Metal fusion bonding inventions 05/06

20060108396 - Bonded components and component bonding: A method for bonding first and second components to one another comprises: forming a plurality of bonding area projections on a bonding area of a first component; depositing bonding metal on the bonding area of the first component or a corresponding bonding area of a second component; positioning the first...

20060108395 - Integral channels in metal components and fabrication thereof: An internal channel in a metal body for use in applications where internal fluid flow within a metal body is desired, as in a heat exchanger. The internal channel is formed in the metal body by frictionally stirring with a pin plunged into the metal body, and traversing the metal...

20060108394 - Method for joining aluminum power alloy: Sintered pieces of rapid-solidified aluminum alloy powder are friction stir welded together. The sintered piece may be composite material dispersing ceramic particle therein. A welding aid, which disperses the same ceramic particle as those in the sintered pieces, may be sandwiched between or mounted on the sintered pieces. A weld...

20060108397 - Microchannel apparatus, methods of making microchannel apparatus, and processes of conducting unit operations: Novel methods of making laminated, microchannel devices are described. Examples include: assembly from thin strips rather than sheets; and hot isostatic pressing (HIPing) to form devices with a hermetically sealed wall. Laminated microchannel articles having novel features are also described. The invention includes processes conducted using any of the articles...

20060108398 - Mounting method for surface-mount components on a printed circuit board: A method for surface mount solder of a comparatively large component is provided wherein a first intermediate component is soldered to a printed wring board and a larger second component is positioned and soldered to the printed wiring board using the intermediate component. An electrical contact made this way is...

20060108399 - Method of manufacturing semiconductor apparatus and method of forming viscous liquid layer: A method of manufacturing a semiconductor apparatus including a process of applying viscous liquid. The method applies viscous liquid onto a principal surface of a substrate, coats the viscous liquid closely with flexible coating material having a higher bonding strength with molecules of the viscous liquid than an intermolecular bonding...

20060108400 - Soldering method and apparatus: It is to provide a soldering method and apparatus, which can achieve highly reliable soldering while suppressing damages to a component to be soldered. There is provided a method for soldering an electronic component to a substrate, which comprises a first heating step for heating the entire solder junction area,...

20060108401 - Braze end isolation layer for generator armature winding bar and method for applying the isolation layer: A brazed joint between an armature winding bar strand package and a hydraulic header clip end fitting including: a plurality of solid strands and a plurality of hollow strands arranged in a tiered array and forming the strand package, the plurality of hollow strands having free ends that extend axially...

20060108402 - Solder ball formation and transfer method: A method of forming and applying a solder mass comprised of depositing solder paste containing a carrier and a solder onto a first substrate, not wettable by said solder; reflowing the solder paste on the first substrate to cause the solder to coalesce into a solder mass; and transferring the...

20060102689 - Method and apparatus for locally clamping components that are to be joined by friction stir welding: The apparatus (50) includes a friction stir welding tool (100), a local clamping means (200), and an interface (300) that joins the tool (100) and the local clamping means (200). The local clamping means (200) is in close proximity to the at least one sidewall (130) of the tool (100)...

20060102690 - Lead-free solder and soldered article: The present invention provides a Sn—Zn based lead-free solder which can prevent peeling of solder from soldered portions even after the passage of long periods after soldering of portions to be soldered made of Cu. A Sn—Zn based lead-free solder according to the present invention comprises 5-10 mass percent of...

20060102697 - Actuator control system: An actuator control system comprises an electric actuator, a driver, and a controller. The electric actuator is provided with a buffering mechanism which absorbs impact applied to a piston rod. The buffering mechanism includes piston dampers which absorb impact applied to a piston, a first end damper which is provided...

20060102693 - Engine welder with full access: A cabinet for an engine welder comprising an output power module driven by a DC input signal from a rectifier having an AC input signal created by an alternator rotated by an internal combustion engine. The cabinet has a front panel with a pivotally mounted door with an open and...

20060102696 - Layered products for fluxless brazing of substrates: A brazing product for fluxless brazing comprises a substrate and a filler metal-forming composition applied to the substrate. The substrate preferably comprises aluminum, an aluminum alloy or another metal and may include at least one layer of a ceramic, carbide or nitride. The filler metal-forming composition comprises a liquid-forming layer...

20060102695 - Polarity switching short circuiting arc welding method: A method of performing polarity switching short circuiting arc welding is provided. In the arc welding, a welding wire is fed at a constant feeding rate, a short circuiting state and a arcing state appear repeatedly between the welding wire and a base metal, and the output polarity of a...

20060102692 - Process for producing ptc element/metal lead element connecting structure and ptc element for use in the process: The present invention provides a novel method for electrical connection between a polymer PTC device and a metal lead element to thereby prevent the problems of the connection by caulking or soldering. For this purpose, the present invention provides a process for producing a connection structure by laser welding, said...

20060102694 - Semiconductor system with fine pitch lead fingers: A semiconductor package system includes providing a die having a plurality of contact pads. A leadframe is formed having a plurality of lead fingers with the plurality of lead fingers having a fine pitch and each having a substantially trapezoidal cross-section. A plurality of bumps is formed on the plurality...

