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Law Office Of Robert M. Wallace patents

The following is a sampling of recent Law Office Of Robert M. Wallace patent applications (USPTO Patent Application #, Patent Title) sorted by month.

February 2011 - Law Office Of Robert M. Wallace patents

20110040435 - Throttle-free transmissionless hybrid vehicle

January 2011 - Law Office Of Robert M. Wallace patents

20110005679 - Plasma uniformity control through vhf cathode ground return with feedback stabilization of vhf cathode impedance
20110005685 - Plasma reactor with uniform process rate distribution by improved rf ground return path
20110006044 - Pyrometer for laser annealing system compatible with amorphous carbon optical absorber layer
20110009999 - Plasma reactor with rf generator and automatic impedance match with minimum reflected power-seeking control

December 2010 - Law Office Of Robert M. Wallace patents

20100319851 - Plasma reactor with feed forward thermal control system using a thermal model for accommodating rf power changes or wafer temperature changes
20100319852 - Capacitivley coupled plasma reactor having a cooled/heated wafer support with uniform temperature distribution
20100314046 - Plasma reactor with a multiple zone thermal control feed forward control apparatus
20100300621 - Method of cooling a wafer support at a uniform temperature in a capacitively coupled plasma reactor
20100303680 - Capacitively coupled plasma reactor having very agile wafer temperature control

September 2010 - Law Office Of Robert M. Wallace patents

20100248488 - Pulsed plasma high aspect ratio dielectric process
20100239373 - Soil vapor extraction remediation system with vapor stream separation
20100224322 - Endpoint detection for a reactor chamber using a remote plasma chamber

July 2010 - Law Office Of Robert M. Wallace patents

20100190324 - Reducing photoresist layer degradation in plasma immersion ion implantation

April 2010 - Law Office Of Robert M. Wallace patents

20100103411 - Spectrographic metrology of patterned wafers
20100106444 - Spectrometric metrology of workpieces using a permanent window as a spectral reference
20100106456 - Metrology of thin film devices using an addressable micromirror array
20100096085 - Plasma reactor with a ceiling electrode supply conduit having a succession of voltage drop elements
20100096261 - Physical vapor deposition reactor with circularly symmetric rf feed and dc feed to the sputter target

February 2010 - Law Office Of Robert M. Wallace patents

20100032289 - Method for ultra-uniform sputter deposition using simultaneous rf and dc power on target

January 2010 - Law Office Of Robert M. Wallace patents

20100018648 - Workpiece support for a plasma reactor with controlled apportionment of rf power to a process kit ring
20100012029 - Apparatus for controlling radial distribution of plasma ion density and ion energy at a workpiece surface by multi-frequency rf impedance tuning
20100012480 - Method for controlling radial distribution of plasma ion density and ion energy at a workpiece surface by multi-frequency rf impedance tuning

December 2009 - Law Office Of Robert M. Wallace patents

20090294061 - Plasma reactor with plasma load impedance tuning for engineered transients by synchronized modulation of an unmatched low power rf generator
20090294062 - Plasma reactor with plasma load impedance tuning for engineered transients by synchronized modulation of a source power or bias power rf generator
20090294065 - Ceiling electrode with process gas dispersers housing plural inductive rf power applicators extending into the plasma
20090294275 - Method of plasma load impedance tuning by modulation of a source power or bias power rf generator
20090294414 - Method of plasma load impedance tuning for engineered transients by synchronized modulation of a source power or bias power rf gererator
20090295295 - Plasma reactor with high speed plasma load impedance tuning by modulation of different unmatched frequency sources
20090295296 - Method of plasma load impedance tuning by modulation of an unmatched low power rf generator
20090297404 - Plasma reactor with high speed plasma impedance tuning by modulation of source power or bias power
20090298287 - Method of plasma load impedance tuning for engineered transients by synchronized modulation of an unmatched low power rf generator

