture analysis method, program therefor, and analysis apparatus thereof: A spot weld fracture analysis method for a spot weld portion of three or more mutually superimposed plates that are spot-welded at a common welding point comprises an analysis step of executing an analysis by using a finite element model in which each plate is modeled by shell elements, and... Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070090164 - System and methods for data-driven control of manufacturing processes: Systems and methods for implementing hybrid, closed-loop control that generates control values for processes defined by a limited number of function evaluations and large amounts of process and measurement noise. The described control system is applied to a stencil printing process for applying solder paste to an electronic medium such... Agent: Thomas, Kayden, Horstemeyer & Risley, LLP

20070090167 - Weld filler, use of the weld filler and welding process: The invention relates to a weld filler and to a use of a weld filler which significantly improves the weldability of some nickel-based superalloys and includes the following constituents (in wt %): 17.5%-20.0% chromium (Cr) 10.0%-12.0% cobalt (Co) 9.0%-10.5% molybdenum (Mo) 0.1%-3.3% titanium, in particular 3.0%-3.3% titanium (Ti), 1.4%-1.8% aluminum... Agent: Siemens Corporation Intellectual Property Department

20070090163 - Welding accessory arrangement: A welding accessory system for a welder that includes a welder having a welder housing and at least one welding accessory support connected to the welder housing to support at least one welding accessory of a welder. The one or more welding accessory supports include a cable holder, an electrode... Agent: Fay Sharpe / Lincoln

20070090170 - Method of making a circuitized substrate having a plurality of solder connection sites thereon: A method of making a circuitized substrate in which solder material (e.g., in paste form) is deposited through a screen onto individual conductors in a spaced pattern of individual solder “islands”. A solder flux is then deposited onto the “islands” causing these to spread out and form a continuous solder... Agent: Lawrence R. Fraley Hinman, Howard & Kattell, LLP

20070090171 - Method for manufacturing a printed circuit board for electronic devices and an electronic device using the same: A soldering technology, particularly a lead-free soldering technology, that can secure the reliability of a whole electronic device is provided. In a method for manufacturing a printed circuit board for electronic devices with a substrate to which a plurality of electronic parts having connection terminals with different metal compositions are... Agent: Armstrong, Kratz, Quintos, Hanson & Brooks, LLP

20070084900 - Bonding apparatus comprising improved oscillation amplification device: A bonding apparatus such as an ultrasonic transducer is provided that comprises an oscillation amplification device having a longitudinal axis and a substantially triangular cross-sectional area on a plane that is orthogonal to the longitudinal axis. An ultrasonic driver is coupled to the oscillation amplification device at a first position... Agent: Ostrolenk Faber Gerb & Soffen

20070084901 - Lightweight bondhead assembly: A bondhead assembly having a bond body for mounting a bonding tool, a support structure that is configured to be drivable for moving the bondhead assembly to different locations and flexural elements arranged substantially along at least one plane which couple the bond body to the support structure for flexibly... Agent: Ostrolenk Faber Gerb & Soffen

20070084902 - Conduit purging device and method: A device for purging gas comprises a conduit assembly defining an interior volume. The conduit assembly comprises a first conduit portion having an open first end and an open second end and a second conduit portion having an open first end and a closed second end. The open second end... Agent: Nasa Goddard Space Flight Center

20070084903 - Pronged fork probe tip: Provided is a pronged fork probe tip for probing a node, such as a through-hole node, on a circuit. The probe tip has a shaft made from an electrically conductive material, concentric to a longitudinal probe axis, and two fork prongs coupled to the shaft and positioned parallel to the... Agent: Hewlett Packard Company

20070084904 - Conductive ball, formation method for electrode of electronic component, electronic component and electronic equipment: A conductive ball is formed by coating a generally spherical-shaped core made of a non-metallic material with a coating layer composed of a Cu layer and an Sn-5.5Ag alloy layer of non-eutectic composition. The conductive ball is disposed on a land of an electronic component via flux and reflown at... Agent: Nixon & Vanderhye, PC

20070084905 - Method of making tailored blanks using linear friction welding: A method of making a tailored blank comprising the following steps: (a) friction welding first and second structural members together at a substantially right angle with respect to each other to form an intersection comprising a first joining surface formed by adjoining bottom faces of the first and second structural... Agent: Ostrager Chong Flaherty & Broitman, P.C.

