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  Light emitting diode systemsUSPTO Application #: 20060038188Title: Light emitting diode systems Abstract: Light emitting diode systems are disclosed. (end of abstract) Agent: Fish & Richardson PC - Minneapolis, MN, US Inventors: Alexei A. Erchak, Elefterios Lidorikis USPTO Applicaton #: 20060038188 - Class: 257082000 (USPTO) Related Patent Categories: Active Solid-state Devices (e.g., Transistors, Solid-state Diodes), Incoherent Light Emitter Structure, In Combination With Or Also Constituting Light Responsive Device, With Specific Housing Or Contact Structure, Discrete Light Emitting And Light Responsive Devices The Patent Description & Claims data below is from USPTO Patent Application 20060038188. Brief Patent Description - Full Patent Description - Patent Application Claims
CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application claims priority under 35 U.S.C. .sctn.119 to U.S. Provisional Patent Application Ser. No. 60/603,087, filed Aug. 20, 2004, and entitled "LIGHT EMITTING DIODE SYSTEMS" and U.S. Provisional Patent Application Ser. No. 60/605,733, filed Aug. 31, 2004, and entitled "DIE ATTACH PROCESSES", the entire contents of which are hereby incorporated by reference. INCORPORATION BY REFERENCE [0002] This application incorporates by reference the following U.S. Provisional Patent Applications: 60/553,894, filed Mar. 16, 2004; 60/462,889, filed Apr. 15, 2003; 60/474,199, filed May 29, 2003; 60/475,682, filed Jun. 4, 2003; 60/503,653, filed Sep. 17, 2003; 60/503,654 filed Sep. 17, 2003; 60/503,661, filed Sep. 17, 2003; 60/503,671, filed Sep. 17, 2003; 60/503,672, filed Sep. 17, 2003; 60/513,807, filed Oct. 23, 2003; 60/514,764, filed Oct. 27, 2003; 60/603,087, filed Aug. 20, 2004; 60/605,733, filed Aug. 31, 2004; 60/645,720 filed Jan. 21, 2005; 60/645,721 filed Jan. 21, 2005; 60/659,861 filed Mar. 8, 2005; 60/660,921 filed Mar. 11, 2005; 60/659,810 filed Mar. 8, 2005; and 60/659,811 filed Mar. 8, 2005. This application also incorporates by reference the following U.S. patent applications: U.S. Ser. No. 10/723,987 entitled "Light Emitting Devices," and filed Nov. 26, 2003; U.S. Ser. No. 10/724,004, entitled "Light Emitting Devices," and filed Nov. 26, 2003; U.S. Ser. No. 10/724,033, entitled "Light Emitting Devices," and filed Nov. 26, 2003; U.S. Ser. No. 10/724,006, entitled "Light Emitting Devices," and filed Nov. 26, 2003; U.S. Ser. No. 10/724,029, entitled "Light Emitting Devices," and filed Nov. 26, 2003; U.S. Ser. No. 10/724,015, entitled "Light Emitting Devices," and filed Nov. 26, 2003; U.S. Ser. No. 10/724,005, entitled "Light Emitting Devices," and filed Nov. 26, 2003; U.S. Ser. No. 10/735,498, filed Dec. 12, 2003, and entitled "Light Emitting Systems", U.S. Ser. No. 10/794,244, filed Mar. 5, 2004, and entitled "Light Emitting Device Methods", U.S. Ser. No. 10/794,452, filed Mar. 5, 2004, and entitled "Light Emitting Device Methods", U.S. Ser. No. 10/872,335, entitled "Optical Display Systems and Methods" and filed Jun. 18, 2004; U.S. Ser. No. 10/871,877, entitled "Electronic Device Contact Structures" and filed Jun. 18, 2004; and U.S. Ser. No. 10/872,336, entitled "Light Emitting Diode Systems" and filed Jun. 18, 2004. TECHNICAL FIELD [0003] The invention relates to light emitting diode systems. BACKGROUND [0004] A light emitting diode (LED) often can provide light in a more efficient manner than an incandescent light source and/or a fluorescent light source. The relatively high power efficiency associated with LEDs has created an interest in using LEDs to displace conventional light sources in a variety of lighting applications. For example, in some instances LEDs are being used as traffic lights and to illuminate cell phone keypads and displays. [0005] Typically, an LED is formed of multiple layers, with at least some of the layers being formed of different materials. In general, the materials and thicknesses selected for the layers determine the wavelength(s) of light emitted by the LED. In addition, the chemical composition of the layers can be selected to try to isolate injected electrical charge carriers into regions (commonly referred to as quantum wells) for relatively efficient conversion to optical power. Generally, the layers on one side of the junction where a quantum well is grown are doped with donor atoms that result in high electron concentration (such layers are commonly referred to as n-type layers), and the layers on the opposite side are doped with acceptor atoms that result in a relatively high hole concentration (such layers are commonly referred to as p-type layers). [0006] A common approach to preparing an