FREE patent keyword monitoring and additional FREE benefits. http://images1.freshpatents.com/images/triangleright (1K) REGISTER now for FREE triangleleft (1K)
FreshPatents.com Logo    FreshPatents.com icons
Monitor Keywords Patent Organizer File a Provisional Patent Browse Inventors Browse Industry Browse Agents
  
Browse Inventors: A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z

Lisa H. Karlin patents

Recent bibliographic sampling of Lisa H. Karlin patents listed/published in the public domain by the USPTO (USPTO Patent Application #,Title):



03/26/15 - 20150084138 - Integrated circuit having varying substrate depth and method of forming same
A semiconductor device is formed such that a semiconductor substrate of the device has a non-uniform thickness. A cavity is etched at a selected side of the semiconductor substrate, and the selected side is then fusion bonded to another substrate, such as a carrier substrate. After fusion bonding, the side...
Inventors: Lisa H. Karlin, Hemant D. Desai, Kemiao Jia (Freescale Semiconductor, Inc.)

08/14/14 - 20140225206 - Pressure level adjustment in a cavity of a semiconductor die
A semiconductor die (20) includes a substrate (30) and microelectronic devices (22, 26) located at a surface (32) of the substrate (30). A cap (34) is coupled to the substrate (30), and the microelectronic device (22) is positioned in the cavity (24). An outgassing material structure (36) is located within...
Inventors: Yizhen Lin, Chad S. Dawson, Hemant D. Desai, Lisa H. Karlin, Keith L. Kraver, Mark E. Schlarmann

01/09/14 - 20140008739 - Semiconductor device and method of fabricating same
A wafer structure (88) includes a device wafer (20) and a cap wafer (60). Semiconductor dies (22) on the device wafer (20) each include a microelectronic device (26) and terminal elements (28, 30). Barriers (36, 52) are positioned in inactive regions (32, 50) of the device wafer (20). The cap...
Inventors: Lisa H. Karlin, Lianjun Liu, Alex P. Pamatat, Paul M. Winebarger (Freescale Semiconductor, Inc.)

10/31/13 - 20130285161 - Integrated circuit having varying substrate depth and method of forming same
A semiconductor device is formed such that a semiconductor substrate of the device has a non-uniform thickness. A cavity is etched at a selected side of the semiconductor substrate, and the selected side is then fusion bonded to another substrate, such as a carrier substrate. After fusion bonding, the side...
Inventors: Lisa H. Karlin, Hemant D. Desai, Kemiao Jia

02/21/13 - 20130043564 - Attaching a mems to a bonding wafer
A MEMS is attached to a bonding wafer in part by forming a support layer over the MEMS. A first eutectic layer is formed over the support layer. The eutectic layer is patterned into segments to relieve stress. A second eutectic layer is formed over the bonding wafer. A eutectic...
Inventors: Lisa H. Karlin, Hemant D. Desai

05/03/12 - 20120107993 - Method of making a micro-electro-mechanical-systems (mems) device
A method of forming a MEMS device includes forming a sacrificial layer over a substrate. The method further includes forming a metal layer over the sacrificial layer and forming a protection layer overlying the metal layer. The method further includes etching the protection layer and the metal layer to form...
Inventors: Lisa H. Karlin, David W. Kierst, Lianjun Liu, Wei Liu, Ruben Montez, Robert F. Steimle

05/03/12 - 20120107992 - Method of producing layered wafer structure having anti-stiction bumps
A method (50) for producing a layered wafer structure (24) having anti-stiction bumps (22) entails producing the anti-stiction bumps (22) in a surface (32) of a substrate (26) or, alternatively, in a surface (48) of a substrate (28). The method (50) further entails coupling the substrates (26, 28) with an...
Inventors: Lisa H. Karlin, Hemant D. Desai (Freescale Semiconductor, Inc.)

