Metal fusion bonding inventions 07/06

20060163315 - Ribbon bonding tool and process: An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underlying bonding surface....

20060163316 - Friction stir welding apparatus: A friction stir welding apparatus has a novel tool-in-tool construction where a friction stir welding pin tool extends through a center bore of a friction stir welding shoulder tool and is moveable axially and rotationally relative to the shoulder tool. The pin tool and shoulder tool both have their own...

20060163317 - Device for cutting or welding tubular workpieces or the like: The invention relates to a device (1) for cutting or welding tubes (3) or similar workpieces, said device comprising a guiding mechanism which is used to control the cutting or welding torch (17) along a pre-determined line and is provided with a stand-type portal (7). Said portal comprises a through...

20060163318 - Continuous mode solder jet apparatus and method: A solder jet apparatus and method is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anywhere on the surface...

20060163322 - Brazing filter metal sheet and method for production thereof: In order to provide a brazing sheet having excellent workability, a powder of a brazing filler metal composition is obtained from a single type of powder or by mixing two or more powders to form the brazing filler metal composition. By powder roll compaction of the powder, the powder is...

20060163321 - Liquid phase diffusion welding method for metallic machine part and metallic machine part: A liquid phase diffusion bonding method for a metal machine part superior in the quality of the joint and the productivity enabling the bonding time to be shortened, achieving homogenization of the bonding structure and improving the tensile strength, fatigue strength, and joint quality and reliability. This liquid phase diffusion...

20060163326 - Method and device for friction agitation welding: A weld across a joint is formed between superposed plate workpieces comprising a first plate workpiece made up of one or more plates and a second plate workpiece made up of a single plate having a joint bore formed therein by grasping the superposed plate workpieces between a rotating friction...

20060163324 - Method and system for spraying metallic powder on a component surface: A method for applying a braze material to a component surface comprises the steps of first directing a liquid spray including a binder toward the component surface, and then injecting a powder including a metallic braze material into the spray, and thereby coating the component surface with a substantially homogenous...

20060163320 - Method for fixing a miniaturized component to a carrier plate: The invention relates to a method, a device and a system for fixing a miniaturized component—especially carrying or containing at least one optical element—to a carrier plate in a highly-precise manner, by means of a soldered joint, a welded joint or an adhesive joint. Said component is positioned above the...

20060163319 - Method for manufacture of truss core sandwich structures and related structures thereof: An embodiment provides a method of constructing a cellular structure having nodes therein comprising: providing at least one truss layer comprised of at least one truss unit, at least one of the truss units being comprised of truss members; providing at least one panel in mechanical communication with the at...

20060163323 - Repair and reclassification of superalloy components: Novel materials and methods for repairing/reclassifying superalloy components are described herein. These materials are non-traditional blends of materials having a much higher base material content than traditional repair/reclassification materials. In embodiments used to repair/reclassify nickel-based components, these materials may comprise about 5-18.9 weight percent of a low melting point alloy...

20060163325 - Wire bonding apparatus and process: A wire bonding machine includes (1) a support structure for supporting a work piece and (2) a pre-heat structure for supporting the work piece during a pre-heat operation. The pre-heat structure is moveable with respect to the support structure....

20060163328 - Apparatus and method for friction stir welding using a consumable pin tool: The present invention provides a friction stir welding apparatus operable for welding one or more metals, metal alloys, or other materials. The friction stir welding apparatus includes a pin tool holder, a shoulder having a surface coupled to the pin tool holder, and a pin tool coupled to the pin...

20060163327 - Method of manufacturing cylindrical body, friction stir welding method, and friction stir welding device: A method of manufacturing a cylindrical body, comprising the step of forming the cylindrical body by bending a plate-like work having first projected finger to fourth projected finger at four corned parts and allowing the end faces thereof to abut on each other, wherein the main surface of the cylindrical...

20060163329 - Multilayered metal laminate and process for producing the same: An adhesive-free multilayered metal laminate having a given thickness which is obtained by bonding a metal sheet having a thin metal film on a surface thereof to a metal foil without using an adhesive; and a process for continuously producing the laminate. The process comprises the steps of; setting a...

20060163330 - Site flattening tool and method for circuit board repair: Disclosed are a tool and a procedure for flattening a site on a printed circuit board. The tool comprises three sections: a nozzle, a throat and a flattening block. The nozzle connects the tool to a hot air source and receives hot air from said source, and the throat is...

20060163331 - Method and apparatus for forming a low profile wire loop: A method of bonding a wire between a first bonding location and a second bonding location is provided. The method includes bonding a first end of a wire to a first bonding location using a wire bonding tool to form a first wire bond. The method also includes forming a...

20060163332 - Method of suppressing extension of fatigue crack, method if detecting fatique crack and paste used for the methods: A method of detecting fatigue crack by which the fatigue crack can be easily detected by visual observation even in a relatively early stage, and a method of restraining propagation thereof. The detection method includes the steps of: (a) preparing a paste in which particles having hardness not less than...

