Metal fusion bonding inventions 02/07

20070039998 - Column suction-holding head and column mounting method: [Problem to be Solved] When a multiplicity of columns are to be connected to a ceramic substrate of a ceramic column grid array, a mounting jig is placed over the ceramic substrate, and the columns are inserted into holes of the mounting jig. If the columns are inserted into the... Agent: Wenderoth, Lind & Ponack, L.L.P.

20070039999 - Soldering apparatus and soldering method: A soldering apparatus including a preheating conveyor belt to convey a printed circuit board with electronic components mounted thereon, at least one preheating heater to preheat the printed circuit board conveyed by the preheating conveyor belt, a soldering conveyor belt positioned adjacent to the preheating conveyor belt to convey the... Agent: Stein, Mcewen & Bui, LLP

20070040003 - Low temperature methods of bonding components and related structures: Methods of bonding two components may include positioning the components relative to one another to obtain a desired orientation. Once the desired orientation is obtained, the components can be bonded in the desired orientation with metal wherein a temperature of both components is maintained below a melting temperature of the... Agent: Myers Bigel Sibley & Sajovec

20070040002 - Method for forming a weldbonded structure: A method for weldbonding at least two work-pieces together includes applying an adhesive to a first surface of a first work-piece, and bringing the first surface of the first work-piece into contact with a surface of a second work-piece. The first work-piece and second work-piece are then friction stir or... Agent: Ingrassia Fisher & Lorenz, P.C.

20070040004 - Process for producing a high temperature-resistant structure with application of bonding agent: A process for producing a high temperature-resistant structure having at least one at least partially structured metallic layer includes applying a bonding agent to at least one joining portion of the at least one layer. The bonding agent is applied in drop form to form a bonding layer with a... Agent: Lerner Greenberg Stemer LLP

20070040001 - Welded structure having excellent resistance to brittle crack propagation and welding method therefor: A welding method for manufacturing welded structures having excellent properties to prevent the propagation of brittle fracture occurring in welded joints, characterized by the step of forming a repair weld having a greater toughness than that of a butt weld and an outer edge whose angle φ with respect to... Agent: Kenyon & Kenyon LLP

20070040000 - Zoned stretching of a web: There is provided an apparatus and methods for stretching one or more zones of a web and webs including one or more stretched zones. Each of the stretched zones in the web is stretched in the cross-web direction, i.e., the direction transverse to the downweb direction. The stretching can be... Agent: 3m Innovative Properties Company

20070040005 - Vibration stress relief of weldments: A method of stress relief for stainless steel combustion turbine components includes vibrating the components during welding at a subharmonic frequency. The proper frequency is selected to be below a harmonic frequency, and to produce an amplitude in the range of ¼ to ½ the amplitude produced by a harmonic... Agent: Siemens Corporation Intellectual Property Department

20070040007 - Friction stir spot joining device: There is provided a friction stir spot joining device in which a pin can be simply and surely caused to come in or come out from a tip end of a joining tool by driving a pin extraction motor when the pin extraction motor is used so as to cause... Agent: Flynn Thiel Boutell & Tanis, P.C.

20070040006 - Material forming tool and method for forming a material: A material forming tool and a method for forming a material is described and which includes a shank portion; a shoulder portion which releasably engages the shank portion; a pin which releasably engages the shoulder portion, and wherein the pin defines a passageway; and a source of a material coupled... Agent: Alan D. Kirsch

20070040008 - Method and apparatus for diffusion bonding, brazing and joining: Apparatus for diffusion bonding, brazing, or joining between respective surfaces of two parts, e.g., the exterior wall of a first annular cylinder and the interior wall of a concentric second annular cylinder, includes a cylindrical body having a circumferential cavity positioned between upper and lower ends thereof. A flexible annular... Agent: Macpherson Kwok Chen & Heid, LLP

20070034671 - Friction stir welding load confirmation system: A portable multi-axis load confirmation tool having a rotating ball on the end thereof follows a three-dimensional weld program path therewith. The ball reacts to an internal load cell for verifying weld program path dynamics before an actual program is run with friction stir welding tools. The load cell is... Agent: Ostrager Chong Flaherty & Broitman, P.C.

