Metal fusion bonding inventions 04/06

20060086772 - System and method for improving hard drive actuator lead attachment: A system and method are disclosed for improving hard drive actuator lead attachment. In one embodiment, an actuator board is coupled to an actuator flexible cable by a bonding agent, such as an anisotropic conductive film (ACF). In one embodiment, an actuator flexible cable is coupled to one or more...

20060086773 - Technique for optical inspection system verification: A technique for optical inspection verification implements a number of steps. Initially, a simulated solder paste material, including a solder powder and an organic resin, is provided. Next, the simulated solder paste material is printed in a desired pattern on a base material to provide a reference test board. Then,...

20060086774 - Formed structural assembly and associated preform and method: A superplastically formed structural assembly is provided, as is an associated preform and method for forming such an assembly. The assembly includes a skin member and a support member that are joined to define a space between the members and between the joints. The assembly can be produced by joining...

20060086775 - Method of friction stir welding and retractable shoulderless variable penetration friction stir welding tool for same: A method of friction stir welding and a non-consumable retractable shoulderless variable penetration friction stir welding tool. The tool includes a substantially cylindrical body portion, a head portion, and a tip section, each integral to the tool. The body portion has a longitudinal axis about which it is rotable, a...

20060086776 - Method to join or repair superalloy hot section turbine components using hot isostatic processing: Accordingly, the present invention provides a method for joining metallic members, which can be used to join component sub-assemblies. Further, the present invention provides a method for repairing a component by replacing a damaged portion and re-inserting a replacement section. In general, the present invention provides in one embodiment a...

20060086777 - Method and apparatus for placing conductive balls: Improved placing method and apparatus are provided for placing conductive balls in a predetermined pattern onto one surface of a base unit. An arrangement member is provided to have one surface, another surface opposite to the one surface of the arrangement member and positioning openings. The positioning openings are arranged...

20060081679 - Friction stir spot joining device: There is provided a friction stir spot joining device in which a pin can be simply and surely caused to come in or come out from a tip end of the joining tool by driving a pin extraction motor when the pin extraction motor is used so as to cause...

20060081680 - Desoldering wick for lead-free solder: A desoldering wick having an inner metal coating such as a 0.1 μm to 12 μm layer of tin or tin-alloy and an outer noble metal coating such as a 0.5 nm to 10 μm layer of gold, silver, platinum, palladium, or rhodium for the removal of lead-free solder; a...

20060081682 - Brazing method of an aluminum material: A method of brazing an aluminum material, which contains: using an aluminum alloy brazing sheet, wherein an aluminum alloy containing 0.2 to 1 mass % of Mg is used for a core alloy; the brazing sheet, in which an Mg amount in a filler alloy is 0.05 mass % or...

20060081681 - Coated diamond particles: A method of producing coated diamond particles includes the steps of providing a combination of a transition metal selected from zirconium, hafnium, niobium and tantalum, an activation metal and uncoated diamond particles, and heat treating the combination in a non-oxidizing atmosphere to cause the activation metal to bond to the...

20060081683 - Expandable mandrel for use in friction stir welding: A mandrel that provides a counter-force to the pressure exerted on the outside of a pipe or other arcuate surface by a friction stir welding tool, wherein the mandrel is expandable through the use of a wedge, and wherein the mandrel enables multiple friction stir welding heads to simultaneously perform...

20060081684 - Magnetic pulse welding of steel propshafts: A method of magnetically welding an end fitting to a metal tube includes assembling a driver ring over an end of the tube and inserting a length of the end fitting into a bore of the tube. An overlap region of the tube, the driver ring and the cylinder are...

20060081685 - Repair process: In accordance with the present invention, a process for repairing metal workpieces, such as turbine engine components, is provided. The process comprises the steps of forming a braze paste containing a first nickel base alloy material containing boron and chromium and a second nickel base alloy material containing chromium and...

20060081686 - Repair process: In accordance with the present invention, a process for repairing metal workpieces, such as turbine engine components, is provided. The process comprises the steps of forming a braze paste containing a first nickel base alloy material containing boron and chromium and a second nickel base alloy material containing chromium and...

