Metal fusion bonding inventions 08/06

20060191976 - Flow soldering apparatus: A compact soldering apparatus capable of increasing reliability of products by reducing occurrence of dross and using lead-free solder, wherein a primary jet nozzle 1, a secondary jet nozzle 2, and a pump (not shown) forming jet waves 24, 25 are installed in a solder tank 6 reservoiring molten solder...

20060191977 - Desoldering sheath: The present invention provides a desoldering sheath and a method for making the same. The desoldering sheath is comprised of multiple metal ropes that are each made from two or more fine-gauge wire threads. The metal ropes are woven together to form a metal fabric that approximates the shape of...

20060191979 - Device for tightly fastening at least two members: e

20060191980 - Friction stir welding method and structure body: This invention provides a configuration of a joint that allows a satisfactory welded joint to be formed with reduced deformation of the joint region when two-face structures (panels) are friction-welded end to end. The panels 31, 32 each have two substantially parallel plates 33, 34 and a third member 35...

20060191981 - Friction stir welding method and structure body: This invention provides a configuration of a joint that allows a satisfactory welded joint to be formed with reduced deformation of the joint region when two-face structures (panels) are friction-welded end to end. The panels 31, 32 each have two substantially parallel plates 33, 34 and a third member 35...

20060191978 - Method of forming and blank therefor: A method of forming and a blank therefor, in which the blank comprises a parent body and an insert, at least one of which is made of a material which possesses superplastic properties. The insert is joined to the parent body by friction stir welding. The primary purpose of the...

20060191982 - Process for producing a metallic honeycomb body with a layer length difference: A method for producing a metallic honeycomb body includes providing a plurality of smooth sheet-metal foils and at least partly structured sheet-metal foils and placing the foils in a housing. The smooth sheet-metal foils have a first length while the structured sheet-metal foils have a second length. A difference between...

20060186172 - Lead free desoldering braid: A braid for desoldering a printed circuit board or electrical component having a lead-free solder formed from a plurality of solid metal strands bundled together to form a bundle in which a plurality of bundles are braided with one another to form a braid. The braid is formed having a...

20060186173 - Self-contained vacuum module for stencil wiper assembly: A vacuum plenum module of a stencil wiper assembly for wiping and removing excess material from a stencil of a stencil printer includes a wiper blade to wipe the stencil, a plenum chamber in fluid communication with the wiper blade, and a vacuum generator attached to and in fluid communication...

20060186174 - Droplet jet head and droplet jet apparatus: A droplet jet head includes a nozzle substrate having a plurality of nozzle holes; a cavity substrate having recesses whose bottoms serve as diaphragms, and the recesses serving as ejection chambers; an electrode substrate having separate electrodes opposed to the diaphragms; a reservoir substrate having a recess serving as a...

20060186175 - Metal containers for solder paste: A container for soldering adjuvant is made of a metal having a composition similar to the composition of a solder bath. Preferably, the container holds solder paste and the container is made of metal having a composition similar to the composition of the metal part of the paste in the...

20060186176 - Process for producing aluminum-containing honeycomb bodies using radiant heaters: A method for producing aluminum-containing honeycomb bodies includes providing at least partly structured aluminum-based metal foils. The at least partly structured metal foils are stacked and/or wound to form a honeycomb structure having passages. The metal foils are heated from an open end face of the passages with at least...

20060186177 - Wire bonding method: A wire bonding method for bonding a ball 11 which is formed at a tip end of a bonding wire to a pad 2 that is a first bond point to form a first bonding part 12 and bonding the wire 10 to an interconnect wiring 4 that is a...

20060186178 - Method for the production of a strip comprising a staggered profile that runs in the longitudinal direction thereof: w

20060186180 - Accurate relative alignment and epoxy-free attachment of optical elements: A method for accurately positioning and aligning multiple components, such as optical components, on a common substrate. A separate pattern of solder bumps is formed on the substrate for each of the components to be mounted. Congruent patterns of solder pads are formed on the respective components. The components are...

20060186181 - Ball mounting method: A ball mounting apparatus for mounting a plurality of balls sucked up to the head on a workpiece. The apparatus includes a positioning mechanism for the workpiece, a ball supply device for supplying the balls, the head for sucking up the balls, an energized force generating device for energizing the...