20070084906 - Hole repair technique and apparatus: A method of hole defect repair includes removing one or more defects at or near a desired hole shape in a substrate by removing a non-concentric portion of the substrate proximate the desired hole shape, and welding a filler material to the substrate after removing the non-concentric portion of the... Agent: Kinney & Lange, P.A.

20070080189 - Catalytic reactor: The invention relates to a reactor (1), suitable for the catalytic conversion of a feed mixture which is capable of explosion and/or ignition, comprising a feed supply chamber (2), an effluent discharge chamber (3), a catalyst bed (4) having an upstream surface (5) and a downstream surface (6) which is... Agent: Shell Oil Company

20070080194 - Heat shield with a sandwich construction: A heat shield is disclosed having first and a second three-dimensionally deformed metal layers which are connected to one another such that an outer edge section of the first metal layer is flanged on the second metal layer around substantially the entire circumference of the outer edge of the second... Agent: Rader, Fishman & Grauer PLLC

20070080191 - Method and apparatus of producing a welded connection between the surfaces of two planar workpieces: A method for producing a welded connection between a first workpiece and a second workpiece and also an apparatus for carrying out the method are illustrated and described. The object of providing a method for producing a welded connection between two workpieces along a parallel joint in which thermal energy... Agent: Marshall, Gerstein & Borun LLP

20070080190 - Method of mounting a semiconductor chip: When a semiconductor chip is mounted using ultrasonic vibration, a method of mounting makes it possible to bond the semiconductor chip and bonding patterns with sufficient bonding strength without making the construction of a circuit board complex. The method of mounting a semiconductor chip causes ultrasonic vibration to act on... Agent: Armstrong, Kratz, Quintos, Hanson & Brooks, LLP

20070080193 - Ultrasonic horn: An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges,... Agent: Koda & Androlia

20070080195 - Friction stir welding tool with counterbearing for mounting on a handling device: Illustrated and described is a friction stir welding device for mounting on a handling device. The object that the forces and moments which have to be absorbed by the handling device during the welding operation in the course of the movement of the friction stir welding tool along the weld... Agent: Marshall, Gerstein & Borun LLP

20070075118 - Apparatus, system, and method for positioning a printed circuit board component: An apparatus, system, and method are disclosed for positioning a printed circuit board component. A clamping member applies a clamping force to a levering member linked to a positioning member. The levering member biases the positioning member toward a printed circuit board in response to the clamping force. The positioning... Agent: Kunzler & Associates

20070075121 - Apparatus and system for welding preforms and associated method: An assembly for positioning a structural assembly for friction stir welding, and a system and method for friction stir welding the structural assembly are provided. The assembly includes a frame defining an aperture therein, and at least one structural member positioned within the aperture. The assembly also includes at least... Agent: Alston & Bird LLP

20070075120 - Methods for inhibiting corrosion in brazed metal surfaces and coolants and additives for use therein: wherein R1, R2, R3, and R4 are each independently selected from the group consisting of H, OH, COOH, C1-C10alkyl groups, glycol esters, anhydride groups, —COOM, and combinations thereof, wherein M is at least one of H, alkali metal ions, alkali earth metal ions, NH4+, amines, imidazoline, polyalcohol esters, C1 to... Agent: Honeywell International Inc. Law Department Patent Services

20070075119 - Solder feeder: A solder feeder includes a housing member, a solder gripper assembly with a solder guide tube, a solder holder, a trigger means, and a solder path tube receiving a straight or a curved nozzle. Solder from a solder spool is extended forward when the trigger means is engaged or activated.... Agent: Chung M. Wong

20070075122 - Method for fabricating a chip module and a device module fabricated therefrom: The present invention relates to a method for fabricating a device module having the steps of providing an integrated device in a Ball Grid Array package wherein the integrated device has a solder contact elevated from a surface of the integrated device, providing a printed circuit board having a contact... Agent: Patterson & Sheridan, LLP Gero Mcclellan / Infineon / Qimonda