20060157531 - Single body friction stir welding tool for high melting temperature materials: A single body friction stir welding tool, wherein the single body is pressed/sintered as a single body tool in a single pressing operation, and wherein different tool design characteristics can be introduced into the single body tool....

20060157532 - Apparatus of clamping semiconductor devices using sliding finger supports: An apparatus for supporting lead fingers during a wire bonding process and method of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers...

20060157533 - Processing system: A processing system including a carry-in stage including a carry-in device; an operation stage wherein the workpieces are measured and processed, the operation stage including a measurement device and a processing device in this order from a carry-in stage side thereof, the measurement device being separated from the processing device;...

20060157534 - Components with solder masks: In a surface mounting operation for connecting a semiconductor chip and connection component, at least one of the chip or the component has a plurality of elongated pads having a length being greater than the width. The elongated pads are preferably parallel to each other on the chip or component....

20060157535 - Orbital tube welding purge adaptor: A purge gas introduction system for an orbital tube welding setup is provided, configured to inject high purity inert purge gas to the interior volume of a tube or tubular component. An o-ring is interposed between an annular base and an annular ring, their junction forming an annular o-ring groove,...

20060157536 - Work piece holder: The invention relates to a fixture that reduces the heat transfer between a thermally conductive work piece, such as a copper tube, and the fixture. In one embodiment, the fixture includes a pair of collet members, with each collet member having at least one work piece engaging protrusion, and a...

20060157537 - Camera-assisted adjustment of bonding head elements: The invention relates to a method which is used to carry out adjusting operations on a bond head, wherein a bond head element is positioned in relation to a reference element, especially an ultrasonic tool. According to the invention, at least the surrounding area of the reference element, especially the...

20060157538 - Orbital friction welding method and device for carrying out said method: The invention relates to an orbital friction welding method and a friction welding device for welding workpieces by means of friction welding units, wherein the workpieces are pressed against each other in the contact plane during the application of the oscillation energy. To this effect, n>1 friction welding heads are...

20060157539 - Hot reduced coil tubing: Continuous coil tubing made from shorter lengths of flat metal strip which are spliced end-to-end and formed into tubular form and seam welded and thereafter introduced into a forging or hot reduction process. Finished coil tubing is withdrawn from the process at a different rate than flat metal strip is...

20060157540 - Solder ball loading method and solder ball loading unit background of the invention: Provides a solder ball loading unit capable of loading fine solder balls on electrodes. Solder balls 78s are gathered by sucking air from a loading cylinder 24 located above a ball arranging mask 16. The gathered solder balls 78s are rolled on the ball arranging mask 16 by moving the...

20060157541 - Filter, liquid discharge head utilizing the same, and producing method therefor: A filter is formed by a sintered non-woven, metal fiber cloth adapted to be installed in a liquid passage, and, in the filter, a substance sticking to the surface of metal fibers which is present in the outermost part of the filter and in the vicinity thereof is removed together...

20060157542 - Method for machining a workpiece made from a titanium-based alloy: A method for machining a workpiece made from titanium based alloy is provided. the method comprises: heating the workpiece in a hydrogen containing atmosphere, whereby hydrogen is taken up; cooling the workpiece; metal-removing machining of the workpiece; and heating the workpiece in a hydrogen-free atmosphere, whereby hydrogen is released. A...

20060157543 - Fine grain titanium-alloy article and articles with clad porous titanium surfaces: Disclosed herein are alpha-beta titanium alloys processed above the beta transus temperature yet that maintain a fine grain structure. Disclosed herein are articles comprising a titanium alloy body and a porous titanium material attached to the body, wherein the titanium alloy body has a grain size of less than or...

20060151570 - Ultrasonic bonding device, information recording medium manufacturing apparatus, ultrasonic bonding method, object, and cartridge case: An ultrasonic vibrator 3, a horn 4 whose contact surface that contacts a front end portion of an attachment boss 22a of a recording medium case (an upper case 11a and a lower case 11b) is subjected to a matte finishing process and transmits ultrasound generated by the ultrasonic vibrator...

20060151571 - Wire clamping plate: A wire clamping plate is provided for a wire clamp that is adapted to contact a length of metallic wire when the wire clamp is applying a clamping force on the wire. The wire clamping plate comprises doped silicon carbide, which makes it electrically conductive and exhibit a high level...

20060151572 - Welding method, welding system and welding jig: A plurality of attachments having springs hold the outer plate of a fuel tank, and an inner jig positions the inner plate. The attachments are attached to clamp arms which are opened/closed by cylinders. When the overlap portion between the outer and inner plates is welded, the thermal deformation caused...

20060151574 - Formulations useful against hepatitis c virus infections: The present invention relates generally to chemical compounds and substances which are effective against Hepatitis C virus (HCV) infections. Moreover, the present invention relates to compositions comprising said compounds and/or substances, to methods for preventing HCV infections as well use of the compounds and/or substances for the preparation of compositions...

20060151573 - Method for producing a cooled ring carrier: The invention relates to a method for producing a cooled ring carrier (1) for an aluminium piston pertaining to an internal combustion engine and produced according to a casting method, comprising a cooling channel (6) which is embodied on the rear (3) fo the ring carrier as a downwardly open...