20060081687 - Al-mg-mn weld filler alloy: The present invention relates to a filler wire alloy composition including, in wt. %: Mg 6.0 to 9.5%, Mn 0.9 to 2.0%, Zn 0.2 to 0.9%, Zr≦0.3%, preferably 0.05 to 0.25%, Cr≦0.5%, Sc≦2.8%, Cu≦0.5%, preferably ≦0.25%, Fe≦0.5%, Si≦0.5%, Ti≦0.3%, the balance aluminium and incidental elements and impurities. The invention further...

20060076387 - Joining method and apparatus: This joining method has a joining step of bonding together a plurality of members W1, W2, which are to be joined, metallurgically in a solid phase state, and comprises a contact step of bringing a liquid organic acid L into contact with surfaces to be joined of the members W1,...

20060076388 - Method and apparatus for mounting and removing an electronic component: A method and an apparatus are provided for mounting and removing electronic components using solder bumps while constraining thermal stresses to a substrate. The method and apparatus for mounting and removing an electronic component (bear chip 32) to be soldered onto the substrate with solder bumps 114 is configured to...

20060076389 - Method and apparatus for controlling and monitoring a brazing process: In a method and a corresponding apparatus for controlling and monitoring the vacuum brazing of power components and SMD components, in which the temperature of the process is controlled using an open thermocouple, which is arranged separate from the furnace heating and is integrated in a base plate serving as...

20060076391 - Flip chip bonding tool: A bonding tool and method for bonding a semiconductor chip to a surface is provided wherein the bonding tool includes a bonding tip comprising a ceramic material, preferably titanium carbide. The bonding tip is operative to hold the chip and a bonding energy generator such as an ultrasonic transducer is...

20060076390 - Wire bonder: A Wire Bonder contains a bondhead and a rocker arranged on the bondhead that is rotatable on a horizontal axis. A horn with a flange is attached to the rocker in which a capillary is clamped. At least one sensor is attached to the bondhead that detects vibrations of the...

20060071048 - Ultrasonic welding horn for welding a seam in an imaging receptor belt: In ultrasonic welding of a seam, such as for creation of an imaging belt, an ultrasonic welding horn is applied to an overlap area. The welding horn has a contact surface within a certain set of dimensions comparable to the overlap area. The welding horn defines a conical main body...

20060071050 - Multi-head tab bonding tool: A bonding tool for use in multi-head tape automated bonding (TAB) is provided. The bonding tool comprises a plurality of TAB bonding heads, the TAB bonding heads providing for electrical dissipation wherein current flow is low enough so as not to damage a device being bonded and high enough to...

20060071049 - Wire bonder and method of operating the same: Wire bonder having a bonding head which has a bonding tool and a bonding wire guide and, especially, a bonding wire cutting device which comprises a cutter for separation of that section of a bonding wire which projects beyond a bonding contact, the wire bonder having a camera with a...

20060071051 - Solder metal, soldering flux and solder paste: Solder metal consists essentially of 8.8 to 5.0 mass % of Zn, 0.05 to 0 mass % of Bi and the balance of Sn and unavoidable impurities....

20060071052 - Method and apparatus for determining solder paste composition quality: Determining the quality of a solder paste deposit includes comparing the fluorescence from a solder paste deposit with that of a deposit having an ideal mixture of flux and metal spheres....

20060071053 - Microwave brazing of airfoil cracks: A gas turbine engine includes alternating rows of rotary airfoils or blades and static airfoils or vanes. The vanes are made of a base metal, such as cobalt or nickel superalloy. If a crack forms in one of the vanes, a braze alloy is applied to the crack. The braze...

20060071054 - Aluminum end caps ultrasonically welded to end of aluminum tube: An aluminum tubular unit for long-term, leak-free storage of fluids is formed in which an aluminum cap is ultrasonically welded to an end of the aluminum tube. The ultrasonic weld is formed from a device capable of producing a torsional vibration pattern. The ultrasonic welding of the cap to the...

20060071055 - Cantilevered welding collet: An apparatus and method for securing one or more workpieces before welding in a weld head unit. The apparatus includes a welding collet which incorporates a cantilevered, flexible spring “finger” or beam to support the workpiece. The finger is adapted to more uniformly distribute bending stresses along the clamping portions...

20060071056 - Transient liquid phase bonding using sandwich interlayers: Systems and methods for transient liquid phase bonding are described herein. Embodiments of these systems and methods utilize sandwich interlayers to produce stronger, more homogeneous bonds than currently possible. These sandwich interlayers comprise a middle bonding layer sandwiched between two outer bonding layers. The middle bonding layer comprises a different...