November 2009 - Law Office Of Robert M. Wallace patents

20090280628 - Plasma immersion ion implantation process with chamber seasoning and seasoning layer plasma discharging for wafer dechucking
20090280628 - Plasma immersion ion implantation process with chamber seasoning and seasoning layer plasma discharging for wafer dechucking
20090272492 - Plasma reactor with center-fed multiple zone gas distribution for improved uniformity of critical dimension bias
20090272492 - Plasma reactor with center-fed multiple zone gas distribution for improved uniformity of critical dimension bias
20090274590 - Plasma reactor electrostatic chuck having a coaxial rf feed and multizone ac heater power transmission through the coaxial feed
20090274590 - Plasma reactor electrostatic chuck having a coaxial rf feed and multizone ac heater power transmission through the coaxial feed
20090275206 - Plasma process employing multiple zone gas distribution for improved uniformity of critical dimension bias
20090275206 - Plasma process employing multiple zone gas distribution for improved uniformity of critical dimension bias

June 2009 - Law Office Of Robert M. Wallace patents

20090159002 - Gas distribution plate with annular plenum having a sloped ceiling for uniform distribution
20090159002 - Gas distribution plate with annular plenum having a sloped ceiling for uniform distribution
20090159213 - Plasma reactor gas distribution plate having a path splitting manifold immersed within a showerhead
20090159213 - Plasma reactor gas distribution plate having a path splitting manifold immersed within a showerhead
20090159439 - Apparatus for wafer level arc detection at an rf bias impedance match to the pedestal electrode
20090159439 - Apparatus for wafer level arc detection at an rf bias impedance match to the pedestal electrode
20090162260 - Plasma reactor gas distribution plate with radially distributed path splitting manifold
20090162261 - Plasma reactor gas distribution plate having a vertically stacked path splitting manifold
20090162262 - Plasma reactor gas distribution plate having path splitting manifold side-by-side with showerhead
20090162260 - Plasma reactor gas distribution plate with radially distributed path splitting manifold
20090162261 - Plasma reactor gas distribution plate having a vertically stacked path splitting manifold
20090162262 - Plasma reactor gas distribution plate having path splitting manifold side-by-side with showerhead
20090152247 - Fast axis beam profile shaping for high power laser diode based annealing system
20090156011 - Method of controlling cd bias and cd microloading by changing the ceiling-to-wafer gap in a plasma reactor
20090156013 - Method and apparatus for removing polymer from the wafer backside and edge
20090139963 - Multiple frequency pulsing of multiple coil source to control plasma ion density radial distribution
20090142930 - Gate profile control through effective frequency of dual hf/vhf sources in a plasma etch process

May 2009 - Law Office Of Robert M. Wallace patents

20090120367 - Plasma immersion ion implantation reactor with extended cathode process ring

April 2009 - Law Office Of Robert M. Wallace patents

20090097185 - Time-based wafer de-chucking from an electrostatic chuck having separate rf bias and dc chucking electrodes
20090084986 - Multiple band pass filtering for pyrometry in laser based annealing systems
20090084986 - Multiple band pass filtering for pyrometry in laser based annealing systems

March 2009 - Law Office Of Robert M. Wallace patents

20090081876 - Method of preventing etch profile bending and bowing in high aspect ratio openings by treating a polymer formed on the opening sidewalls
20090056629 - Cathode liner with wafer edge gas injection in a plasma reactor chamber
20090057269 - Method of processing a workpiece in a plasma reactor with independent wafer edge process gas injection

February 2009 - Law Office Of Robert M. Wallace patents

20090053836 - Method of wafer level transient sensing, threshold comparison and arc flag generation/deactivation
20090044748 - System with multi-location arc threshold comparators and communication channels for carrying arc detection flags and threshold updating
20090044750 - Apparatus for wafer level arc detection at an electrostatic chuck electrode
20090045046 - Method of multi-location arc sensing with adaptive threshold comparison
20090042352 - Gate interface relaxation anneal method for wafer processing with post-implant dynamic surface annealing



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