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Led assembly with vented circuit boardLed assembly with vented circuit board description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20070086188, Led assembly with vented circuit board. Brief Patent Description - Full Patent Description - Patent Application Claims
CROSS REFERENCE TO RELATED APPLICATIONS [0001] This application is a divisional application of U.S. patent application Ser. No. 10/847,343, filed May 18, 2004 and entitled "LED Assembly with Vented Circuit Board," the contents of which are incorporated herein by reference. FIELD OF THE INVENTION [0002] The invention relates to lighting units using light emitting diodes (LEDs). More particularly, the invention relates to a light emitting diode assembly with a vented circuit board. BACKGROUND OF THE INVENTION [0003] Light-emitting diodes (LEDS) have been used for signs and other types of illuminated displays for many years. As a byproduct of operation, display assemblies having LEDs generate heat as electric current flows through the devices. The heat must be dissipated or removed to prevent overheating. Cooling a display assembly is important in order to preserve its functionality and efficiency. Furthermore, display assemblies when used in outdoor environments may be exposed to wind forces that affect loading on the assemblies. One approach for cooling an LED display assembly is shown in PCT publication WO2004019657. The publication generally shows a coolant fluid which cools LEDs using a mesh design. BRIEF SUMMARY OF THE INVENTION [0004] In one variation, a printed circuit board assembly includes a plurality of LEDs disposed in a grid pattern at junctions in which the junctions are interconnected by adjacent bridges defining air vents. A plurality of vents enables air to pass through the printed circuit board assembly, thus reducing wind resistance and promoting cooling. [0005] In another variation, a printed circuit board assembly includes a plurality of LED modules, each LED module being disposed at a corresponding junction, the junctions being connected to bridges in which adjacent bridges define air vents for allowing air to pass through. The bridges and junctions include a multilayer substrate having an insulating layer and a thermal cooling layer in thermal communication with the LED modules. The insulating layer may include a plurality of fluid openings configured for fluid convective heat transfer with the thermal cooling layer. [0006] In yet another variation, a printed circuit board assembly includes a plurality of LED modules and a multilayer substrate. The multilayered substrate may have an external insulating layer and a thermal cooling layer in thermal communication with the LED modules. The external insulating layer includes a plurality of openings which exposes the thermal cooling layer for fluid convective heat transfer. [0007] In yet another variation, a printed circuit board assembly includes a plurality of LEDs having a dome. The LEDs may be disposed in a grid pattern at junctions being interconnected by bridges defining air vents. The bridges include a substrate for activating the LEDs and the substrate includes a front side including the LEDs and an opposing a rear side. Aerodynamic members configured to reduce air pressure are disposed on the second side of the substrate corresponding to location of the junctions. In this way, wind loading may be reduced for multiple directions. Other variations are described in more detail herein. BRIEF DESCRIPTION OF THE DRAWINGS [0008] A more complete understanding of the present invention and the advantages thereof may be acquired by referring to the following description in consideration of the accompanying drawings, in which like reference numbers indicate like features, and wherein: [0009] FIG. 1 illustrates a perspective view of a printed circuit board assembly according to one or more aspects of the present invention. [0010] FIG. 2 illustrates a frontal elevation view of the printed circuit board assembly of FIG. 1. [0011] FIG. 3 illustrates an enlarged view of the printed circuit board assembly of FIG. 1 with LED modules. [0012] FIG. 4 illustrates an enlarged view of a printed circuit board assembly similar to FIG. 3, with the LED modules according to one or more aspects of the present invention. [0013] FIG. 5 illustrates a first rear perspective view of an LED module according to one or more aspects of the present invention. [0014] FIG. 6 illustrates a front perspective view of the LED module of FIG. 5 according to one or more aspects of the present invention. [0015] FIG. 7 illustrates a second rear perspective view of a LED module according to one or more aspects of the present invention. [0016] FIG. 8 illustrates a perspective view of an alternative embodiment of a printed circuit board assembly according to one or more aspects of the present invention. [0017] FIG. 9 illustrates a schematic diagram of one possible decoder-conductor arrangement for energizing components of a LED module according to one or more aspects of the present invention. [0018] FIG. 10 illustrates an enlarged view of the PCB assembly of FIG. 1 with a first heat dissipation feature according to one or more aspects of the present invention. [0019] FIG. 11 illustrates an enlarged view of the PCB assembly of FIG. 1 with a second heat dissipation feature according to one or more aspects of the present invention. Continue reading about Led assembly with vented circuit board... Full patent description for Led assembly with vented circuit board Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Led assembly with vented circuit board patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Led assembly with vented circuit board or other areas of interest. ### Previous Patent Application: Led assembly with vented circuit board Next Patent Application: Led assembly with vented circuit board Industry Class: Illumination ### FreshPatents.com Support Thank you for viewing the Led assembly with vented circuit board patent info. IP-related news and info Results in 0.13636 seconds Other interesting Feshpatents.com categories: Electronics: Semiconductor , Audio , Illumination , Connectors , Crypto , 174 |
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