20060186179 - Apparatus and method for bonding wires: A wire bonder and a method of bonding a bonding wire to a bonding pad of a bonding location using the wire bonder are provided. The method includes forming a bonding ball at an end of the bonding wire, pre-deforming at least a portion of the bonding ball and bonding...

20060186182 - Cream solder printing metal mask with positioning function and its positioning method: Rectangular positioning lands are formed on a circuit board, and rectangular positioning openings are formed in a metal mask. In addition, the positioning lands and positioning openings are formed such that their long side length becomes identical, and short side of the positioning opening becomes narrower than that of the...

20060186183 - Wave solder nozzle: A wave solder nozzle is capable of delivering solder material to perform a wave soldering operation on a printed circuit board in an inert atmosphere. The wave solder nozzle includes a front plate and a back plate coupled to the front plate. The front plate and the back plate define...

20060180635 - Bonding tool and method: An improved bonding tool for bonding a ribbon characterized by a thickness to a bonding pad and the method for using the same is disclosed. The bonding tool includes a transducer and a bond foot having a plurality of protrusions extending therefrom for pressing the ribbon against the bonding pad,...

20060180636 - Two-piece tube: A tube for receiving roller bodies has two tube halves that are joined together in form-locking fashion so as to provide a form lock, and the form lock is configured so that it is undoable only whenever there are no roller bodies located in the tube....

20060180637 - Burning-on alloy for the production of ceramically veneered dental restorations: t

20060180638 - Method for bonding metallic plates and jig for the bonding of the metallic plates: A method for bonding metallic plates includes: sandwiching a laminated body, which includes a plurality of metallic plates and is formed with an inner cavity opening on a surface thereof, between a pair of jigs each having a flat abutment surface abutting against respective surfaces of the laminated body, wherein...

20060180639 - Method and arrangement for thermally relieved packages with different substrates: A method (80) of reducing stress between substrates of differing materials includes the steps of applying (82) solder (16) on a first substrate (14), reflowing (84) the solder on the first substrate to form a cladded substrate (30), applying (85) a medium such as flux or solder on a second...

20060180640 - Utilization of metallic porous materials: This invention relates to a method of brazing while the thickness of the opening between materials being brazed can not be maintained constant or can not be adjusted in the appropriate range. In order to solve this issue the porous material of metals or metal alloys consisting of Ni, Cu,...

20060175376 - Apparatus and method for welding a pour spout fitment to a container: Apparatus for use in welding a pour spout fitment (22) to a container (32) comprises an ultrasonic welding horn (18) formed with a recess (20) at one end for receiving part of the fitment (22), an anvil (2) between an annular surface portion of which and that one end of...

20060175377 - Capillary holder: A capillary holder for mounting a capillary onto a horn is provided that comprises a mounting hole formed in the horn that has a first width along a first axis that is smaller than a width of the capillary and a second width along a second axis perpendicular to the...

20060175379 - Device for cooling welding caps: A device for cooling welding caps of a welding apparatus includes a cooling line (10). A cooling agent is kept under pressure during removal of the welding caps. An expansion device (16) including an expansion chamber (34) is connected to the cooling line (10)....

20060175380 - Self-assembly method, opal, photonic band gap, and light source: A suspension of particles is rapidly self-assembled with a minimal number of defects into a three-dimensional array of particles onto a substrate under simultaneous sedimentating and annealing forces. This array of particles may be ordered as an opal structure. Optionally, the synthesized structure may incorporate an electrolyte into the suspension...

20060175381 - Friction stir nut and method of joining therewith: A friction stir nut is disclosed. The friction stir nut includes a body, a cap, and an anti-rotation feature. The body has an elongated cylindrical shank extending between a first end and a second end, the cap being disposed at the second end, and the anti-rotation feature being disposed at...

20060175382 - Tool geometries for friction stir spot welding of high melting temperature alloys: A tool for friction stir spot welding of high melting temperature materials, wherein the tool geometry includes a short pin and broad shoulder to enhance mixing of high temperature materials, and wherein the tool includes a superabrasive coating to thereby enable FSSW of high melting temperature materials....