LED is as follows. The layers of material are prepared in the form of a wafer. Typically, the layers are formed using an epitaxial deposition technique, such as metal-organic chemical vapor deposition (MOCVD), with the initially deposited layer being formed on a growth substrate. The layers are then exposed to various etching and metallization techniques to form contacts for electrical current injection, and the wafer is subsequently sectioned into individual LED chips. Usually, the LED chips are packaged. [0007] During use, electrical energy is usually injected into an LED and then converted into electromagnetic radiation (light), some of which is extracted from the LED. SUMMARY [0008] The invention relates to optical display systems and methods. [0009] In one aspect, the invention features a system that includes a light emitting device, at least one electrical contact pad disposed along an edge of the surface of the light emitting device, and a package. The package can include a plurality of plated regions for providing electrical contact to the light emitting device and a plurality of wire bonds connected between the plated regions and the at least one electrical contact pad. [0010] Embodiments can include one or more of the following. [0011] The light emitting device can include a multi-layer stack of materials that includes a light generating region and a first layer supported by the light generating region. The surface of the first layer can be configured so that light generated by the light generating region can emerge from the light emitting device via a surface of the first layer, a shape of a surface of the multi-layer stack being rectangular and the surface of the first layer having a dielectric function that varies spatially according to a pattern. [0012] The plurality of wire bonds can include at least about 5 wire bonds. The plurality of wire bonds can include at least about 10 wire bonds. The plurality of wire bonds can include at least about 25 wire bonds. The plurality of wire bonds can include at least about 50 wire bonds. [0013] An aspect ratio of the surface of the multi-layer stack can be about 4.times.3. An aspect ratio of the surface of the multi-layer stack can be about 16.times.9. The package can include a light emitting panel. The package can be mounted on a heat sink device. The package can be mounted on a core board. [0014] The light emitting device can be a light emitting diode. The light emitting device can be a photonic lattice light emitting diode. The light emitting device can be a surface emitting laser. [0015] An aspect ratio of the surface of the first layer can be about 4.times.3. An aspect ratio of the surface of the first layer can be about 16.times.9. [0016] In an additional aspect, the invention features an optical display system that includes a plurality of light emitting diodes, a microdisplay, at least one optical component disposed along an optical path from the microdisplay to the light emitting diode, and a beam aggregation device disposed along an optical path from the microdisplay to the light emitting diodes. The beam aggregation device can be configured to combine light generated by the plurality of light emitting diodes. [0017] Embodiments can include one or more of the following. The plurality of light emitting diodes can include at least one light emitting diode that includes a multi-layer stack of materials. The multi-layer stack of materials can include a light generating region, and a first layer supported by the light generating region. A surface of the first layer can be configured so that light generated by the light generating region can emerge from the light emitting device via a surface of the first layer, and the surface of the first layer having a dielectric function that varies spatially according to a pattern. [0018] The beam aggregation device can be an x-cube. The beam aggregation device can be a prism, dichroic mirror, x-cube, holographic grating, and/or combinations thereof. The plurality of light emitting diodes can include red light emitting diodes, blue light emitting diodes, and green light emitting diodes. The plurality of light emitting diodes can include a red light emitting diode, a blue light emitting diode, and a green light emitting diode. [0019] The light emitting diodes can be photonic lattice light emitting diodes. The light emitting diodes can be rectangular in shape. Continue reading... Full patent description for Light emitting diode systems Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Light emitting diode systems patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. 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