Metal fusion bonding inventions 01/07

20070017955 - Weld metal material apparatus and method: A solid weld-metal-producing material is formed by agglomerating weld metal material powder. An igniter may be integrally formed in or on the agglomerated weld metal material. In addition to typical components of a weld metal material mixture, such as a reductant metal and a transition metal oxide, the agglomerated weld... Agent: Jonathan A. Platt Renner, Otto, Boisselle & Sklar, LLP

20070017957 - Method and apparatus for detecting parameters of a liquid metal in a container: A method and an apparatus for measuring simultaneously and in a reliable manner both the level of molten metal in a casting mold and the depth of molding powder floating over the molten metal, wherein an electromagnetic open cavity is formed on the upper inlet aperture of a casting mold... Agent: Mcdonnell Boehnen Hulbert & Berghoff LLP

20070017958 - Method for coating a substrate and articles coated therewith: Methods for coating a substrate, such as a turbine engine component, are presented. In one method a preform comprising braze alloy and wear-resistant particles is attached to the substrate. The preform is then bonded to the substrate to form the wear-resistant coating. Other embodiments include articles, such as components for... Agent: General Electric Company Global Research

20070017956 - Modified flux system: A titanium based welding flux that includes titanium dioxide and a moisture resistant agent. The titanium oxide includes purified titanium dioxide that includes little or no impurities that can act as nucleation sites for carbide formation in a weld metal. The moisture resistant compound includes a colloidal metal oxide.... Agent: Fay Sharpe / Lincoln

20070017959 - Solder joint determination method, solder inspection method, and solder inspection device: A solder joint determination method is disclosed that is able to inspect a joint portion between an electrode and a soldered portion and determine a soldering condition of the joint portion reliably with high precision. The method includes the steps of: scanning a surface of the electrode with the light... Agent: C. Irvin Mcclelland Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070017960 - Method for joining at least two adjoining work-pieces by friction stir and/or friction stir spot welding: A method for weldbonding at least two work-pieces together includes applying an adhesive to a first surface of a first work-piece, and bringing the first surface of the first work-piece into contact with a surface of a second work-piece. The first work-piece and second work-piece are then friction stir or... Agent: Shimokaji & Associates, P.C.

20070012746 - Heating type accelerator for soldering paste: A heating type accelerator for soldering paste includes an injection part, at least a heat guiding element and at least a heating element. The injection part has a chamber inside and provides an inlet and an outlet at two lateral sides thereof to communicating with the chamber. The heat guiding... Agent: G. Link Co., Ltd.

20070012747 - Honeycomb structure and method for applying adhesive and brazing material to the structure: A method for gluing and brazing a honeycomb structure includes at least one partially structured foil with a pitch and a wave height. The method includes the steps of choosing a mean brazing material diameter of a powder brazing material, said diameter being 15% smaller than the height of the... Agent: Lerner Greenberg Stemer LLP

20070012748 - Method for manufacturing multi-component structural members: A method for fabricating multi-component structural members includes brazing a first component of air-hardenable martensitic stainless steel to a second component made of ferrous, stainless or nickel alloy steels. The martensitic stainless steel first component is preferably type 410, 420 or 440 and formed while in the annealed condition. The... Agent: Drummond & Duckworth

20070012749 - Method of bonding metal ball for magnetic head assembly: A method of bonding a metal ball for a magnetic head assembly is provided. The method comprises: preparing a capillary; disposing the capillary so as to face a bonding surface of the electrode pad of the slider and that of the electrode pad of the flexible printed circuit board; carrying... Agent: Brinks Hofer Gilson & Lione

20070012750 - Current fuse and method of making the current fuse: In order to provide a current fuse with high solderability without containing harmful materials, solder chips containing 30 to 60 percent by weight of zinc, 0.1 to 2 percent by weight of copper, 0.1 to 1 percent by weight of nickel, and the remainder percent by weight being tin, or... Agent: Smith Patent Office

20070012751 - Electrical circuit apparatus and method for assembling same: An electrical circuit apparatus (300) that includes; a substrate (330) having a top side, a ground layer (336), at least one thermal aperture (332), and at least one solder aperture (334); a heat sink (310); and an adhesive layer (320) for mechanically coupling the heat sink to the ground layer... Agent: Motorola, Inc.