20060175383 - Wire bonding method: A wire bonding method with the process of performing a first bonding to a pad of a die that is a first bond point, and the process of performing a second bonding to an interconnect wiring (or a lead) that is a second bond point, thus connecting the pad and...

20060169739 - Transducer assembly, capillary and wire bonding method using the same: A transducer assembly and wire bonding method has a vibration unit for generating an ultrasonic wave. A body section is coupled to the vibration unit for transferring the ultrasonic wave. A tapered horn is coupled to the body section for transferring and concentrating the ultrasonic wave. A capillary is coupled...

20060169741 - Self-clamping device for friction stir spot welding: A friction stir spot welding device includes a tool head configured for traveling in a first direction towards a workpiece and in a second direction away from the workpiece. A weld tool is rotatably coupled relative to the tool head and includes a free end. The weld tool travels in...

20060169740 - Welding tool for friction-stir welding apparatus: The invention is a welding tool used in a friction-stir welding apparatus for welding a plurality of members to be welded. The welding tool includes: a tool holder having a front end and a base end, the base end being held by the friction-stir welding apparatus so as to be...

20060169742 - Wire ultrasonic bonding method and wire ultrasonic bonding apparatus: A conductive portion of a wire, composed of a plurality of core wires, is inserted and fitted into a groove in a pressing die, thereby restricting the conductive portion to a bonding width of a terminal, and in this condition with the use of a press forming machine, the conductive...

20060169743 - Apparatus and method for filling a ball grid array template: An apparatus and method for filling a ball grid array template is disclosed. The apparatus comprises a normally horizontal base plate with the ball grid array template being mounted onto the base plate at one end. A solder ball supply bin is slidably mounted over the surface of the base...

20060169744 - Soldering tip with wear-and corrosion resistant coating: A soldering tip for soldering irons having a mounting portion adapted to fit in a heater unit of a soldering iron or tip-heater cartridge and a soldering portion shaped for forming of a solder joint. At least the soldering portion is formed of a copper inner base material which is...

20060169745 - Multi-function digital pressure measuring device: A multi-function digital pressure measuring device and welding torch having an outlet nozzle with first and second gas inlets with valves. The pressure measuring device having a body with a first gas chamber and a first inlet and a first outlet where the first inlet is connectable to a first...

20060169746 - Resonator, ultrasonic die bonding head, and ultrasonic die bonding apparatus: A resonator 1 of the present invention includes: a vibrating member 13 holding an electronic component 12 and applying a vibration to the electronic component 12; and a depressing member 15 applying a depressing force for a side of a substrate 11 to the electronic component 12 through the vibrating...

20060169748 - Friction stir welding method: The invention provides a friction stir welding method with less weld defects upon welding a butted portion between a first member and a second member. A first member 10 is butted against a second member 20, and then a round-bar buildup member 30 is pressed against the upper surface of...

20060169747 - Friction stir welding tool: A friction stir welding tool is described and which includes a shank portion; a shoulder portion which is releasably engageable with the shank portion; and a pin which is releasably engageable with the shoulder portion....

20060169749 - Method for manufacturing filter canisters and tracking quality assurance: An assembly line for manufacturing filter canisters is disclosed. The method for assembling filter canisters provides a unique serial number for each canister and a database that associates the component lot numbers, activated charcoal weight, and quality assurance test results with the serial number for the filter canister. The manufacturing...

20060169750 - Soldering method and apparatus: There are provided a solder ball deforming step of mechanically deforming a ball to break an oxide film of a surface thereof and to expose a nonoxide surface and a solder melting step of heating and melting the deformed solder ball through energy irradiation in a state where the deformed...

20060169751 - Method for depositing an adhesion-promoting layer on a metallic layer of a chip: A method for depositing an adhesion-promoting layer on a spatially bounded metallic layer of a silicon chip is provided. The adhesion-promoting layer is deposited, using at least one wet-chemical process. During the wet-chemical process, the concentration of an inhibitor of a multi-component process bath is checked in at least approximately...

20060169752 - Forge welding of heavy duty tubulars: A method of joining heavy duty oilfield, well, or other tubulars includes the step of joining the tubulars by forge welding and flushing a reducing flushing gas around the heated tubular ends during at least part of the forge welding operation such that oxides are removed from the forge welded...