Metal fusion bonding inventions 10/06

20060237514 - Solder dispenser: A solder dispenser provides a cylindrical dispensing container which has a solder inlet for introducing the above-mentioned solder member, and an opening portion for discharging the above-mentioned solder member to the external, and forms an internal space where the solder member can fall between the above-mentioned solder inlet and the...

20060237515 - Exothermic weld mold clamp: An exothermic weld mold clamp including a mold locating system adapted to locate pieces of an exothermic mold relative to each other; and a mold locking system. The mold locking system includes at least one mold locking pin movably mounted on the mold locating system and a spring biasing the...

20060237516 - Method of treating and probing a via: A method of treating a via connected with a substrate and a method of probing the via are disclosed. A pattern of a lead-free solder paste is applied around a hole of the via without completely covering a pad of the via. The paste is reflowed to form a pattern...

20060237517 - Apparatus and manufacturing method of combining low melting point alloys and application of low melting point alloys: An apparatus and a manufacturing method of combining low melting point alloys and an application of low melting point alloys use a low melting point alloy (solder) as a heat-conducting medium. The solder is attached on the surface of a heat sink to define a heat-dissipating device installable onto a...

20060231587 - Apparatus for performing a plurality of magnetic pulse forming or welding operations: An apparatus for performing a plurality of magnetic pulse forming or welding operations includes a power supply, a plurality of inductors, and a power distribution system for selectively connecting the power supply to each of the plurality of inductors so as to perform a plurality of magnetic pulse forming or...

20060231591 - Feed devices and methods for injection molded solder systems: A solder feeding device having a reservoir, a drive unit, a first lead, and a second lead is provided. The reservoir melts solid solder wire into molten solder, while the drive unit selectively feeds the solid solder wire into the reservoir. The first and second leads are in electrical communication...

20060231590 - Glow discharge drilling apparatus and glow discharge drilling method: A glow discharge drilling apparatus enables switching of a continuous mode for continuously supplying electric power and an intermittent mode for intermittently supplying electric power. Electric power is supplied in the intermittent mode with respect to a sample easily melted by a heat due to a glow discharge and a...

20060231588 - Hydrogen supplying apparatus and method of manufacturing hydrogen supplying apparatus: A hydrogen supplying apparatus equipped with a hydrogen separation membrane and a catalyst plate, which is made by forming a catalyst layer on a metal plate, wherein the metal material of the membrane is different in hardness from that of the catalyst plate. A method of producing the hydrogen supplying...

20060231589 - Hydroxynaphthalenedicarboxylic acid hydrazide and derivatives thereof as well as process for preparing them: h

20060231584 - Manufacturing method of trademark label: A manufacturing method of trademark label of the present invention comprises a process of making rubber sheet which produced by compounding the ingredients of natural rubber composite, a process of cutting the rubber sheet according to the design of trademark label, a process of spreading primer on adhesion side of...

20060231586 - Method of assembling two parts, at least one of which is made of a composite, and insert for carrying out the assembly: The present invention relates to a method for bonding a first part (31) made of a composite to a second part (34), to a defined dimension (A), wherein an insert (32) is fitted onto said first part (31), said insert (32) protruding beyond said dimension (A), the insert (32) is...

20060231592 - Ultrasonic tool and ultrasonic bonder: An ultrasonic tool, for bonding two materials to each other by joining a face of one of the materials to a face of the other material using the action of ultrasonic waves applied to one of the materials through another face of the one of the materials, wherein the ultrasonic...

20060231585 - Welding device and method for welding workpieces: The invention concerns an ultrasonic welding device, which is more fully integrated by adjacent components of coupling surface. In order to permit a adequately fixed connection between the components, while, at the same time simplifying the mounting, it is suggested that at least some of the integrated components (30, 34)...

20060231593 - Friction welding device: A friction-welding device for the integral joining of components, having an oscillator, which generates a periodic movement of a component and a welding surface provided thereon relative to another, static component and a welding surface provided thereon, with directions of movement parallel to the welding surfaces, having a compression device...

20060231595 - Method for friction stir welding of dissimilar materials: A process for adjoining materials by friction stir welding. Two adjacent material segments are heated by localized heating to raise the temperature of each segment along the intersection to a discrete predefined level below the melting point of the particular segment of material being heated. In conjunction with this discrete...

20060231594 - Method for friction stir welding, jig therefor, member with friction stir-welded portion, and tool for friction stir welding: A recess portion with a substantially circular cross-section is provided in the upper end surface of a supporting jig. When a probe of a device for friction stir welding is buried in the upper end surface of a layered portion, material in the vicinity of the buried portion flows plastically....

20060231596 - Process for making a welded steel tubular having a weld zone free of untempered martensite: A process for making an untempered martensite-free welded steel tubular is disclosed. The process includes rapid quenching of the steel tubular without formation of untempered martensite, at rates up to about 1600° F./second. There is no post-weld seam annealing process required. Also a welded steel tubular made in accordance with...

