Metal fusion bonding inventions 12/05

20050284912 - Flange-mounted transducer: A flange-mounted transducer, such as an ultrasonic transducer, is provided that comprises a horn and a driver coupled to the horn for generating an oscillatory energy supply to the horn. A support structure interface is positioned at a node of longitudinal oscillatory displacement of the transducer and a support structure...

20050284915 - Apparatus and method for indexing of substrates and lead frames: An apparatus for manipulating a work piece in connection with a wire bonding machine including at least one magazine handler is provided. The apparatus includes a first conveyor system configured to receive work pieces from the at least one magazine handler, and a second conveyor system configured to receive work...

20050284913 - Capillary for wire bonding: A capillary tip for deforming a bonding wire during bonding of the wire to a bonding surface comprises a bottom face along an inner periphery of the capillary tip for pressing the bonding wire against a bonding surface, an outer radius along an outer periphery of the capillary tip, and...

20050284914 - Method and apparatus for measuring the size of free air balls on a wire bonder: A system for measuring the size of free air balls for use with a wire bonder having a wire bonding tool and an Electric Flame Off (EFO) device is provided. The system includes an imager disposed above a first image plane, a prism disposed below the imager, and at least...

20050284916 - Ball bonding method and ball bonding apparatus: When ball bonding a thin wire to a work, it is possible to carry out bonding without causing damage to the characteristics of the work. Discharging is carried out between a discharge electrode and the end of a thin wire that projects from a capillary to melt the end of...

20050284917 - Die attach area cut-on-fly method and apparatus: A method and apparatus for bonding integrated circuits uniquely suited to high volume tag production is described, where conductive material of a substrate at the die-attach-area is cut before an IC chip or transponder is placed on the conductive material over the cut and bonded. The apparatus performs the method...

20050284918 - In-situ alloyed solders, articles made thereby, and processes of making same: A composition includes a solder paste matrix and a solder mixture including a tin-based solder alloy. The composition also includes a discrete dispersion of a metal. The tin-based alloy includes a melting first temperature and the metal includes a melting second temperature. The melting second temperature is greater than the...

20050284919 - Method and apparatus for automated assembly and laser welding of medical devices: A method and system for assembling a component within a medical device that includes a support device fixedly positioning the medical device and a weld head capable of being advanced towards a bottom portion of the support device so that the seal member, the front wall, the rear wall and...

20050284921 - Method of soldering electronic component having solder bumps to substrate: A method of soldering electronic component (6) having solder bumps (7) formed thereon to substrate (12), wherein bumps (7) are pressed against a flux transferring stage on which a thin film is formed of flux (10) containing metal powder (16) of good wettability to solder so as to cause metal...

20050284920 - Solder bumps formation using solder paste with shape retaining attribute: Method of forming solder bumps of an integrated circuit package is described. A solder paste is formed from a material having a characteristic that the deposited instances thereof substantially retain their geometric shape upon exposure to electromagnetic radiation....

20050279805 - Bondhead for wire bonding apparatus: A bondhead is provided that comprises a bondhead body for holding a bonding tool, such as an ultrasonic transducer, and a bondhead actuator coupled to the bondhead body for moving the bonding tool with respect to a bonding surface. A wire clamping device, which may comprise a wire clamp holder...

20050279807 - Aom modulation techniques employing an upstream bragg adjustment device: Digital control of frequency and/or amplitude modulation techniques of an intracavity and/or extracavity AOM (60) facilitate substantially full extinction of a laser beam (90) to prevent unwanted laser energy from impinging a workpiece (80); facilitate laser pulse amplitude stability through closed-loop control of pulse-to-pulse laser energy; facilitate beam-positioning control including,...

20050279808 - Aom modulation techniques employing plurality of tilt-angled transducers to improve laser system performance: Digital control of frequency and/or amplitude modulation techniques of an intracavity and/or extracavity AOM (60) facilitate substantially full extinction of a laser beam (90) to prevent unwanted laser energy from impinging a workpiece (80); facilitate laser pulse amplitude stability through closed-loop control of pulse-to-pulse laser energy; facilitate beam-positioning control including,...

20050279806 - Modular steel concrete reinforcement system: A method of welding reinforcement steel bars (rebar) and assembly of fusion-welded rebar into panel assemblies that are self-stabilizing to withstand the rigors of transport to and positioning within construction sites. The rebar welding method generates fusion welds in such a manner that the weld imparts stability and strength to...

20050279809 - Optical structures including liquid bumps and related methods: A liquid prime mover can be used to position a component on a substrate. For example, a liquid material can be provided on the substrate adjacent the component such that the component has a first position relative to the substrate. A property of the liquid material can then be changed...

20050279810 - Friction stir weld repair: A method of repairing a discrepancy in a casting, weldment or other workpiece comprised of a material characterized by thermoplastic properties includes excising the discrepancy by cutting, milling, or otherwise removing workpiece material surrounding the discrepancy so as to remove the discrepancy and form a cylindrical hole in the workpiece....

20050279813 - Automated ball mounting process and system with solder ball testing: An automated ball mounting process and system are disclosed In which solder balls are tested by heating the solder balls to a temperature between the eutectic temperature of lead-tin and the melting temperature of a lead free solder ball. If the heated solder balls melt they are standard solder balls....

20050279812 - Semiconductor device, manufacturing method and apparatus for the same: A highly reliable semiconductor chip electrode structure allowing control of interface reaction of bonding sections even in the case of using two- or three-element solder used conventionally is disclosed. A solder alloy making layer for preventing dissolving and diffusion of tin into tin-based lead free solder is thinly formed on...