20060102698 - Voltage regulated gmaw welding using a constant current power source and wire feeder having variable gain: A system and method of duplicating CV mode of operation with a CC power includes a wire feeder designed to automatically adjust the speed of which consumable wire is delivered to a weld so as to maintain a target voltage set by a user. The wire feeder is designed to...

20060102691 - Water-base aluminum-brazing composition and process of brazing: An aqueous aluminum brazing composition containing an organic binder and zinc-based flux which prevents precipitation of the zinc-based flux having a large specific gravity while securing excellent brazeability. The thixotropic index of the brazing composition is adjusted to 1.01-1.20 by adding (meth)acrylic acid/(meth)acrylate copolymer emulsion to the brazing composition as...

20060102699 - Counter-rotating spindle for friction stir welding: A counter-rotating spindle includes a shoulder tool, a pin tool inserted in the shoulder tool, a first motor that is connected with the pin tool and rotates the pin tool, and a second motor that is connected with the shoulder tool and rotates the shoulder tool. The direction and the...

20060102700 - Printed circuit board having improved solder pad layout: A printed circuit board (100) includes a plurality of through-holes (26) defined therein, and a plurality of solder pads (20) defined to surround the through holes (26) respectively. Each of the solder pads (20) includes a first soldering zone (22) for accommodating solder used in a soldering process and a...

20060102701 - Bump formation method and bump forming apparatus for semiconductor wafer: A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head, a recognition device, and a control device. ICs formed...

20060102702 - Powder coating for generator stator bar end fitting and method for applying the power coating: A method of sealing a generator stator bar and a stator bar end fitting receiving the end including the steps of: brazing the fitting to the end of the stator bar with a braze material; applying a powder coating material to the end of the stator bar in the fitting;...

20060102703 - Circuit board soldering method utilizing thermal mass compensating pallets: A pallet for supporting a circuit board during a soldering process. The pallet has a thermal mass that is varied to offset a thermal mass of the circuit board so as to minimize the difference in temperatures across the circuit board during the soldering process. The thermal mass of the...

20060097029 - Method of flip-chip bonding: A method of flip-chip bonding can favorably activate the bonding surfaces and remove oxide films when bonding pads and bumps of a semiconductor chip and a substrate and avoids problems such as the bumps being excessively flattened and the bonds between connection terminals being destroyed by subsequent ultrasonic vibration. The...

20060097028 - Method of ultrasonic mounting and ultrasonic mounting apparatus using the same: A method of ultrasonic mounting can increase mounting efficiency by using high-frequency ultrasound and can also mount large semiconductor chips. The method ultrasonically bonds a semiconductor chip 52 to a substrate 50 using an ultrasonic mounting apparatus including a horn 15 that propagates ultrasonic vibration of an ultrasonic vibrator, the...

20060091181 - Wire tensioner for a wire bonder: A wire tensioner for a wire bonding apparatus is provided. The wire tensioner includes a body structure defining a passage for receiving a wire, the passage including an inlet opening and an outlet opening through which the wire is configured to extend. The wire tensioner defines (1) an inlet port...

20060091183 - Double wall cooking vessel: A dual wall cooking vessel is formed by the impact or friction bonding of the an inner to an outer vessel wherein a laminate of aluminum and copper layers is disposed between the outer surface of the bottom of the inner vessel and the inner surface of the bottom of...

20060091182 - Repair of braze joint and article repaired: A method of repairing a braze joint and the resulting joint includes removing an unsuitable portion of a first joining material in a joint between a first member and a second member of an aerospace assembly and cleaning the joint. A stripping solution is used to remove the unsuitable portion...

20060091184 - Method of mitigating voids during solder reflow: A Solder bump is formed by providing solder material on a conductive site of a substrate. The solder material is reflowed to provide a solder bump on the substrate. The solder material is ultrasonically agitated during at least a part of the reflow to at least partially mitigate formation of...

20060091185 - Method of mounting electronic component: The method is capable of securely mounting an electronic component on a circuit board by applying ultrasonic vibration. The method comprises the step of applying ultrasonic vibrations to the electronic component so as to flip-chip-bond the electronic component to the circuit board having electrodes. Portions of the circuit board, which...

20060091186 - Method for joining rails by friction welding: Method for the metallic joining of profiled rails in the longitudinal direction. Method includes heating rail ends to a joining temperature by pressing together faces of the rails end while simultaneously moving them relative to one another in an oscillating manner with a greatest oscillation amplitude relative to one another...

20060091187 - Flux and method for joining dissimilar metals: Disclosed herein is a method for joining dissimilar metals without a need for a separate welding process. The method comprises applying a flux on a metal to be joined, inserting the metal into a mold, and injecting a molten metal into the mold. Thus, the base metal to be cast...

20060091188 - Solder printing process to reduce void formation in a microvia: In one embodiment, a method is provided. The method comprises filling a microvia formed in a bond pad with solder paste comprising solder balls of the first size; and coating the bond pad with solder paste comprising solder balls of the second size, wherein the second size is greater than...