20060231597 - Method for joining a tube to a member using deformation resistance welding/brazing: One method for joining a tube to a member includes obtaining a tube and obtaining a member having a surface groove. The tube is relatively positioned with respect to the member to completely cover the surface groove without the tube entering the surface groove, wherein the tube is in direct...

20060226197 - Manufacturing plant for parts, particularly vehicle body parts: A manufacturing plant (1) is provided for vehicle body parts (2, 3). The manufacturing plant includes a number of processing stations (4, 5, 6, 7, 8, 9, 10), which are situated one behind the other along a transfer line (22), and of a number of multiaxial robots (18, 19). In...

20060226198 - Precision soldering tweezers with arms having adjustably positional distal ends: A pair of soldering tweezers, having: a first arm having a distal end that is adjustably positionable in a direction parallel to its central longitudinal axis; a second arm having a distal end that is adjustably positionable in a direction perpendicular to its central longitudinal axis; and a biasing mechanism...

20060226201 - Circuit board carrier/solder pallet: Provided is a plaque and its method of manufacture, the plaque including a cured thermoset phenolic resin and a reinforcing material that is molded into a controlled thickness. Also provided is a solder pallet utilizing the plaque in its manufacture. The plaque can be manufactured by forming a preform of...

20060226200 - Method for manufacturing bonded substrates and substrates for use in the bonded substrates: A method for manufacturing bonded substrates includes: forming the first terminals on the first substrate, the first terminals each having a metal core projecting from a surface of the first substrate, each metal core coated with a solder layer lower in a melting point than the metal core; forming the...

20060226199 - Selective soldering of flat flexible cable with lead-free solder to a substrate: A system and method for soldering flat flexible cable to an electronic substrate using lead-free solder is disclosed. The method comprises bending conductive end portions of the flat flexible cable and inserting the bent conductive end portions of the flat flexible cable through slots that extend through the thickness of...

20060226202 - Pcb solder masking process: A PCB solder masking process allowing easier process, reduced production cost and improved PCB quality involves dispensing low hardness resin on contacts to be exposed on the PCB, resin being solidified, non-solidified area covered with mask, UV exposed, non-solidified area removed, PCB sprayed insulation varnish, solidified, varnish and resin on...

20060226203 - Selective solder deposition by self-assembly of nano-sized solder paricles, and methods of assembling soldered packages: A nano-sized solder suspension flows by selective wetting onto a bond pad and away from a bond-pad resist area. A microelectronic package is also disclosed that uses the nano-sized solder suspension. A method of assembling a microelectronic package is also disclosed. A computing system is also disclosed that includes a...

20060219754 - Bonding wire cleaning unit and method of wire bonding using same: A wire cleaning system for cleaning wire configured to be wirebonded is provided. The wire cleaning system includes a chamber through which a wire configured to be wirebonded extends prior to the wire being wirebonded. The wire cleaning system also includes an energy source for removing contamination from the wire...

20060219755 - Conductive ball mounting method, and apparatus therefor: A conductive ball mounting apparatus and method for holding a conductive ball on the holding face, as has a suction port formed therein, of a holder head thereby to mount the held conductive ball, while interposing a flux therein, on a workpiece. After the end of the mounting action and...

20060219756 - Active binder for brazing, part for brazing employing the binder, brazed product obtained with the binder, and silver brazing material: An active binder for brazing which is for use in brazing metals to ceramics; a ceramic part for brazing to which the binder has been applied; a brazed product; and a foil-form brazing material for use in producing a brazed metal/ceramic product. The active binder contains particles of either an...

20060219757 - Method for producing cure system, adhesive system, and electronic device: A cure system including a compatiblized and passivated refectory solid dispersed within a low temperature liquid curing agent is provided. An adhesive system including the cure system is provided, and an associated method. A device including the cured adhesive system is provided....

20060219758 - Welding of gamma'-strengthened superalloys: A method of welding γ′-strengthened superalloys. The methods improve the weldability of these superalloys by creating areas having lower amounts of γ′-forming elements, resulting in stronger welds. In one method, a vacuum heat treatment is used to create γ′-depleted zones having reduced amounts of γ′-forming elements. A post weld heat...

20060219759 - Method for fabricating large dimension bonds using reactive multilayer joining: A method for joining component bodies of material over bonding regions of large dimensions by disposing a plurality of substantially contiguous sheets of reactive composite materials between the bodies and adjacent sheets of fusible material. The contiguous sheets of the reactive composite material are operatively connected by an ignitable bridging...

20060219760 - Soldering method, soldering device, bonding method, bonding device, and nozzle unit: Provided is a nozzle unit for use in a bonding device in which bonding between a first member and a second member is effected by providing a bonding member that has been melted by heating at a bonding position where the first member and the second member are to be...