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  Layer forming method, layer forming apparatus, device, manufacturing method for device, and electronic apparatusUSPTO Application #: 20070263031Title: Layer forming method, layer forming apparatus, device, manufacturing method for device, and electronic apparatus Abstract: A plurality of unit areas (bit) B are set on a base board. A liquid drop made of a liquid member is ejected to the unit area B from a liquid drop ejecting head so as to form a layer on the base board. A first pattern is formed by a first nozzle group Na in nozzles N which are formed in the liquid drop ejecting head. A second pattern is formed by a second nozzle group Nb which is different from the first nozzle group Na. By doing this, it is possible to maintain a stable ejection operation so as to form a pattern in preferable accuracy when patterns having different features are formed on the base board by using the liquid drop ejecting apparatus. (end of abstract)
Agent: Oliff & Berridge, PLC - Alexandria, VA, US Inventors: Minoru Koyama, Toshimitsu Hirai USPTO Applicaton #: 20070263031 - Class: 347040000 (USPTO) The Patent Description & Claims data below is from USPTO Patent Application 20070263031. Brief Patent Description - Full Patent Description - Patent Application Claims
CROSS-REFERENCE TO RELATED APPLICATION [0001] This is a Divisional of application Ser. No. 10/400,526 filed Mar. 28, 2003. The disclosure of the prior application is hereby incorporated by reference herein in its entirety. BACKGROUND [0002] 1. Field of the Invention [0003] The present invention relates to a layer forming method which uses a liquid drop ejecting device and a layer forming apparatus, device and manufacturing method therefor, and an electronic apparatus. [0004] 2. Description of Related Art [0005] Conventionally, a photo-lithography method has been commonly used for manufacturing a fine wiring pattern for a semiconductor-integrated-circuit. Recently, methods using a liquid drop ejecting method are disclosed. According to such a method, a liquid member which contains a pattern forming member is ejected to a base board from a liquid drop ejecting head; thus a wiring pattern is formed by disposing the pattern forming member on a pattern forming surface. It is understood that such technique is quite effective for multi-product production in a small volume (See Japanese Unexamined Patent Application, First Publication, No. Hei 11-274671 and Japanese Unexamined Patent Application, First Publication, No. 2000-216330 for reference). [0006] Here, when a wiring pattern is formed on a device, there is a case in which, for example, a linear line pattern and an inclining line pattern which is diagonal to the linear line pattern exist together, or a wiring pattern has different line widths co-existing. However, when these different wiring patterns are formed by a liquid drop ejecting apparatus under a common ejection conditions, there have sometimes been cases in which a required accuracy cannot be obtained in the formed pattern. [0007] For example, when a wiring pattern in which a liner line pattern and an inclining line pattern exist together is formed under common ejection conditions in which liquid drops having a common size are ejected, it occurs that intervals of the ejected liquid drops do not continue, particularly in an inclining line pattern; therefore, the obtained wiring pattern may have a conductivity defect. Thus, there is a concern that device quality may be degraded. SUMMARY [0008] The present invention was made in consideration of the above problems. An object of the present invention is to provide a layer manufacturing apparatus and method therefor by which it is possible to maintain a stable ejection operation so as to form a pattern with a preferred accuracy when patterns are formed on a base board by a liquid drop ejecting apparatus such that different patterns coexist. Another object of the present invention is to provide a device and an electronic apparatus using a layer manufactured by the above products. [0009] In order to solve the above problems, a layer forming method for setting a plurality of unit areas on a base board and ejecting a liquid drop made from a liquid member from a liquid drop ejecting head to the unit area and forming a layer on the base board preferably comprises steps of forming a first pattern by a first nozzle group which are formed in the liquid drop ejecting head, and forming a second pattern by a second nozzle group which is different from the first nozzle group. [0010] According to the present layer forming method, a first pattern is formed by a first nozzle group and a second pattern is formed by a second nozzle group which is different from the first nozzle group. Therefore, even if intervals between the liquid drops are insufficient when linear line patterns and inclining line patterns are formed by, for example, the first nozzle group and the liquid drop