Metal fusion bonding inventions 09/06

20060208029 - Wire aiming position control method and position control apparatus: To provide a wire aiming position control method and position control apparatus capable of accurately feeding a welding wire to an aiming position of a welded member regardless of a change in an amount of twisting the wire and to provide a wire aiming position control method and position control...

20060208030 - Structure to accommodate increase in volume expansion during solder reflow: Solder balls, such as, low melt C4 solder balls undergo volume expansion during reflow. Where the solder balls are encapsulated, expansion pressure can cause damage to device integrity. A volume expansion region in the semiconductor chip substrate beneath each of the solder balls accommodates volume expansion. Air-cushioned diaphgrams, deformable materials...

20060208031 - Concentric, insulated tubular conduits and method for assembly: Concentric, tubular sections are assembled by first securing annular centralizers and insulation about the external surface of the smaller diameter tube while the tube is horizontally disposed. The larger tube is then vertically aligned and lowered into a recessed area formed below the assembly area work level. A lifting cable,...

20060208032 - Manufacture of specialized alloys with specific properties: A method of manufacturing specialized alloys having specific properties and an alloy made using this method. The methods involve the use of micro and/or nano-sized particles that are mixed into an alloy using a friction stir welding method. The micro and/or nano-sized particles are used to alter one or more...

20060208033 - Apparatus and method for connecting coated wires: An apparatus and method of connecting a covered wire to a wire terminal which incorporates ultrasonic and resistance welding in sequence. The method includes (a) positioning the wire terminal against an anvil; (b) positioning the covered wire against the terminal; (c) positioning a tip of an ultrasonic welder in clamped...

20060208034 - Anvil for friction stir welding high temperature materials: A friction stir welding anvil and method of producing a friction stir welding anvil that precludes diffusion or mechanical bonding of the anvil to the work pieces are provided. The alternatives for producing such an anvil comprise coating the anvil with diffusion barriers such as oxides, nitrides, intermetallics, and/or refractory...

20060208035 - Optical component installation and train alignment process utilizing metrology and plastic deformation: A micro-optical train manufacturing process includes a step of characterizing the position of optical components on an optical bench, typically using a metrology system. These optical components are then aligned with respect to each other in a passive alignment step based on data from the metrology system and optical system...

20060208036 - Tubes with an integrated flange consisting of flexibly rolled material for structural classis and body parts: A flange tube consisting of plate metal, having a closed cross-section and comprising at least one flange which is integrally produced from the plate metal of the tube body and which extends in the longitudinal direction....

20060208039 - Method for creating an electrical contact for a piezoelectric actuator and polarizing the piezoelectric actuator: A method for creating a soldered joint to contacts of a piezoelectric actuator and polarizing the piezoceramic layers of the piezoelectric actuator has the steps of Polarization and soldering of the joint which are performed simultaneously such that the duration of the process is reduced....

20060208038 - Method and contact point for establishing an electrical connection: A method for establishing an electrical connection between a first contact surface and a second contact surface, with a wire-bonding tool being used to provide a contact wire between the contact surfaces by bonding the contact wire to the first contact surface and subsequently leading it to the second contact...

20060208037 - Method, device and system for bonding a semiconductor element: The invention relates to a method and also a device and a system for bonding a semiconductor element (4), in which various contact areas (8) of the semiconductor element (4) are successively connected to terminal areas (2, 3, 7) by means of bonding wire elements (6) and in which an...

20060208040 - Adaptable spring force clamping apparatus and methods: Adaptable spring force clamping apparatus and methods are disclosed. In one embodiment, an apparatus includes at least one elongated member adapted to be positioned proximate to a surface of a work piece. The elongated member includes first and second end portions adapted to be secured to substantially prevent movement of...

20060208041 - Forming solder balls on substrates: A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask...

20060208042 - Method for refining and homogeneously distributing alloying partners and for removing undesirable reaction products and slags in or from soft solder during the production of fine solder powder: The invention relates to a method for refining and homogeneously distributing alloying partners and for removing undesired reaction products such as oxides and/or slag in or from soft solder during the production of fine solder powder, in which the solder alloy is melted in a high temperature-resistant plant and/or animal...

20060201994 - Bonding mechanism for a heat conduction tube and heat dissipation plate: A bonding mechanism for a heat conduction tube and heat dissipation plate is disclosed. The bonding mechanism comprises an installation platform, an elevating device, and a height-adjusting device. The installation platform allows the heat dissipation plates to be placed flatly on the surface of the platform and the height adjusting...

20060201995 - Bore alignment tool: Apparatus and methods for aligning tubular members comprising a first and second expandable member coupled to a rod. A first expandable member is disclosed that moves in an axial direction toward the second expandable member. The first expandable member engages a first tubular member and the second expandable member engages...

20060201997 - Fine pad pitch organic circuit board with plating solder and method for fabricating the same: A fine pad pitch organic circuit board with plating solder and a method for fabricating the circuit board with plating solder are provided. The circuit board is formed with a plurality of densely arranged contact pads on at least a surface thereof in the absence of solder mask being applied...

20060201996 - Medical graft materials with adherent extracellular matrix fibrous mass: Described are medical grafting materials that include a base substrate material and an adherent fibrous mass of extracellular matrix components received upon the substrate material. Also described are methods of preparing and using such materials....

20060201998 - Method for producing permanent integral connections of oxide-dispersed (ods) metallic materials or components of oxide-dispersed (ods) metallic materials by welding: A method for producing permanent integral connections of oxide-dispersed metallic materials by welding. The materials or components to be connected are overlapped to form an overlapping region in a joining region of the overlapping region. The materials or components are heated below the melting temperatures of the materials and are...