20070034672 - Method of and installation for rolling in-process stock: p

20070034673 - Seam-welded air hardenable steel constructions: The present invention provides seam-welded, air hardenable steel tubes, methods of manufacturing seam-welded air hardenable steel tubes, tube mills for practicing such methods and applications for using seam-welded, air hardenable steel tubing of the present invention.... Agent: Drummond & Duckworth

20070034674 - Semiconductor device: A wire bonding method that connects a first bonding point and a second bonding point by a wire, the method including a step that press-bonds a ball formed on a tip end of a wire to a first bonding point, thus forming a press-bonded ball; a step that slightly raises... Agent: Koda & Androlia

20070034675 - Implantable lead attachment: The invention is a lead attachment suitable for implantation in living tissue that enables connection of a wire that is comprised of stainless steel to a tack that in turn is bonded to a titanium swage cup, preferably Ti-6Al-4V. The wire is attached by crimping inside a crimping tube, to... Agent: Alfred E. Mann Foundation For Scientific Research

20070034676 - Electric field assisted solder bonding: Substrates such as wafers often have surface or other imperfections that can create gaps when the wafers are solder bonded together. Such substrates can be more effectively bonded together by subjecting an intervening solder layer to an electrostatic force that causes the solder layer to be pulled to fill at... Agent: Honeywell International Inc.

20070023478 - Thermocompression bonding module and method of using the same: A thermocompression bonding module includes a thermode assembly configured to be mounted to a plate member. The thermode assembly includes a heater assembly configured to apply a bonding force to an item during a bonding operation and a control device coupled to the heater assembly for adjusting the bonding force... Agent: Lisa B. Vaccarelli Tyco Technology Resources

20070023479 - Apparatus and method for joining pipe ends together: A method and apparatus for joining pipe sections (102, 104) together to form an underwater pipeline. The pipe sections (102, 104) are in an abutting position and have a generally vertical orientation. An upper end (108) of the most recently joined pipe sections (104) is to be welded to a... Agent: Browdy And Neimark, P.l.l.c. 624 Ninth Street, Nw

20070023480 - Bead trimmer with a tool extraction system: The bead trimmer is preferably applied in a production line for elements having longitudinal weld beads (21), where an element slides along a parallel direction to a longitudinal axis thereof (x), and comprises a tool-bearing turret (2) for removable fixing of a trimming tool (30), associated to a first slide... Agent: Young & Thompson

20070023482 - Oil distillation vacuum column with thickened plate in the vapor horn section: A vacuum column for oil distillation incorporates a thickened plate that has a layer of erosion-resistant material that is thicker than the corrosion-resistant thickness of an adjacent column section. Use of thickened, explosive- or roll-bonded clad plates may provide better service than either conventional plug-welded liners or conventional shell plates... Agent: Marshall, Gerstein & Borun LLP

20070023481 - Soldering work piece, soldering method and heat exchanger: The invention relates to a soldering work piece made of aluminium and/or aluminium compounds, to a soldering method, in addition to a heat exchanger soldered in said manner. One surface of the soldering work piece is provided with an artificially applied oxide layer.... Agent: Foley And Lardner LLP Suite 500

20070023483 - Packaging method: A packaging method includes ultrasonically bonding a semiconductor device and a substrate together via bumps that include gold as a main component thereof. A contact surface of a primary bump on a surface of an aluminum pad on one side of the substrate contacts and is ultrasonically bonded to a... Agent: Posz Law Group, PLC

20070023484 - Friction stir welding apparatus: A body member and flange members are butted together at first and second abutment portions, and are retained by first and second backing jigs. In this arrangement, inner circumferential surfaces of the first and second abutment portions are fitted on and in close contact with outer circumferential surfaces of the... Agent: Lahive & Cockfield, LLP

20070023485 - Method of repairing a blade of a one-piece bladed disc of a turbomachine and test piece for implementing the method: To repair the blade, a patch is welded by an electron beam. The method starts by machining the damaged zone so as to obtain a zone to be repaired having a defined profile; welded on to a first test piece element corresponding to the blade, having said defined profile, is... Agent: C. Irvin Mcclelland Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070023486 - Apparatus and a method of soldering a part to a board: The present invention provides technology that uniformly heats and melts a plurality of solder material arranged in a plurality of locations on a board, and uniformly solders a plurality of parts to the board that are arranged in a plurality of locations on the board. A soldering apparatus includes an... Agent: Kenyon & Kenyon LLP

20070023488 - Method of making an electronic assembly: A method of making an electronic assembly comprising an electronic component that is attached to a circuit board by protruding solder bumps of the electronic component places the electronic component on a surface of the circuit board so that solder bumps on the bottom of the electronic component engage contact... Agent: Delphi Technologies, Inc.

20070023487 - Wire bonding method and device of performing the same: A wire bonding method may involve forming a bonding ball on a leading end of a wire projected from a capillary. The bonding ball may be transformed to increase an area of the mounting surface of the bonding ball. The transformed bonding ball may be bonded to the bonding pad.... Agent: Harness, Dickey & Pierce, P.L.C

20070023489 - Method of joining components using amorphous brazes and reactive multilayer foil: In accordance with the invention, a first body is joined to a second body by joining a first amorphous braze layer to a surface of the first body and joining a second amorphous braze layer to a surface of the second body. A reactive multilayer foil is then disposed between... Agent: Polster, Lieder, Woodruff & Lucchesi