is ejected only to a unit area in the linear line pattern, the liquid drops are ejected to a border section in the unit area by the second nozzle group so as to be between the liquid drops in the linear line pattern formed by the liquid drops which are ejected by the first nozzle group. Therefore, the intervals of the liquid drops are formed continuously in the linear line pattern. [0011] Also, in the layer forming method of the present invention, it is preferable that the liquid drop be ejected to the unit area by the first nozzle group, and that the liquid drop be ejected to a border section in the unit areas by the second nozzle group. [0012] By doing this, a layer (pattern) is formed by the continuous liquid drops; thus, the obtained layer (pattern) has superior continuity. [0013] Also, in the layer forming method according to the present invention, it is preferable that the liquid member contain a conductive member. [0014] By doing this, it is possible to form a conductive layer such as a wiring pattern. Therefore, it is possible to form a wiring pattern having superior continuity which is free of line discontinuities. [0015] Also, in the layer forming method according to the present invention, it is preferable that the first nozzle group and the second nozzle group be disposed in a staggered manner in the liquid drop ejecting head. [0016] When the intervals between nozzles in the first nozzle group is made to correspond to the intervals between the neighboring unit areas, the liquid drop ejecting head is inclined. This is because the intervals between the nozzles in the first nozzle group are usually wider, and the interval between the nozzles in the first nozzle group ostensibly should preferably be narrowed. In such a case, if the first nozzle group and the second nozzle group are disposed in a staggered manner, it is possible to use relatively small inclination angle of the liquid drop ejecting head because the intervals between the nozzles in the first nozzle group are initially narrow. [0017] In a layer forming method according to the present invention, it is preferable that an interval between the nozzles be determined according to an interval between the unit areas in the liquid drop ejecting head. [0018] According to the layer forming method in the present invention, the liquid drop is ejected without controlling the inclination angle0 of the liquid drop ejecting head. Therefore, an inclination angle adjusting device is not necessary in the layer forming apparatus because the liquid drop is ejected from the a certain liquid drop ejecting head in the layer forming device. Thus, the inclination angle adjusting device is not necessary; thus, it is possible to reduce the cost of the layer forming apparatus. [0019] In a layer forming apparatus for setting a plurality of unit areas on a base board and ejecting a liquid drop made from a liquid member from a liquid drop ejecting head to the unit area and forming a layer on the base board according to the present invention, it is preferable that the layer forming apparatus be provided with a controlling section for controlling an ejection operation of a liquid drop ejection head which forms a first pattern by a first nozzle group of the nozzles which are formed on a liquid drop ejecting head and forms a second pattern by a second nozzle group which is different from the first nozzle group. [0020] The present layer forming apparatus is provided with a controlling section which controls an ejection operation of the liquid drop ejection head such that a first pattern is formed by a first nozzle group and a second pattern is formed by a second nozzle group which is different from the first nozzle group. Therefore, even if intervals between the liquid drops are insufficient when linear line patterns and inclining line patterns are formed by, for example, the first nozzle group, and the liquid drop is ejected only to a unit area in the linear line pattern, the liquid drops are ejected to a border section in the unit area by the second nozzle group so as to be between the liquid drops in the linear line pattern formed by the liquid drops which are ejected by the first nozzle group. Therefore, the intervals of the liquid drops are formed continuously in the linear line pattern. [0021] Also, in a layer forming apparatus according to the present invention, it is preferable that a liquid drop ejecting device be provided with an inclination controlling device for controlling the angle of inclination of the liquid drop ejection head. Continue reading... Full patent description for Layer forming method, layer forming apparatus, device, manufacturing method for device, and electronic apparatus Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Layer forming method, layer forming apparatus, device, manufacturing method for device, and electronic apparatus patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. 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