20060201999 - Electronic component mounting apparatus and electronic component mounting method: In an electronic component mounting method in which electronic components are sucked/held by plural respective nozzles provided on a mounting head so as to be mounted on electronic component mounting portions of a board, such a mounting operation is sequentially carried out as to all of the electronic components, in...

20060202000 - Eccentric rotation soldering method and apparatus: An eccentric rotation soldering method and apparatus, forming a curved sealing portion at one end of a heating after the heat pipe is pressed sealed, and aligning the electrode of a soldering unit with the pressed edge of the sealing portion of the heat pipe. When the heat pipe is...

20060202001 - Enhanced heat system for bga/cga rework: A method and system for heating a circuit board component to an approximately uniform temperature sufficient to reflow the connections between the circuit board component and the circuit board. The method and system include a supplemental gas heater having a diffuser plate. The circuit board is placed against the diffuser...

20060196912 - Method and apparatus for mounting and removing an electronic component: A method and an apparatus are provided for mounting and removing electronic components using solder bumps while constraining thermal stresses to a substrate. The method and apparatus for mounting and removing an electronic component (bear chip 32) to be soldered onto the substrate with solder bumps 114 is configured to...

20060196913 - Assembly tool for positioning of a chassis component and corresponding manipulating device: The assembly tool (10) for a manipulating device (12) serves to position a body component (14) at a vehicle body (16) while forming bearing contact, the assembly tool (10) being provided with a gripping mechanism (18) and with a positioning mechanism (20), and the positioning mechanism (20) being suitable for...

20060196914 - X-ray inspection device and x-ray inspection method: A X-ray inspection device for inspecting a solder connection portion between a circuit device having a solder ball and a printed circuit board having a land includes: X-ray irradiating means for irradiating X-ray to the solder connection portion between the solder ball and the land; X-ray detecting means for detecting...

20060196915 - High-power ultrasonic horn: An ultrasonic horn for use in a chemical reactor is formed as a unitary piece of material whose length is approximately equal to the wavelength of ultrasonic waves through the material at a selected ultrasonic frequency. The horn has a conically shaped distal end and a mounting surface at its...

20060196916 - Method and device for pressure welding, which takes into account deviations in the length of workpieces: A method and a device are provided for pressure welding, in particular for the friction welding or magnetic arc welding of workpieces (2, 3). The actual length of one or both workpieces (2, 3) and a potential length deviation (DELTA 1) from a target value is measured. If a length...

20060196917 - Method and device for pressure welding, which takes into account deviations in the length of workpieces: A method for partially plating balls for application in ball grid array packages is disclosed. The balls are positioned in recesses of a clam tool made of two parts, such that a gap remains between these parts. A first polymer layer is formed in this gap and one part of...

20060196918 - Process for recovery heavy machines or machine components: The integrated recovery process uses an electrode or added metal chosen and prepared after an accurate analysis of the base metal including not only the composition of the base metal but the physical condition of the machine or component and the process through which the base metal has been obtained....

20060196919 - Welding flux: A welding flux formulated for pipe welding or one-side welding applications including a gas releasing agent, a high melting compound and a low melting compound. The welding flux is particularly formulated for limited pass welding applications which exhibit high impact strength, good slag detachability, low weld metal hydrogen and nitrogen...

20060196912 - Method and apparatus for mounting and removing an electronic component: A method and an apparatus are provided for mounting and removing electronic components using solder bumps while constraining thermal stresses to a substrate. The method and apparatus for mounting and removing an electronic component (bear chip 32) to be soldered onto the substrate with solder bumps 114 is configured to...

20060196913 - Assembly tool for positioning of a chassis component and corresponding manipulating device: The assembly tool (10) for a manipulating device (12) serves to position a body component (14) at a vehicle body (16) while forming bearing contact, the assembly tool (10) being provided with a gripping mechanism (18) and with a positioning mechanism (20), and the positioning mechanism (20) being suitable for...

20060196914 - X-ray inspection device and x-ray inspection method: A X-ray inspection device for inspecting a solder connection portion between a circuit device having a solder ball and a printed circuit board having a land includes: X-ray irradiating means for irradiating X-ray to the solder connection portion between the solder ball and the land; X-ray detecting means for detecting...

20060196915 - High-power ultrasonic horn: An ultrasonic horn for use in a chemical reactor is formed as a unitary piece of material whose length is approximately equal to the wavelength of ultrasonic waves through the material at a selected ultrasonic frequency. The horn has a conically shaped distal end and a mounting surface at its...

20060196916 - Method and device for pressure welding, which takes into account deviations in the length of workpieces: A method and a device are provided for pressure welding, in particular for the friction welding or magnetic arc welding of workpieces (2, 3). The actual length of one or both workpieces (2, 3) and a potential length deviation (DELTA 1) from a target value is measured. If a length...

20060196917 - Method and device for pressure welding, which takes into account deviations in the length of workpieces: A method for partially plating balls for application in ball grid array packages is disclosed. The balls are positioned in recesses of a clam tool made of two parts, such that a gap remains between these parts. A first polymer layer is formed in this gap and one part of...

20060196918 - Process for recovery heavy machines or machine components: The integrated recovery process uses an electrode or added metal chosen and prepared after an accurate analysis of the base metal including not only the composition of the base metal but the physical condition of the machine or component and the process through which the base metal has been obtained....

20060196919 - Welding flux: A welding flux formulated for pipe welding or one-side welding applications including a gas releasing agent, a high melting compound and a low melting compound. The welding flux is particularly formulated for limited pass welding applications which exhibit high impact strength, good slag detachability, low weld metal hydrogen and nitrogen...