20060151575 - Method of producing shaped bodies, particularly cores, molds and feeders for use in foundry practice: The present invention relates to a process for producing shaped bodies, in particular cores, molds and feeders in foundry technology, which comprises the following steps: a. Preparation of a composition comprising i. at least one phenolic resin in solid form, ii. at least one polyisocyanate, and iii. at least one...

20060151576 - Manufacturing method of butt joint, butt joint, manufacturing method of bent member, and friction stir joining method: Two joining members different in high temperature deformation resistance are disposed in an abutted manner. The rotational direction of a probe of a joining member is set to coincide with a rotational direction rotating from the joining member having lower high temperature deformation resistance toward the joining member having higher...

20060151577 - Method and device for joining a planar component to a hollow section: In a method and a device for joining a plane component to a hollow section, the component and the hollow section are inserted in an internal high pressure forming tool so as to be positioned in relation to each other and are connected through the subsequent aid of a fluidic...

20060151578 - Method for making a light weight high performance target: An x-ray anode for use in an x-ray tube is provided. The x-ray anode includes a substrate material, a target material, and one or more graded coefficient of thermal expansion material layers. The target material is coupled to the one or more graded coefficient of thermal expansion material layers and...

20060151579 - Wire loop, semiconductor device having same and wire bonding method: A wire loop comprises a wire connecting a first bonding point and a second bonding point therethrough, wherein the wire includes a ball bonded to the first bonding point, a neck portion adjacent to the ball and a major portion extending from the neck portion to the second bonding point....

20060151580 - Coating compositions for solder spheres, powders and preforms, methods of production and uses thereof: A solder material has been produced and is described herein that comprises a conventional solder component, such as a solder sphere, solder ball, solder powder, solder preform, some other suitable material or form of solder or a combination thereof and a coating composition. Solder parts and/or solder materials described herein...

20060151581 - Reliability enhancement process: A method of packaging a semiconductor component with a printed wiring board is disclosed. The method includes determining a first distance, applying a thin film onto a surface of the semiconductor component such that the thin film is spaced apart from a support of the semiconductor, applying a solder pad...

20060151582 - Joining of advanced materials by superplastic deformation: A method for utilizing superplastic deformation with or without a novel joint compound that leads to the joining of advanced ceramic materials, intermetallics, and cermets. A joint formed by this approach is as strong as or stronger than the materials joined. The method does not require elaborate surface preparation or...

20060144899 - Jam detection apparatus and method for indexing of substrates and lead frames: A system for detecting jamming of at least one workpiece for use with a wire bonder comprises a sensor positioned adjacent a path of travel of the at least one workpiece, the sensor receiving motion information related to the at least one workpiece; and a controller in communication with the...

20060144900 - Roller seam welded body for exhaust gas treatment and process for producing the body: A process for producing a body for exhaust gas treatment having a plurality of metallic layers, includes bringing the layers into contact with each other in a connection region. A connection is made by a roller seam welding process in such a way that the layers form passages through which...

20060144902 - Amplitude adjustment of an ultrasonic horn: A system and method for maintaining a substantially constant gap between a horn and an anvil includes the act of positioning a horn proximal an anvil, so that a gap is established between the horn and the anvil. An alternating current (AC) signal is applied to a converter coupled to...

20060144904 - Method of adjusting the position of an ultrasonic welding horn: An ultrasonic rotary welding apparatus and methods of using the same are disclosed. The ultrasonic welding device includes an ultrasonic horn and an anvil. The ultrasonic horn is constrained by a mounting system. The mounting system permits the horn to exhibit two degrees of freedom. The first degree of freedom...

20060144903 - Method of manufacturing a combined driveshaft tube and yoke assembly: An method for manufacturing an assembly of first and second components, such as an end fitting and a driveshaft tube for use in a vehicular drive train system. Initially, a yoke is provided including a body having a recess provided therein and a pair of yoke arms. The recess defines...

20060144901 - Ribbon-wound bobbin: A ribbon bobbin is disclosed. The ribbon bobbin has a first planar flange, a second planar flange, and a cylindrical post disposed therebetween. The cylindrical post has a first end connected to a center of the first planar flange and a second end connected to a center of the second...

20060144905 - Gap adjustment for an ultrasonic welding system: A system and method for adjusting the gap between a horn and an anvil in an ultrasonic welding system includes the act of positioning a horn proximal to an anvil, so that a gap is established between the horn and the anvil. A force is applied to the horn, so...

20060144906 - Ultrasonic welder with high-q tool: An ultrasonic welding apparatus and method uses a high-Q tool to increase the Q of a weld stack. In an aspect, the high Q-tool is a booster. In an aspect, the high-Q booster is a full wave booster. In an aspect, the high-Q booster is a radially resonant booster. In...

20060144907 - Wire bonds having pressure-absorbing balls: A semiconductor device with a chip having at least one metallic bond pad (101) over weak insulating material (102). In contact with this bond pad is a flattened metal ball (104) made of at least 99.999 % pure metal such as gold, copper, or silver. The diameter (104a) of the...