| Liquid-cooling heat dissipation assembly -> Monitor Keywords |
|
|
 
Liquid-cooling heat dissipation assemblyRelated Patent Categories: Refrigeration, Structural Installation, With Electrical Component CoolingLiquid-cooling heat dissipation assembly description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20060185378, Liquid-cooling heat dissipation assembly. Brief Patent Description - Full Patent Description - Patent Application Claims
BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a liquid-cooling heat dissipation assembly, and more particularly to a liquid-cooling heat dissipation assembly used for heat emitting device such as a CPU. [0003] 2. Description of Prior Art [0004] The compass are developed with more powerful function and computation speed. Beside performance issue, the product appearance, the construction and motherboard connection ways are also under extensive exploited. As downsize of form factor and increasing of processing speed, the heat dissipation for central processing unit (CPU) is also an important issue to solve. [0005] FIG. 1 shows a perspective view of a prior art liquid-cooling heat dissipation system 100a. As shown in this figure, the liquid-cooling heat dissipation system 100a comprises a heat dissipation stage 10a, a water outlet 101a and a water inlet 102a on both ends of the heat dissipation system stage 10a, respectively, a duct 103a connected between the water inlet 102a and a water outlet 201a of a water pump 20a, a duct 104a connected between the water outlet 101a and a water inlet 301a of a cooling stage 30a, which is composed of a plurality of heat-dissipating fins 303a. [0006] The cooling stage 30a comprises a water outlet 302a connected to a water inlet 401a of a water tank 40a through a duct 402a. The water tank 40a comprises a water outlet connected to the water inlet 202a of the water pump 20a, thus forming the liquid-cooling heat dissipation system 100a. During operation, the water pump 20a conveys cool water to the heat dissipation stage 10a for heat exchanging into hot water. Afterward, hot water flows to the cooling stage 30a through the duct 104a for heat exchanging into cool water there and cool water flows back to the water tank 40a through the duct 304a. The above operations are repeated for cyclic heat exchange. [0007] However, above-described prior art liquid-cooling heat dissipation system 100a is composed of separate heat dissipation stage 10a, water pump 20a, cooling stage 30a and water tank 40a and ducts 103a, 104a, 304a and 402a interconnecting between above devices. The liquid-cooling heat dissipation system 100a thus formed is bulky and hard to assemble. This is adverse to the compact trend of computer. SUMMARY OF THE INVENTION [0008] The present invention provides a liquid-cooling heat dissipation assembly, which comprises a liquid cooling array module, a liquid driving module and a cooling plate module integrated into an assembly. A through runner keeps the cooling liquid to flow continuously. The heat exchange cycle can be speeded up and the heat dissipation efficiency can be enhanced. [0009] According to one aspect of the present invention, the liquid-cooling heat dissipation assembly includes a liquid cooling array module with a plurality of heat dissipating fins, an upper cover and a lower cover on top and bottom sides of the liquid cooling array module, respectively, a liquid driving module driving the cooling liquid and assembled to the upper cover of the liquid cooling array module, a cooling plate module assembled with the lower cover of the liquid cooling array module. The cooling plate module has a heat absorbing face on bottom thereof and in contact with electronic device. A liquid passageway is defined through the liquid cooling array module, the liquid driving module and the cooling plate module The cooling liquid flows along the liquid passageway to circulate through those modules when the liquid driving module operates. [0010] According to another aspect of the present invention, the liquid cooling array module comprises a retaining frame with an upper cover and a lower cover on top and bottom sides. A plurality of heat dissipating fins is provided at center of the retaining frame and runners are defined between the plurality of heat dissipating fins. Both ends of the runner are communicated with the upper cover and the lower cover. The hot liquid in the lower cover flows to the upper cover by the driving force of the liquid driving module and then heat exchanges with the plurality of heat dissipating fins to become cooling liquid again. Afterward the cooling liquid flows back to the upper cover for repeated heat dissipation. [0011] According to still another act of the present invention, the liquid driving module comprises a main body win an inner space separated into an upper compartment and a lower compartment. The main body comprises a liquid inlet communicated with the lower compartment. The upper compartment contains a coil stage and an upper cap, and the lower compartment contains a guiding stage with a runner defined on bottom face thereof. An impeller stage is pivotally arranged on bottom of the guiding stage. The impeller stage is placed at the upper cover of the box when the liquid driving module is mounted on the liquid cooling array module. The liquid is injected to the lower compartment through the liquid inlet when the liquid is insufficient. Moreover, the liquid flows into the upper cover through the runner of the guiding stage and the impeller stage. BRIEF DESCRIPTION OF DRAWING [0012] The features of the invention believed to be novel are set forth with particularity in the appended claims. The invention itself however may be best understood by reference to the following detailed description of the invention, which describes certain exemplary embodiments of the invention, taken in conjunction with the accompanying drawings in which: [0013] FIG. 1 shows a perspective view of a prior art liquid-cooling heat dissipation system. [0014] FIG. 2 shows an exploded view of the liquid-cooling heat dissipation assembly according to the present invention. [0015] FIG. 3 shows an exploded view of the liquid-cooling heat dissipation assembly according to the present invention. [0016] FIG. 4 shows another exploded view of the liquid-cooling heat dissipation assembly according to the present invention. [0017] FIG. 5 shows a perspective view of the liquid-cooling heat dissipation assembly to be assembled with retaining frame and fan. [0018] FIG. 6 shows a perspective view of the liquid-cooling heat dissipation assembly already assembled with retaining frame and fan. [0019] FIG. 7 shows a sectional view of the liquid-cooling heat dissipation assembly. DETAILED DESCRIPTION OF THE INVENTION [0020] As shown in FIG. 2, the liquid-cooling heat dissipation assembly according to the present invention is used for heat dissipation of a CPU 20 shown in FIG. 7. The liquid-cooling heat dissipation assembly according to the present invention comprises, from bottom to top order, a cooling plate module 1, a liquid cooling array module 2, a liquid driving module 3 and runners define among those modules. Continue reading about Liquid-cooling heat dissipation assembly... Full patent description for Liquid-cooling heat dissipation assembly Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Liquid-cooling heat dissipation assembly patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Liquid-cooling heat dissipation assembly or other areas of interest. ### Previous Patent Application: Cryogenic computer system with parallel multiple cooling temperatures Next Patent Application: Refrigerant cycle with three-way service valve for environmentally friendly refrigerant Industry Class: Refrigeration ### FreshPatents.com Support Thank you for viewing the Liquid-cooling heat dissipation assembly patent info. IP-related news and info Results in 0.2125 seconds Other interesting Feshpatents.com categories: Tyco , Unilever , Warner-lambert , 3m 174 |
 * Protect your Inventions * US Patent Office filing 
PATENT INFO |
|