01/05/12 - 20120001277 - Methods for making in-plane and out-of-plane sensing micro-electro-mechanical systems (mems)
A device structure is made using a first conductive layer over a first wafer. An isolated conductive region is formed in the first conductive layer surrounded by a first opening in the conductive layer. A second wafer has a first insulating layer and a conductive substrate, wherein the conductive substrate...
Inventors: Woo Tae Park, Lisa H. Karlin, Lianjun Liu, Heinz Loreck, Hemant D. Desai

09/15/11 - 20110221042 - Semiconductor device and method of fabricating same
A wafer structure (88) includes a device wafer (20) and a cap wafer (60). Semiconductor dies (22) on the device wafer (20) each include a microelectronic device (26) and terminal elements (28, 30). Barriers (36, 52) are positioned in inactive regions (32, 50) of the device wafer (20). The cap...
Inventors: Lisa H. Karlin, Lianjun Liu, Alex P. Pamatat, Paul M. Winebarger (Freescale Semiconductor, Inc.)

06/16/11 - 20110143476 - Electrical coupling of wafer structures
A method for electrically coupling a first wafer with a second wafer is provided. The method includes bonding the first wafer with the second wafer using a bonding material. The method further includes forming an opening in the first wafer in a scribe area of the second wafer to expose...
Inventors: Lianjun Liu, Lisa H. Karlin, Alan J. Magnus

06/09/11 - 20110133294 - Micro electromechanical systems (mems) having a gap stop and method therefor
A method of forming a micro-electromechanical system (MEMS) includes providing a cap substrate, providing a support substrate, depositing a conductive material over the support substrate, patterning the conductive material to form a gap stop and a contact, wherein the gap stop is separated form the contact by an opening, forming...
Inventors: Woo Tae Park, Lisa H. Karlin, Lianjun Liu

02/24/11 - 20110042761 - Eutectic flow containment in a semiconductor fabrication process
A disclosed semiconductor fabrication process includes forming a first bonding structure on a first surface of a cap wafer, forming a second bonding structure on a first surface of a device wafer, and forming a device structure on the device wafer. One or more eutectic flow containment structures are formed...
Inventors: Lisa H. Karlin, Hemant D. Desai (Freescale Semiconductor, Inc.)

09/30/10 - 20100244159 - Eutectic flow containment in a semiconductor fabrication process
Eutectic Flow Containment in a Semiconductor Fabrication Process A disclosed semiconductor fabrication process includes forming a first bonding structure on a first surface of a cap wafer, forming a second bonding structure on a first surface of a device wafer, and forming a device structure on the device wafer. One...
Inventors: Lisa H. Karlin, Hemant D. Desai (Freescale Semiconductor, Inc.)

06/24/10 - 20100155861 - Microelectromechanical device with isolated microstructures and method of producing same
A microelectromechanical systems (MEMS) device (20) includes a polysilicon structural layer (46) having movable microstructures (28) formed therein and suspended above a substrate (22). Isolation trenches (56) extend through the layer (46) such that the microstructures (28) are laterally anchored to the isolation trenches (56). A sacrificial layer (22) is...
Inventors: Lisa Z. Zhang, Lisa H. Karlin, Ruben B. Montez, Woo Tae Park (Freescale Semiconductor, Inc.)

Freescale Semiconductor, Inc.

Archived*
(*May have duplicates - we are upgrading our archive.)

20120107992 - Method of producing layered wafer structure having anti-stiction bumps
20120107993 - Method of making a micro-electro-mechanical-systems (mems) device


###

The bibliographic references displayed about Lisa H. Karlin's patents are for a recent sample of Lisa H. Karlin's publicly published patent applications. The inventor/author may have additional bibliographic citations listed at the USPTO.gov. FreshPatents.com is not associated or affiliated in any way with the author/inventor or the United States Patent/Trademark Office but is providing this non-comprehensive sample listing for educational and research purposes using public bibliographic data published and disseminated from the United States Patent/Trademark Office public datafeed. This information is also available for free on the USPTO.gov website. If Lisa H. Karlin filed recent patent applications under another name, spelling or location then those applications could be listed on an alternate page. If no bibliographic references are listed here, it is possible there are no recent filings or there is a technical issue with the listing--in that case, we recommend doing a search on the USPTO.gov website.

###



Sign up for the FreshPatents.com FREE Keyword Monitor and check for keyword phrases (ie. "RFID" , "wireless", "web development", "fuel cells" etc.)...You will be notified when new patent applications and inventions are published that match your keywords. Also you can save for later research public patent/invention documents using our FREE Organizer. It takes only 30 seconds to sign up or login.

Advertise on FreshPatents.com - Rates & Info

###

FreshPatents.com Support - Terms & Conditions