20070007320 - Tool for an ultrasound welding device comprising a reinforcing element for reducing the deviation of the working surface of the tool: A sonotrode for an ultrasound welding device including at least one working surface and a front surface that extends perpendicularly to the working surface. To avoid or reduce a deviation perpendicular to the longitudinal axis of the sonotrode, the front surface has at least one reinforcing element.... Agent: Dennison, Schultz & Macdonald

20070007321 - Friction stir welding method and group of shape members for friction stir welding: The purpose of the present invention is to provide a method that can be easily applied to friction stir welding where the thickness of face plates at one welding portion is different from the thickness of face plates at another welding portion. Three shape members 10, 11, 12 having two... Agent: Antonelli, Terry, Stout & Kraus, LLP

20070007322 - Board assembly apparatus having electronic components disposed in a space between circuit boards and a manufacturing method thereof: A board assembly apparatus and a manufacturing method includes applying solder paste onto a first surface of a first board, arranging electronic components on the first surface of the first board on which the solder paste is applied, arranging a second board above the electronic components and the first surface... Agent: Stanzione & Kim, LLP

20070007323 - Standoff structures for surface mount components: Increasing standoff height for surface mount components mounted to a laminate by image screening at least one standoff structure in a footprint area on the laminate surface. The standoff structure may comprise a filled epoxy and curing agents and may be cured by thermal treatment or by exposure to actinic... Agent: International Business Machines Corporation Dept. 18g

20070000967 - Solders with intermetallic phases, solder bumps made thereof, packages containing same, and methods of assembling packages therewith: A solder composition includes a reflow-wetting element that is an intermetallic both pre-reflow and post-reflow. The intermetallic releases the reflow-wetting element upon heating. The solder composition includes the intermetallic first phase in a bulk-solder second phase. A method of assembling a microelectronic package includes the intermetallic in a solder. A... Agent: Schwegman, Lundberg, Woessner & Kluth, P.A.

20070000969 - Brazed aluminum structure and method for forming same: A brazed aluminum alloy structure is formed that includes a first component formed of an aluminum alloy sheet, a second metal sheet component formed of an aluminum alloy and a braze fillet metallurgically bonding a faying surface of the first component to a faying surface of the second component. The... Agent: Delphi Technologies, Inc.

20070000971 - Integrated circuit device and electronic instrument: An integrated circuit device includes first and second transistors NTr1 and PTr1 push-pull connected between first and second power supply lines and outputting a voltage of one of the first and second power supply lines to a connection node ND by a charge-pump operation, and a pad PD electrically connected... Agent: Oliff & Berridge, PLC

20070000970 - Method of producing wire-connection structure, and wire-connection structure: For electrically connecting a wiring formed on one surface of an insulating substrate such as an FPC to an individual electrode arranged facing the other surface of the substrate, firstly, a through hole and a notch are formed by irradiating a laser beam from above onto the FPC. Next, the... Agent: Baker Botts LLP C/o Intellectual Property Department

20070000968 - Weld structure having excellent resistance brittle crack propagation resistance and method of welding the weld structure: A welding method for manufacturing welded structures having excellent properties to prevent the propagation of brittle fracture occurring in welded joints, characterized by the step of forming a repair weld having a greater toughness than that of a butt weld and an outer edge whose angle φ with respect to... Agent: Kenyon & Kenyon LLP

20070000972 - Friction stir welding device: A friction stir welding device for welding an article by means of a welding tool, includes: a tool holding section configured to hold the welding tool and rotate round a predetermined reference axial line; rotation driving unit configured to drive the tool holding section to rotate round the reference axial... Agent: Oliff & Berridge, PLC

20070000973 - Stamped tubular member and method and apparatus for making same: A unique tubular work piece is disclosed along with a novel method and apparatus for manufacturing tubular work pieces from sheet metal stock lighter and stronger structures with less waste and less cost than prior methods.... Agent: Kane & Co., PLC

20070000974 - Printed board and ink jet head: When the driving printed wires from the drive IC are passed between the terminal lands and connected to respective terminal lands, and the printed wires of a number greater than the number of printed wires that can be passed between the terminal lands are required, the driving printed wires from... Agent: Baker Botts LLP C/o Intellectual Property Department

20070000975 - Log splitter: A self-contained, or externally actuated, hydraulic log splitter which includes a frame on which is slidably mounted an assembly of a specially designed push plate secured at one end to a reversible hydraulic cylinder and at the other to a splitting table carrying logs which is pushed against a straight... Agent: Michaud-duffy Group LLP

20070000976 - Electrically-isolated interconnects and seal rings in packages using a solder preform: Embodiments include electronic assemblies and methods for forming electronic assemblies. One embodiment includes a method of forming a MEMS device assembly, including forming an active MEMS region on a substrate. A plurality of bonding pads electrically coupled to the active MEMS region are formed. A seal ring wetting layer is... Agent: Konrad Raynes & Victor, LLP. Attn: Int77