20050279811 - Wire bonding wedge: This invention is for a wedge for bonding an elongated conductor, such as a wire, to a bond pad on a microelectronic device. A wire passes through an aperture in the wedge into a pocket or an open notch. A sidewall on each side of the pocket or open notch...

20050274770 - Method for the precise and reliable placement of solid metallic and non-metallic particles: Vibrational energy is used to fluidize a bed of particulate material over the top surface of a tooling plate with particle alignment hole passing from its top to bottom side. The particle alignment holes are slightly smaller than the particles in the particulate bed. The vibrational energy's frequency, amplitude, orientation,...

20050274771 - Bonding apparatus: A bonding apparatus 10 including an X and Y motor parts 20 and 50, which have substantially the same construction, and a moving table 60, which can be moved in the XY plane by these motor parts. The X motor part 20 and Y motor part 50 are connected to...

20050274773 - Cored wire: Cored wire including at least one thermal barrier layer, distinguished by the fact that said layer is made of a material that pyrolizes upon contact with a metal bath such as liquid metal....

20050274774 - Insulation paper with high thermal conductivity materials: The present invention provides for a high thermal conductivity (HTC) paper that comprises a host matrix, such as mica, and HTC materials intercalated into the host matrix. The HTC materials are comprised of at least one of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings...

20050274772 - Treating an area to increase affinity for a fluid: Methods to treat an area on a surface to increase affinity for a fluid having a solution of particles including a conductive material....

20050274775 - Method of forming metal blanks for sputtering targets: The present invention relates to an improvement in the manufacture of metal blanks, discs, and sputtering targets by flattening only one of the two surfaces of a metal plate. The elimination of flattening the metal plate's second surface results in a significant cost reduction. The metal plate of the present...

20050274776 - Dissimilar material weld joint formed by joining iron type material and aluminum type material, and weld joining method: Disclosed are: a dissimilar material weld joint being formed by joining an iron type material and an aluminum type material and having not only a high strength but also an excellent ductility; and a weld joining method allowing such a joint to be stably produced. A dissimilar material weld joint...

20050269382 - System for welding motor-vehicle bodies: A system for the welding of motor-vehicle bodies comprises a conveying line, for carrying the motor-vehicle bodies to be welded through a welding station, and a plurality of pairs of side gates mobile on guide means, the gates of each pair being adapted to the configuration of a corresponding type...

20050269383 - Apparatus and methods for underwater welding: A lower housing having a lower chamber and a welding opening is fixed about an underwater weld site. The lower housing includes an upper opening, the lower housing being filled with water upon installation. A transport housing containing a welding unit in a dry state is lowered such that a...

20050269384 - Method of preventing flashing between solder pads on circuit board: A method of preventing flash between solder pads on a circuit board is proposed. The method involves the step of forming a solder resistant structure on a area between at least two solder pads on the circuit board, such that the solder masks isolates the solder material that flashes between...

20050269385 - Soldering method and solder joints formed therein: This invention forms an indium or indium alloy layer on top of a Sn based lead-free solder. The indium or indium alloy layer can be formed by various methods, such as plating, deposition, printing, dipping, etc. The indium-containing layer melts during the soldering process, wets the substrate, and forms a...

20050263564 - Apparatus and method for making an improved chain link fabric: An apparatus for processing chain link fabric including a welding assembly and/or a compressing assembly. The welding assembly is configured to weld together wire-end portions of the chain link fabric. The welding assembly includes a guiding assembly having a finger and a cam, which are configured to restrict the movement...

20050263565 - Method and device for moving an element by means of a drive: A method for moving an element using a drive system includes determining a difference between a predetermined value of the position of the element and an actually measured value of the position of the element at frequent intervals using a processor during the movement of the element. A collision of...

20050263566 - Substrate holding apparatus: A substrate holding apparatus for semiconductor processing like wire bonding process is disclosed. Two or more holding points at both side of center locating point are provided to created a distributed holding force at clamp tool holding shoulder to generate a moment about substrate moving direction to act on clamp...

20050263567 - Scientific phenomena evaluation device and manufacturing method of the same: A scientific phenomena evaluation device comprising a base plate in which long grooves having sectional areas of 1 mm2 or less being formed in the surface and a cover plate that is placed on the surface of said base plate and covers said long grooves to form minute channels in...

20050263568 - Method and product for joining tubes of dissimilar metals: A method and product for joining a first tube comprised of a first metal to a second tube comprised of a second metal, the metals being metallurgically incompatible. A layered plate is produced having a first layer compatible with the first metal, a second layer compatible with the second metal...

20050263569 - Portable friction welder: A portable friction welder that applies direct axial load to the workpieces via a rotating variable pressure hydraulic cylinder placed between the workpieces and a rotational device. The portable friction welder includes an interchangeable adapter configured to receive a fitting for a first workpiece, a variable pressure hydraulic cylinder with...

20050263570 - Method for forming sputter target assemblies: The method forms a sputter target assembly by attaching a sputter target to an insert and applying a bond metal layer between the insert and a backing plate. Then pressing the insert and backing plate together forms a solid state bond with the bond metal layer, attaches the insert to...

20050263571 - Injection molded continuously solidified solder method and apparatus: A method and apparatus for forming solder bumps by molten solder deposition into cavity arrays in a substrate immediately followed by solidification of molten solder such that precise replication of cavity volumes is consistently achieved in formed solder bump arrays. Various solder filling problems, such as those caused by surface...

20050263572 - Circuit assembly for battery pack or the like, and method of making the same: A circuit assembly includes a first substrate formed with a first wiring pattern, a second substrate formed with a second wiring pattern, and a joint member for electrically and/or mechanically connecting the first substrate to the second substrate. The joint member includes a set of separated leads extending generally parallel...